Fairchild FDH700 service manual
查询FDH700供应商查询FDH700供应商
FDH700
ULTRA FAST DIODE
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
Information Only Data Sheet
FINAL REVERSE CURRENT & FORWARD VOLTAGE LIMITS MIGHT BE INCREASED SLIGHTLY
Absolute Maximum Ratings (note 1) TA = 25
O
C unless otherwise noted
Parameter Value Units
Storage Temperature -65 to +200
Maximum Junction Temperature -65 to +175 OC
Total Power Dissipation at 25OC 250 mW
Derate above 25OC 1.67 mW/OC
Working Inverse Voltage 20 V
DC Forward Current 150 mA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
0.500 Minimum
12.70 Typ 1.000
0.022 (0.558) Diameter
0.018 (0.458) Typ 20 mils
CATHODE
BAND
LOGO
FD
H7
00
0.200 (5.08)
0.120 (3.05)
0.090 (2.28) Diameter
0.060 (1.53)
O
C
Electrical Characteristics TA = 25
O
C unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
B
I
R
Breakdown Voltage 30 V IR= 5.0 uA
V
Reverse Leakage 50 nA VR= 20 V
50 uA VR= 20 V TA = 150OC
V
Forward Voltage 420 500 mV IF= 10 uA
F
520 610 mV IF= 100 uA
640 740 mV IF= 1.0 mA
760 900 mV IF= 10 mA
810 990 mV IF= 20 mA
0.89 1.25 V IF= 50 mA
T
RR
C
© 1999 Fairchild Semiconductor Corporation
Reverse Recovery Time 900 ps IF= IR = 10 mA IRR = 1.0 mA
R
= 100 Ohm
Loop
Diode Capacitance 1.5 pF VR= 0 V, f = 1.0 MHz
T
FDH700 - Rev. A
MAXIMUM CHARACTERS PER LINE: 3 MAXIMUM NUMBER OF LINES: 4
LOGO AND CHARACTERS M & W COUNT AS 2 CHARACTERS EACH
0.021 (0.533) Diameter
0.019 (0.483)
DISCRETE POWER AND SIGNAL
TECHNOLOGIES
STANDARD DIGITAL MARKING CRITERIA
LEADS: COPPER CLAD STEEL
TYPICAL 20 Mils
LEADS TIN DIPPED
(60% SN 40% PB)
STUDS: DUMET (ALLOY 42)
GLASS SLEEVE
0.150 (3.810)
0.140 (3.556)
1.105 (28.067)
1.081 (27.457)
Package Weight
0.14 grams
CATHODE BAND
0.050 (1.270)
Maximum
SEE NOTE 1 BELOW
0.074 (1.880) Diameter
0.068 (1.727)
NOTE 1:
LEAD DIAMETER NOT CONTROLLED IN
THIS ZONE TO ALLOW FOR FLASH, LEAD
FINISH BUILD-UP, & MINOR
IRREGULARITIES OTHER THAN SLUGS.
DO-35 PACKAGE
Fairchild Semiconductor's Criteria
11-MAR-97
Loading...