Fairchild FDG6324L service manual

FDG6324L

See Application Circuit

Integrated Load Switch

General Description Features

This device is intended to be configured as a load switch and
is particularly suited for compact computer peripheral
switching applications where 3V to 20V input and 0.6A output
current capability are needed. This device features a small
N-Channel MOSFET (Q1) together with a large P-Channel
Power MOSFET (Q2) in a single SC70-6 package.

V

DROP

VIN=5V, IL=0.27A. R
Very small package outline (SC70-6).
Control MOSFET (Q1) includes Zener protection for ESD

ruggedness (>6KV Human Body Model).

High density cell design for extremely low on-resistance.

=0.2V @ VIN=12V, IL=0.36A. R

= 0.75Ω.

(ON)

= 0.55Ω. V

(ON)

June 1999

=0.2V @

DROP

SC70-6 SuperSOTTM-6

SOT-23

SuperSOTTM-8

SO-8

SOT-223

V , C

OUT

V , COUT 1

R2

1

EQUIVALENT APPLICATION

IN

ON/OFF

V

DROP

+

-

pin 1

.24

V , R

IN

V

ON/OFF

R , C1

1

1

4

Q2

5

Q1

6

3

2

1

SC70-6

Absolute Maximum Ratings T

Symbol Parameter FDG6324L Units

V

IN

V

ON/OFF

I

L

P

D

TJ,T
ESD Electrostatic Discharge Rating

THERMAL CHARACTERISTICS

R

θJA

Input Voltage Range 3 - 20 V
On/Off Voltage Range 2.5 - 8 V
Load Current - Continuous (Note 1) 0.6 A

- Pulsed (Note 1 & 3) 1.8
Maximum Power Dissipation (Note 2) 0.3 W
Operating and Storage Temperature Range -55 to 150 °C

STG

Human Body Model (100pf/1500Ohm)

Thermal Resistance, Junction-to-Ambient (Note 2) 415 °C/W

= 25°C unless otherwise noted

A

6 kV

OUT

FDG6324L Rev.D

Electrical Characteristics (T

= 25°C unless otherwise noted)

A

Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS

I

FL

Forward Leakage Current

VIN = 20 V, V

ON/OFF

= 0 V

1 µA

ON CHARACTERISTICS (Note 3)

V

R

DROP

(ON)

Conduction Voltage Drop

VIN = 12 V, V
VIN = 5 V, V

= 3.3 V, IL = 0.36 A

ON/OFF

= 3.3 V, IL = 0.27 A

ON/OFF

Q2 - Static On-Resistance VGS = -12 V, ID = -0.6 A

VGS = -5 V, ID = -0.5 A

I

L

Notes:

1. Range of Vin can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V.

2. R

θJA

guaranteed by design while R

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

Load Current

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R

is determined by the user's board design. Thermal ratings based on minimum mounting pad.

θCA

V

= 0.2 V, VIN = 12 V, V

DROP

V

= 0.2 V, VIN = 5 V, V

DROP

ON/OFF

ON/OFF

= 3.3 V

= 3.3 V

0.14 0.2 V

0.16 0.2

0.37 0.55

0.58 0.75

0.36 A

0.27

is

θJC

FDG6324L Load Switch Application

APPLICATION CIRCUIT

Ω

Q2

IN OUT

R1

Q1

ON/OFF

R2

External Component Recommendation

For Co ≤ 1uF applications:
R1 is required to turn Q2 off.
R2 and C1 are optional for slew rate control.

First select R2, 100 -1KΩ, for slew rate control.

Then select R1 such that the ratio R1/R2 is maintained between 10-100.
SPICE model (FDG6324L.MOD) available at www.fairchildsemi.com.

C1

Co

LOAD

FDG6324L Rev.D