Fairchild FDD6635 service manual

FDD6635
35V N-Channel PowerTrench® MOSFET
FDD6635 35V N-Channel PowerTrench
February 2007
tm
General Description
This N-Channel MOSFET has been produced using Fairchild Semiconductor’s proprietary PowerTrench technology to deliver low Rdson and optimized Bvdss capability to offer superior performance benefit in the applications.
Applications
Inverter
Power Supplies
Features
59 A, 35 V R R
Fast Switching
RoHS compliant
= 10 mΩ @ VGS = 10 V
DS(ON)
= 13 mΩ @ VGS = 4.5 V
DS(ON)
D
®
MOSFET
D
G
S
D-PAK
TO-252
(TO-252)
Absolute Maximum Ratings T
o
=25
C unless otherwise noted
A
G
S
Symbol Parameter Ratings Units
V
Drain-Source Voltage 35 V
DSS
V
DS(Avalanche)
V
GSS
ID Continuous Drain Current @TC=25°C (Note 3) 59 A @TA=25°C (Note 1a) 15 Pulsed (Note 1a) 100 EAS Single Pulse Avalanche Energy (Note 5) 113 mJ PD
TJ, T
Drain-Source Avalanche Voltage (maximum) (Note 4) 40 V
Gate-Source Voltage
Power Dissipation @TC=25°C (Note 3) 55 @TA=25°C (Note 1a) 3.8 @T
Operating and Storage Junction Temperature Range –55 to +150
STG
=25°C (Note 1b) 1.6
A
±20
V
W
°C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient
(Note 1) 2.7 (Note 1a) 40 (Note 1b) 96
°C/W °C/W °C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape width Quantity
FDD6635 FDD6635 D-PAK (TO-252) 13’’ 12mm 2500 units
©2007 Fairchild Semiconductor Corporation FDD6635 Rev. C2(W)
www.fairchildsemi.com
FDD6635 35V N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics(Note 2)
BV
Drain–Source Breakdown Voltage
DSS
ΔBVDSS ΔT
J
I
DSS
I
Gate–Body Leakage
GSS
Breakdown Voltage Temperature Coefficient
Zero Gate Voltage Drain Current V
= 0 V, ID = 250 μA
V
GS
I
= 250 μA, Referenced to 25°C
D
= 28 V, VGS = 0 V 1
DS
V
= ±20 V, VDS = 0 V
GS
35 V
32
mV/°C
μA
±100
nA
On Characteristics (Note 2)
V
Gate Threshold Voltage
GS(th)
ΔVGS(th) ΔTJ
R
DS(on)
Gate Threshold Voltage Temperature Coefficient
Static Drain–Source
On–Resistance
= VGS, ID = 250 μA
V
DS
I
= 250 μA, Referenced to 25°C
D
VGS = 10 V, ID = 15 A V
= 4.5 V, ID = 13 A
GS
V
= 10 V, ID = 15 A, TJ=125°C
GS
gFS Forward Transconductance VDS = 5 V, ID = 15 A 53 S
1 1.9 3 V
–5
8.2
10.2
12.4
10 13 16
mV/°C
mΩ
Dynamic Characteristics
C
Input Capacitance 1400 pF
iss
C
Output Capacitance 317 pF
oss
C
Reverse Transfer Capacitance
rss
RG Gate Resistance VGS = 15 mV, f = 1.0 MHz 1.4
= 20 V, V
V
DS
f = 1.0 MHz
= 0 V,
GS
137 pF
Ω
MOSFET
Switching Characteristics (Note 2)
t
Turn–On Delay Time 11 20 ns
d(on)
tr Turn–On Rise Time 6 12 ns t
Turn–Off Delay Time 28 45 ns
d(off)
tf Turn–Off Fall Time Q
Total Gate Charge, VGS = 10V 26 36 nC
g (TOT)
Qg Total Gate Charge, VGS = 5V 13 18 nC Qgs Gate–Source Charge 3.9 nC Qgd Gate–Drain Charge
= 20 V, ID = 1 A,
V
DD
V
= 10 V, R
GS
= 20 V, ID = 15 A
V
DS
GEN
= 6 Ω
14 25 ns
5.3 nC
®
FDD6635 Rev. C2(W) www.fairchildsemi.com
FDD6635 35V N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units Drain–Source Diode Characteristics
VSD Drain–Source Diode Forward
Voltage
trr Qrr
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
θJA
the drain pins. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%
3. Maximum current is calculated as:
where P
4. BV(avalanche) Single-Pulse rating is guaranteed if device is operated within the UIS SOA boundary of the device.
Diode Reverse Recovery Time Diode Reverse Recovery Charge
is guaranteed by design while R
θJC
is maximum power dissipation at TC = 25°C and R
D
R
a) R
P
D
DS(ON)
θCA
θJA
2
1in
pad of 2 oz copper
VGS = 0 V, IS = 15 A (Note 2) 0.8 1.2 V
IF = 15 A, diF/dt = 100 A/µs
26 ns 16 nC
is determined by the user's board design.
= 40°C/W when mounted on a
is at T
DS(on)
and VGS = 10V. Package current limitation is 21A
J(max)
b) R
= 96°C/W when mounted
θJA
on a minimum pad.
®
MOSFET
5. Starting T
= 25°C, L = 1mH, IAS = 15A, VDD = 35V, VGS = 10V
J
FDD6635 Rev. C2(W) www.fairchildsemi.com
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