Thermal Resistance Junction to Case TO-2521.2
Thermal Resistance Junction to Ambient TO-252100
Thermal Resi st an ce Junc ti on to Amb i ent TO -2 52 , 1in2 copper pad area52
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be fou nd a t: http://ww w.f airc hilds e m i.co m /pr oduc ts/dis c rete/reliab ility/ind ex.html.
FDD14AN 06LA0FDD14AN 06LA0TO- 252AA330mm16mm 2500 units
FDD14AN06LA0
Electrical Characteristics
TC = 25°C unless otherwise noted
SymbolParameterTest Con ditionsMinTypMaxUnits
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Volt ag eID = 250µA, VGS = 0V60--V
V
= 50V--1
Zero Gate Voltage Drain Current
DS
= 0VTC = 150oC- -250
V
GS
Gate to Source Leakage CurrentVGS = ±20V--±100nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA1-3V
= 50A, VGS = 10V -0.0102 0.0116
I
D
I
= 50A, VGS = 5V -0.0128 0.0146
Drain to S ou r c e On Re si st ance
D
I
= 50A, VGS = 5V,
D
T
= 175oC
J
-0.0280.033
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitanc e-270-pF
Reverse Transfer Capacitance-115-pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 5VVGS = 0V to 5V
Threshold Gate ChargeVGS = 0V to 1V-2.73.5nC
Gate to Source Gate Charg e-9.7-nC
Gate Charge Threshold to Plateau-7.0-nC
V
DD
I
= 50A
D
I
= 1.0m A
g
= 30V
Gate to Drain “Miller” Charge-8.7-nC
-2810-pF
2532nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-14-ns
Rise Time-132-ns
Turn-Off D elay Time-27-ns
Fall Time-47-ns
Turn-Off Time--111ns