Fairchild FDC6330L service manual
FDC6330L
(
)
y
)
Integrated Load Switch
FDC6330L
February 1999
General Description
This device is particularly suited for compact power
management in portable electronic equipment where 3V
to 20V input and 2.3A output current capability are needed.
This load switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel power
MOSFET (Q2) in one tiny SuperSOTTM-6 package.
Applications
• Power management
• Load actuation
Vin,R1
ON/OFF
R1,C1
SuperSOT -6
TM
Features
• V
= 0.2V @ VIN = 12V, IL=2.5 A. R
DROP
V
= 0.2V @ VIN= 5V,IL= 1.6 A. R
DROP
= 0.08 Ω
(ON)
= 0.125 Ω.
(ON)
• Control MOSFET (Q1) includes Zener protection for
ESD ruggedness (>6kV Human Body Model).
• High performance PowerTrenchTM technology for
extremely low on-resistance.
• SuperSOTTM-6 package design using copper lead frame
for superior thermal and electrical capabilities.
Vout,C1
Q1
3
EQUIVALE N T CIRCUIT
Vout,C1
2
IN
1
R2
ON/OFF
V
DRO P
+
4
Q2
5
6
Se e A pplic at ion Cir cu it
-
OUT
T
=25oC unless otherwise noted
Absolute Maximum Ratings
A
Symbol Parameter Ratings Units
V
IN
V
ON/OFF
I
D
Input Voltage Range
On/Off Voltage Range 1.5 - 8 V
Load Current - Continuous
- Pulsed 10
P
D
TJ, T
stg
Max im um Power D is sip ation
Operating and Storage Temperature Range -55 to +150
ESD Electro sta tic D is c ha rge Rating MIL-STD-883D
Human-Bod
-Model (100pf/1500 Ohm
(Note 1)
Note 2
(Note 1)
3 - 20 V
2.3 A
0.7 W
6kV
Thermal Characteristics
R
JA
θ
R
JC
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 2)
(Note 2)
180
60
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width
330 (
Denotes pin 1)
.
.
1999 Fairchild Semiconductor Corporation
FDC6330L 7’’ 8m m 3000 units
°
C/W
°
C/W
°
Qua ntity
FDC6330L Rev. C
C
FDC6330L
Electrical Characteristics
TA=25oC unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
OFF Characteristics
I
FL
ON Characteristics
DROP
R
(ON)
L
Notes:
1. Range of Vin can be up to 30V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed 20V.
2. R
surface of the drain pins. R
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Leakage Current VIN = 20 V, V
(Note 3)
V
Conduction Voltage
IN
V
IN
= 12 V, V
= 5 V, V
Q2 - Static On-Resist ance VGS = -12 V, ID = -2.3 A
V
= -5 V, ID = -1.9 A
GS
V
Load Current
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
θJA
is guaranteed by design while R
θJC
= 0.2 V, VIN = 12 V, V
DROP
= 0.2 V, VIN = 5 V, V
V
DROP
= 250 µA1
ON/OFF
= 3.3 V, IL = 2.5 A 0.2 V V
ON/OFF
= 3.3 V, IL = 1.6 A 0.2 V
ON/OFF
= 3.3 V 2.5 I
ON/OFF
= 3.3 V 1.6
ON/OFF
is determined by the user’s board design.
θJA
0.054
0.081
0.08
0.125
µ
FDC6330L Load Switch Application
A
Ω
A
External Component Recommendation:
For applications where Co ≤ 1µF.
For slew rate control, select R2 in the range of 1k - 4.7kΩ .
For additional in-rush current control,C1 ≤ 1000pF can be added.
Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.
FDC6330L Rev. C
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