Fairchild FDC6326L service manual
FDC6326L
Integrated Load Switch
General Description Features
This device is particularly suited for compact power
management in portable electronic equipment where 3V to
20V input and 1.8A output current capability are needed.
This load switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel power
MOSFET (Q2) in one tiny SuperSOTTM-6 package.
V
DROP
V
DROP
SuperSOTTM-6 package design using copper lead frame for
superior thermal and electrical capabilities.
=0.20V @ VIN=12V, IL=1.5A.R
=0.20V @ VIN=5V, IL=1A.R
DS(ON)
August 1998
= 0.125 Ω
DS(ON)
= 0.20 Ω.
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
Vout,C1
Q1
3
2
1
Vout,C1
R2
IN
ON/OFF
EQUIVALENT CIRCUIT
V
DROP
+
-
SuperSOT -6
TM
.326
1
pin
Vin,R1
ON/OFF
R1,C1
4
Q2
5
6
See Application Circuit
Absolute Maximum Ratings T
Symbol Parameter FDC6326L Units
V
IN
V
ON/OFF
I
L
P
D
TJ,T
ESD Electrostatic Discharge Rating MIL-STD-883D Human Body
THERMAL CHARACTERISTICS
R
θJA
R
θJC
Input Voltage Range 3 - 20 V
On/Off Voltage Range 2.5 - 8 V
Load Current - Continuous (Note 1) 1.8 A
- Pulsed (Note 1 & 3) 5
Maximum Power Dissipation (Note 2) 0.7 W
Operating and Storage Temperature Range -55 to 150 °C
STG
Model (100pf/1500Ohm)
Thermal Resistance, Junction-to-Ambient (Note 2) 180 °C/W
Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W
= 25°C unless otherwise noted
A
6 kV
OUT
© 1998 Fairchild Semiconductor Corporation
FDC6326L Rev.D1
Electrical Characteristics (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
I
FL
Forward Leakage Current VIN = 20 V, V
= 0 V 1 µA
ON/OFF
ON CHARACTERISTICS (Note 3)
V
R
DROP
DS(ON)
Conduction Voltage Drop
VIN = 12 V, V
VIN = 5 V, V
= 3.3 V, IL = 1.5 A
ON/OFF
= 3.3 V, IL = 1 A 0.14 0.2
ON/OFF
Q2 - Static On-Resistance VGS = -12 V, ID = -1.9 A
VGS = -5 V, ID = -1.5 A
I
L
Notes:
1. VIN=20V, V
2. R
of the drain pins. R
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Load Current V
=8V, TA=25oC
ON/OFF
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
JA
θ
is guaranteed by design while R
JC
θ
is determined by the user's board design.
CA
θ
= 0.125 V, VIN = 12 V, V
DROP
V
= 0.20 V, VIN = 5 V, V
DROP
= 3.3 V 1 A
ON/OFF
= 3.3 V
ON/OFF
0.15 0.2 V
0.095 0.125
0.14 0.2
1
FDC6326L Load Switch Application
APPLICATION CIRCUIT
Q2
IN OUT
R1
C1
Ω
ON/OFF
Q1Ci
R2
External Component Recommendation
First select R2, 100 - 1kΩ, for Slew Rate control.
C1 ≤ 1000pF can be added in addition to R2 for further In-rush current control.
Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off.
For SPICE simulation, users can download a "FDC6326L.MOD" Spice model from Fairchild Web Site at
www.fairchildsemi.com
LOAD
Co
FDC6326L Rev.D1
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