May 2008
FDB8896
FDB8896
N-Channel PowerTrench® MOSFET
30V, 93A, 5.7mΩ
General Description
This N-Channel MOSFET has been designed specifically to
improve the overall efficiency of DC/DC converters using
either synchronous or conventional switching PWM
controllers. It has been optimized for low gate charge, low
r
and fast switching speed.
DS(ON)
Applications
• DC/DC converters
GATE
SOURCE
TO-263AB
FDB SERIES
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
V
I
E
P
T
D
DSS
GS
AS
D
, T
J
STG
Drain to Source Voltage 30 V
Gate to Source Voltage ±20 V
Drain Current
Continuous (T
Continuous (T
Continuous (T
= 25oC, VGS = 10V) (Note 1)
C
= 25oC, VGS = 4.5V) (Note 1) 85 A
C
= 25oC, VGS = 10V, with R
amb
Pulsed Figure 4 A
Single Pulse Avalanche Energy (Note 2) 74 mJ
Power dissipation 80 W
Derate above 25
o
C0 . 5 3 W /
Operating and Storage Te mperature -55 to 175
DRAIN
(FLANGE)
C
= 25°C unless otherwise noted
Features
•r
•r
• High performance trench technology for extremely low
• Low gate charge
• High power and current handling capability
= 43oC/W) 19 A
θ JA
DS(ON)
DS(ON)
r
DS(ON)
= 5.7mΩ, V
= 6.8mΩ, V
G
= 10V, ID = 35A
GS
= 4.5V, ID = 35A
GS
D
S
93 A
tm
o
C
o
C
Thermal Characteristics
R
θ JC
R
θ JA
R
θ JA
Thermal Resistance Junction to Case TO-263 1.88
Thermal Resistance Junction to Ambient TO-263 ( Note 3) 62
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area 43
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB8896 FDB8896 TO-263AB 330mm 24mm 800 units
©2008 Fairchild Semiconductor Corporation
o
C/W
o
C/W
o
C/W
FDB8896 Rev. B2
FDB8896
Electrical Characteristics T
= 25° C unless otherwise noted
C
Symbol Parameter Tes t Cond itions Min Typ Max Units
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage ID = 250µ A, VGS = 0V 30 - - V
V
= 24V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC - - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA 1.2 - 2.5 V
I
= 35A, VGS = 10V - 0.0049 0.0057
D
= 35A, VGS = 4.5V - 0.0059 0.0068
I
Drain to Source On Resistance
D
I
= 35A, VGS = 10V,
D
= 175oC
T
J
- 0.0078 0.0094
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
R
G
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance - 490 - pF
Reverse Transfer Capacitance - 300 - pF
= 15V, VGS = 0V,
V
DS
f = 1MHz
Gate Resistance VGS = 0.5V, f = 1MHz - 2.3 - Ω
Total Gate Charge at 10V VGS = 0V to 10V
Total Gate Charge at 5V VGS = 0V to 5V - 25 36 nC
V
= 15V
Threshold Gate Charge VGS = 0V to 1V - 2.3 3.0 nC
Gate to Source Gate Charge - 8 - nC
Gate Charge Threshold to Plateau - 5.7 - nC
DD
= 35A
I
D
= 1.0mA
I
g
Gate to Drain “Miller” Charge - 9.5 - nC
- 2525 - pF
-4 86 7n C
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time - 9 - ns
Rise Time - 102 - ns
Turn-Off Delay Time - 58 - ns
Fall Time - 44 - n s
Turn-Off Time - - 153 ns
(VGS = 10V)
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Notes:
1: Package current limitation is 80A.
2: Starting T
3: Pulse width = 100s.
4
Source to Drain Diode Voltage
Reverse Recovery Time ISD = 35A, dISD/dt = 100A/µs- -2 7n s
Reverse Recovered Charge ISD = 35A, dISD/dt = 100A/µs- -1 2n C
= 25° C, L = 36µ H, IAS = 64A, VDD = 27V, VGS = 10V.
J
- - 167 ns
= 15V, ID = 35A
V
DD
= 4.5V, RGS = 6.2Ω
V
GS
I
= 35A - - 1.25 V
SD
I
= 20A - - 1.0 V
SD
©2008 Fairchild Semiconductor Corporation FDB8896 Rev. B2
FDB8896
Typical Characteristics T
= 25° C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULT IPL I ER
0
0 25 50 75 100 175
125
150
TC, CASE TEMPERATURE (oC)
Figure 1. Normali ze d Po we r Dis sip ation vs Case
Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θ JC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
100
CURRENT LIMITED
BY PACKAGE
80
VGS = 10V
60
VGS = 4.5V
40
, DRAIN CURRENT (A)
D
I
20
0
25 50 75 100 125 150
175
TC, CASE TEMPERATURE (oC)
Figure 2. Maximum Contin uous Drain Current vs
Case Temperature
P
DM
t
1
t
x R
θ JC
+ T
2
C
1
10
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
10
-1
10
θ JC
10
1/t2
0
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
VGS = 4.5V
, PEAK CURRENT (A)
DM
I
100
50
-5
10
-4
10
-3
10
-2
10
-1
10
t, PUL SE WIDTH (s)
TC = 25oC
FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2008 Fairchild Semiconductor Corporation FDB8896 Rev. B2
FDB8896
Typical Characteristics T
1000
100
10
OPERATION IN THIS
AREA MAY BE
, DRAIN CURRENT (A)
D
I
LIMITED BY r
1
SINGLE PULSE
TJ = MAX RATED
= 25oC
T
C
0.1
11 0
DS(ON)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
= 25° C unless otherwise noted
C
Figure 5. Forward Bias Safe Operating Area
160
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 15V
DD
120
TJ = 25oC
80
, DRAIN CURRENT (A)
D
I
40
TJ = 175oC
0
1.5 2.0 2.5 3.0 3.5
VGS, GATE TO SOURCE VOLTAGE (V)
TJ = -55oC
10µs
100µs
1ms
10ms
DC
500
If R = 0
tAV = (L)(IAS)/(1.3*RATED BV
If R ≠ 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
100
10
, AVALANCHE CURRENT (A)
AS
I
60
1
0.01 0.1 1 10 100
STARTING TJ = 150oC
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Applica ti on Note s AN75 14 and AN75 15
Figure 6. Unclamped Inductive Switching
Capability
160
VGS = 10V
120
80
, DRAIN CURRENT (A)
D
I
40
0
4
0 0.25 0.5 0.75 1.0 1.25 1.5
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS = 4V
TC = 25oC
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VGS = 5V
VGS = 3V
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
14
ID = 35A
12
10
8
, DRAIN TO SOURCE
ON RESISTANCE (mΩ)
DS(ON)
r
6
ID = 1A
4
24681 0
V
, GATE TO SOURCE VOLTAGE (V)
GS
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
Figure 9. Drain to Source On Resis tanc e vs Ga te
Voltage and Drain Current
©2008 Fairchild Semiconductor Corporation FDB8896 Rev. B2
1.6
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
ON RESISTANCE
0.8
NORMALIZED DRAIN TO SOURCE
0.6
-80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC)
VGS = 10V, ID = 35A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature