Fairchild FDB390N15A service manual
FDB390N15A
G
S
D
D2-PAK
G
S
D
FDB390N15A N-Channel PowerTrench
July 2011
N-Channel PowerTrench® MOSFET
150V, 27A, 39mΩ
Features
• R
• Fast Switching Speed
• Low Gate Charge
• High Performance Trench Technology for Extremely Low
• High Power and Current Handling Capability
• RoHS Compliant
= 33.5mΩ ( Typ.)@ VGS = 10V, ID = 27A
DS(on)
R
DS(on)
Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advance PowerTrench process that has been
especially tailored to minimize the on-state resistance and yet
maintain superior switching performance.
Application
• DC to DC Converters
• Synchronous Rectification for Telecommunication PSU
• Battery Charger
• AC Motor Drives and Uninterruptible Power Supplies
• Off-line UPS
®
MOSFET
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DSS
V
GSS
I
D
I
DM
E
AS
dv/dt Peak Diode Recovery dv/dt (Note 3) 6.0 V/ns
P
D
TJ, T
STG
T
L
Drain to Source Voltage 150 V
Gate to Source Voltage ±20 V
Drain Current
Drain Current - Pulsed (Note 1) 108 A
Single Pulsed Avalanche Energy (Note 2) 78 mJ
Power Dissipation
Operating and Storage Temperature Range -55 to +175
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
= 25oC unless otherwise noted
C
- Continuous (TC = 25oC,Silicon Limited) 27
- Continuous (TC = 100oC,Silicon Limited) 19
(TC = 25oC) 75 W
- Derate above 25oC 0.5 W/oC
300
Thermal Characteristics
Symbol Parameter
R
θJC
R
θJA
©2011 Fairchild Semiconductor Corporation
FDB390N15A Rev. A2
Thermal Resistance, Junction to Case 2.0
Thermal Resistance, Junction to Ambient 62.5
Ratings
www.fairchildsemi.com1
A
o
C
o
C
Units
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB390N15A FDB390N15A D2-PAK 330mm 24mm 800
FDB390N15A N-Channel PowerTrench
Electrical Characteristics T
= 25oC unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
∆BV
∆T
I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V 150 - - V
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Body Leakage Current VGS = ±20V, V
ID = 250µA, Referenced to 25oC - 0.1 - V/oC
VDS = 120V, V
= 0V - - 1
GS
VDS = 120V, TC = 150oC - - 500
= 0V - - ±100 nA
DS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage VGS = VDS, ID = 250µA 2.0 - 4.0 V
Static Drain to Source On Resistance VGS = 10V, I
Forward Transconductance
VDS = 10V, ID = 27A (Note 4)
= 27A - 33.5 39 mΩ
D
- 33 - S
Dynamic Characteristics
C
iss
C
oss
C
rss
C
oss(er)
Q
g(tot)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance - 96 130 pF
Reverse Transfer Capacitance - 5.8 - pF
VDS = 75V, VGS = 0V
f = 1MHz
Energy Related Output Capacitance VDS = 75V, ID = 27A 169 - pF
Total Gate Charge at 10V
Gate to Source Gate Charge 5.0 - nC
Gate Charge Threshold to Plateau - 2.0 - nC
Gate to Drain “Miller” Charge - 3.5 - nC
VDS = 75V, ID = 27A
VGS = 10V
(Note 4,5)
ESR Equivalent Series Resistance (G-S) Drain Open,f = 1MHz - 1.4 - Ω
- 965 1285 pF
- 14.3 18.6 nC
µA
®
MOSFET
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-On Delay Time
Turn-On Rise Time - 10 30 ns
Turn-Off Delay Time - 20 50 ns
Turn-Off Fall Time - 5 20 ns
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. Starting TJ = 25°C, L = 3 mH, ISD = 7.2 A
3. ISD ≤ 27A, di/dt ≤ 200A/µs, VDD ≤ BV
4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
Maximum Continuous Drain to Source Diode Forward Current - - 27 A
Maximum Pulsed Drain to Source Diode Forward Current - - 108 A
Drain to Source Diode Forward Voltage V
Reverse Recovery Time
Reverse Recovery Charge - 131 - nC
, Starting TJ = 25°C
DSS
VDD = 75V, ID = 27A
VGS = 10V, R
(Note 4,5)
= 0V, I
GS
VGS = 0V, I
dIF/dt = 100A/µs (Note 4)
= 4.7Ω
GEN
= 27A - - 1.25 V
SD
= 27A, VDD = 75V
SD
- 14 38 ns
- 63 - ns
FDB390N15A Rev. A2
2
www.fairchildsemi.com
Typical Performance Char acteristics
0.1 1 5
1
10
100
200
*Notes:
1. 250µs Pulse Test
2. TC = 25oC
I
D
, Drain Current[A]
VDS, Drain-Source Voltage[V]
V
GS
= 15.0V
10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
5.0V
2 3 4 5 6 7
1
10
100
200
-55oC
175oC
*Notes:
1. VDS = 10V
2. 250µs Pulse Test
25oC
I
D
, Drain Current[A]
VGS, Gate-Source Voltage[V]
0.4 0.6 0.8 1.0 1.2 1.3
1
10
100
200
*Notes:
1. VGS = 0V
2. 250µs Pulse Test
175oC
I
S
, Reverse Drain Current [A]
VSD, Body Diode Forward Voltage [V]
25oC
0 20 40 60 80 100
20
40
60
80
*Note: TC = 25oC
VGS = 20V
VGS = 10V
R
DS(ON)
[mΩ],
Drain-Source On-Resistance
ID, Drain Current [A]
0.1 1 10 100 200
1
10
100
1000
2000
C
oss
C
iss
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
*Note:
1. VGS = 0V
2. f = 1MHz
C
rss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
0 4 8 12 16
0
2
4
6
8
10
*Note: ID = 27A
VDS = 30V
VDS = 75V
VDS = 120V
V
GS
, Gate-Source Voltage [V]
Qg, Total Gate Charge [nC]
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
FDB390N15A N-Channel PowerTrench
®
MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDB390N15A Rev. A2
3
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