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FDB3682 / FDP3682
N-Channel PowerTrench® MOSFET
100V, 32A, 36mΩ
FDB36 82 / FDP3682
September 2002
Features
• r
• Q
• Low Miller Charge
• Low Q
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
Formerly developmental type 82755
= 32mΩ (Typ.), V
DS(ON)
(tot) = 18.5nC (Typ.), V
g
Body Diode
RR
= 10V, ID = 32A
GS
= 10V
GS
Applications
• DC/DC converters and Off-Line UPS
• Distributed Power Architectures and VRMs
• Primary Switch for 24V and 48V Systems
• High Volt age Synchronous Rectifier
• Direct Injection / Diesel Injection System
• 42V Automo tive Load Co ntrol
• Electro nic Valve Train System
DRAIN
(FLANGE)
GATE
SOURCE
TO-263AB
FDB SERIES
(FLANGE)
MOSFET Maximum Ratings T
DRAIN
= 25° C unless otherwise noted
C
SOURCE
DRAIN
TO-220AB
FDP SERIES
GATE
D
G
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Source Voltage 100 V
Gate to Source Voltage ±20 V
Drain Curr e nt
Continuous (T
I
D
Continuous (T
Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 23 A
C
= 25oC, VGS = 10V, R
amb
= 43oC/W) 6 A
θ JA
32 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 55 mJ
Power dissipation 95 W
o
Derate above 25
C0 . 6 3 W /
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristi cs
R
θ JC
R
θ JA
R
θ JA
This product ha s been des igned to me et the e xtr eme test c ondit ions and envir onment deman ded by the automot ive indus t ry. For a
All Fairchild Semiconductor prod ucts are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
©2002 Fairchild Semiconductor Corporation
Thermal Resistance Junction t o Case TO-220, TO-263 1.58
Thermal Resistance Junction t o Ambient TO-220, TO-263 (Note 2) 62
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
certification.
FDB3682 / FDP3682 Rev. B
o
C/W
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB3682 FDB3682 TO-263AB 330mm 24mm 800 units
FDP3682 FDP3682 TO-220AB Tube N/A 50 units
FDB36 82 / FDP3682
Electrical Characteristics
TC = 25° C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain t o Source Breakdown Volta ge ID = 250µ A, VGS = 0V 100 - - V
V
= 80V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- - 2 5 0
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2 - 4 V
=32A, VGS=10V - 0.032 0.036
I
Drain to Source On Resistance
D
= 16A, VGS = 6V, - 0.040 0.060
D
=32A, VGS=10V, TC=175oC - 0.080 0.090
I
D
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitance - 190 - pF
Reverse Transfer Capacitance - 45 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total G ate Ch arg e at 10 V VGS = 0V to 10V
Threshold Gate Charge VGS = 0V to 2V - 2.4 3.6 nC
Gate to Source Gate Charge - 6.5 - nC
Gate Charge Threshold to Plateau - 4.1 - nC
= 50V
V
DD
I
= 32A
D
I
= 1.0m A
g
Gate to Drain “ Miller” Charge - 4.6 - nC
-1 2 5 0- p F
-1 8 . 52 8n C
µA
ΩI
Resistive Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time - 9 - ns
Rise Time - 46 - ns
T u rn-Off Delay Time - 26 - ns
Fall Time - 32 - ns
Turn-Off Time - - 87 ns
(VGS = 10V)
V
DD
V
GS
--8 3n s
= 50V, ID = 32A
= 10V, RGS = 16Ω
Drain-Source Diode Characteristics
I
= 32A - - 1 .25 V
V
SD
t
rr
Q
RR
Notes:
1: Starting T
2: Pulse Width = 100s
©2002 Fairchild Semiconductor Corporation FDB3682 / FDP3682 Rev. B
Source to Drain Di ode Voltage
Reverse Recovery Time ISD = 32A, dISD/dt = 100A/µ s- - 5 5 n s
Reverse Recovery Charge ISD = 32A, dISD/dt = 100A/µ s- - 9 0 n C
= 25° C, L = 0.27mH, IAS = 20A.
J
SD
I
= 16A - - 1.0 V
SD
FDB36 82 / FDP3682
Typical Characteristics T
= 25° C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
02 55 07 51 0 0 1 7 5
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
1
0.5
0.2
0.1
0.05
0.02
0.01
150
35
V
= 10V
30
GS
25
20
15
, DRAIN CURRENT (A)
10
D
I
5
0
25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
Figure 2. Maximum Continuous Drain Curr ent vs
Case Temperature
, NORMALIZED
θ JC
Z
400
100
, PEAK CURRENT (A)
DM
I
0.1
THERMAL IMPEDANCE
0.01
30
10
-5
10
VGS = 10V
-5
SINGLE PULSE
-4
10
-3
10
-2
10
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC
FOR TEMPERATURES
ABOVE 25
CURRENT AS FOLLOWS:
I = I
P
DM
1/t2
x R
θ JC
0
10
o
C DERATE PEAK
175 - T
25
0
10
t
θ JC
150
1
t
2
+ T
C
1
10
C
1
10
Figure 4. Peak Current Capability
©2002 Fairchild Semiconductor Corporation FDB3682 / FDP3682 Rev. B
Typical Characteristics T
= 25° C unless otherwise noted
C
FDB36 82 / FDP3682
200
100
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
1
, DRAIN CURRENT (A)
D
I
SINGLE PULSE
TJ = MAX R ATED
T
= 25oC
C
0.1
1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
10ms
DC
1ms
10µs
100µs
Figure 5. Forward Bias Safe Operating Area
80
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 15V
DD
60
40
TJ = 175oC
100
If R = 0
200
tAV = (L)(IAS)/(1.3*RATED BV
If R ≠ 0
t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
10
, AVALANCHE CURRENT (A)
AS
I
1
STARTING TJ = 150oC
0.001 0.01 0.1 1
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
80
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
60
TC = 25oC
40
VGS = 20V
- VDD) +1]
10
VGS = 10V
VGS = 6V
, DRAIN CURRENT (A)
D
I
20
0
TJ = 25oC
TJ = -55oC
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
60
PULSE DURATION = 80ms
DUTY CYCLE = 0.5% MAX
50
40
30
DRAIN TO SOURCE ON RESISTANCE (mΩ)
20
0 5 10 15 20 25 30 35
Id, DRAIN CURRENT (A)
VGS = 6V
VGS = 10V
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
, DRAIN CURRENT (A)
D
I
20
0
01234
VDS, DRAIN TO SOURCE VOLTAGE (V)
3.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
2.5
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC)
VGS = 5V
VGS = 10V, ID =32A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2002 Fairchild Semiconductor Corporation FDB3682 / FDP3682 Rev. B