FDB2552 / FDP2552
N-Channel PowerTrench® MOSFET
150V, 37A, 36mΩ
FDB25 52 / FDP2552
February 2012
Features
•r
•Q
• Low Miller Charge
•Low Q
= 32mΩ (Typ.), V
DS(ON)
(tot) = 39nC (Typ.), V
g
Body Diode
RR
= 10V, ID = 16A
GS
= 10V
GS
Applications
• DC/D C C onverters an d Of f- li ne UPS
• Distributed P ower Arc hitectures and VRMs
• Primary Switch for 24V and 48V Syst ems
• High Voltage Synchronous Rectifier
• UIS Capability (Single Pulse and Repetitive Pulse)
Formerly developmental type 82869
DRAIN
(FLANGE)
SOURCE
DRAIN
GA TE
TO-220AB
FDP SERIES
MOSFET Maximum Ratings T
GATE
SOURCE
TO-263AB
FDB SERIES
= 25°C unless otherwise not ed
C
DRAIN
(FLANGE)
D
G
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Source Voltage 150 V
Gate to Source Voltage ±20 V
Drain Curr e nt
Continuous (T
I
D
Continuous (T
Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 26 A
C
= 25oC, VGS = 10V) with R
amb
= 43oC/W 5 A
θ JA
37 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 390 mJ
Power dissipation 150 W
o
Derate above 25
C1 . 0 W /
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θ JC
R
θ JA
R
θ JA
©2012 Fairchild Semiconductor Corporation FDB2552 / FDP2552
Thermal Resistance Junction to Case TO-220, TO-263 1.0
Thermal Resistance Junction t o Ambient TO- 220, TO-263 (Note 2) 62
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
o
C/W
o
C/W
o
C/W
Rev. C
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB2552 FDB2552 TO-263AB 330mm 24mm 800 units
FDP2552 FDP2552 TO-220AB Tube N/A 50 units
FDB25 52 / FDP2552
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Con ditions Min Typ Max Units
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag e ID = 250µ A, VGS = 0V 150 - - V
V
= 120V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- -2 5 0
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2 - 4 V
= 16A, VGS = 10V - 0.032 0.036
I
D
I
= 8A, VGS = 6V - 0.036 0.054
Drain to S ou r c e On Re si st ance
D
= 16A, VGS = 10V,
I
D
T
= 175oC
J
- 0.084 0.097
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitanc e - 285 - pF
Reverse Transfer Capacitance - 55 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10V VGS = 0V to 10V
Threshold Gate Charge VGS = 0V to 2V - 5.2 6.8 nC
Gate to Source Gate Charg e - 13.5 - nC
Gate Charge Threshold to Plateau - 8.4 - nC
V
DD
I
= 16A
D
I
= 1.0m A
g
= 75V
Gate to Drain “Miller” Charge - 8.3 - nC
- 2800 - pF
39 51 nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time - 12 - ns
Rise Time - 29 - ns
Turn-Off D elay Time - 36 - ns
Fall Time - 29 - ns
Turn-Off Time - - 97 ns
(VGS = 10V)
V
= 75V, ID = 16A
DD
V
= 10V, RGS = 8.2Ω
GS
- - 62 ns
Drain-Source Diode Characteristics
I
= 16A - - 1.25 V
V
SD
t
rr
Q
RR
Notes:
1: Starting T J = 25°C, L = 7.8mH, IAS = 10A.
2: Pulse Width = 100s
©2012 Fairchild Semiconductor Corporation FDB2552 / FDP2552 Rev. C
Source to Drain Diode Voltage
Reverse Recovery Time ISD = 16A, dISD/dt = 100A/µ s- -9 0n s
Reverse Recovered Charge ISD = 16A, dISD/dt = 100A/µ s - - 242 nC
SD
= 8A - - 1.0 V
I
SD
FDB25 52 / FDP2552
Typical Characteristics T
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
02 55 07 51 0 0 1 7 5
TC, CASE TEMPERATURE (oC)
= 25°C unless otherwise noted
C
125
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θ JC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
10
40
30
20
, DRAIN CURRENT (A)
D
I
10
150
0
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES:
DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-1
10
θ JC
10
0
x R
t
1
t
2
2
+ T
θ JC
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
700
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
VGS = 10V
100
, PEAK CURRENT (A)
DM
I
30
-5
10
-4
10
-3
10
-2
10
t, PULSE WIDTH (s)
-1
10
TC = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2012 Fairchild Semiconductor Corporation FDB2552 / FDP2552 Rev. C
Typical Characteristics T
= 25°C unless otherwise noted
C
FDB25 52 / FDP2552
300
100
10
OPERATION IN THIS
AREA MAY BE
, DRAIN CURRENT (A)
D
I
LIMITED BY r
1
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
0.1
1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
10µs
100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
80
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 15V
DD
60
40
TJ = 25oC
, DRAIN CURRENT (A)
D
I
20
TJ = 175oC
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VGS, GATE TO SOURCE VOLTAGE (V)
TJ = -55oC
100
If R = 0
300
tAV = (L)(IAS)/(1.3*RATED BV
If R ≠ 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
10
, AVALANCHE CURRENT (A)
AS
I
1
STARTING TJ = 150oC
0.1 1 10 0.01
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
80
VGS = 10V
60
VGS = 6V
40
VGS = 5V
, DRAIN CURRENT (A)
D
I
20
PULSE DURATION = 80µs
0
012345
VDS, DRAIN TO SOURCE VOLTAGE (V)
DUTY CYCLE = 0.5% MAX
TC = 25oC
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
42
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
40
38
36
34
32
DRAIN TO SOURCE ON RESISTANCE(mΩ)
30
0 1 02 03 04 0
VGS = 6V
VGS = 10V
ID, DRAIN CURRENT (A)
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
©2012 Fairchild Semiconductor Corporation FDB2552 / FDP2552 Rev. C
3.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
2.5
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC)
VGS = 10V, ID = 16A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature