Fairchild FDP16AN08A0, FDB16AN08A0 service manual

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FDP16AN08A0 / FDB16AN08A0
N-Channel PowerTrench® MOSFET 75V, 58A, 16m
FDP16AN08A0 / FDB16AN08A0
July 2002
Features
•r
•Q
• Low Miller Charge
• Low Qrr Body Diode
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
Formerly developmental type 82660
DRAIN
(FLANGE)
MOSFET Maximum Ratings T
= 13mΩ (Typ.), V
DS(ON)
(tot) = 28nC (Typ.), V
g
GS
GS
TO-220AB
FDP SERIES
= 10V, ID = 58A
= 10V
SOURCE
DRAIN
GATE
C
GA TE
SOURCE
= 25°C unless otherwise noted
Applications
• 42V Automotiv e Load Control
• Starter / Alternator Systems
• Electronic Power Steering Systems
• Electronic Valve Train Systems
• DC-DC converter s and Off-line UPS
• Distributed P ower Arc hitectures and VRMs
• Primary Switch for 24V and 48V systems
G
TO-263AB
FDB SERIES
DRAIN
(FLANGE)
D
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Sou r c e Voltage 75 V Gate to Source Voltage ±20 V Drain Curr e nt Continuous (T
I
D
Continuous (T Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 44
C
= 25oC, VGS = 10V, with R
amb
= 43oC/W) 9 A
θJA
58 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 117 mJ Power dissipation 135 W
o
Derate above 25
C0.9W/
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
This product has been designed to meet the extreme test conditions and environment demanded by the automotive
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality
©2002 Fairchild Semiconductor Corporation
Thermal Resistance Junction to Case TO-220,TO-263 1.11 Thermal Resistance Junction to Ambient TO-220,TO-263 62 Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
systems certification.
FDP16AN08A0 / FDB1 6AN08A0 Rev. A1
o
C/W
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB16AN08A0 FDB16AN08A0 TO-263AB 330mm 24mm 800 units FDP16AN08A0 FDP16AN08A0 TO-220AB Tube N/A 50 units
FDP16AN08A0 / FDB16AN08A0
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Con ditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag e ID = 250µA, VGS = 0V 75 - - V
V
= 60V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- -250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
I
= 58A, VGS = 10V - 0.013 0.016
D
I
= 29A, VGS = 6V - 0.019 0.029
Drain to S ou r c e On Re si st ance
D
= 58A, VGS = 10V,
I
D
T
= 175oC
J
- 0.032 0.037
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 288 - pF Reverse Transfer Capacitance - 88 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 3.5 5 nC Gate to Source Gate Charg e - 1 1 - nC Gate Charge Threshold to Plateau - 7.6 - nC
V
DD
I
= 58A
D
I
= 1.0m A
g
= 40V
Gate to Drain “Miller” Charge - 6.4 - nC
- 1857 - pF
28 42 nC
µA
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 8 - ns Rise Time - 82 - ns Turn-Off Delay Time - 28 - ns Fall Time - 30 - ns Turn-Off Time - - 86 ns
(VGS = 10V)
V
= 40V, ID = 58A
DD
V
= 10V, RGS = 10
GS
--135ns
Drain-Source Diode Characteristics
I
= 58A - - 1.2 5 V
V
SD
t
rr
Q
RR
Notes: 1: Starting T
©2002 Fairchild Semiconductor Corporation FDP16AN08A0 / FDB1 6AN08A0 Rev. A1
Source to Drain Diode Voltage Reverse Recovery Time ISD = 58A, dISD/dt = 100A/µs- -35ns
Reverse Recovered Charge ISD = 58A, dISD/dt = 100A/µs- -36nC
= 25°C, L = 260µH, IAS = 30A.
J
SD
I
= 29A - - 1.0 V
SD
FDP16AN08A0 / FDB16AN08A0
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
10
60
40
20
, DRAIN CURRENT (A)
D
I
0
150
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t PEAK TJ = PDM x Z
-1
10
θJC
10
1/t2
0
x R
θJC
t
+ T
1
t
2
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
700
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
VGS = 10V
, PEAK CURRENT (A)
100
DM
I
50
-5
10
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2002 Fairchild Semiconductor Corporation FDP16AN08A0 / FDB1 6AN08A0 Rev. A1
FDP16AN08A0 / FDB16AN08A0
Typical Characteristics T
500
100
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
, DRAIN CURRENT (A)
D
1
I
SINGLE PULSE TJ = MAX RATED
T
C
0.1 1 10 100
DS(ON)
= 25oC
VDS, DRAIN TO SOURCE VOLTAGE (V)
= 25°C unless otherwise noted
C
10µs
100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
100
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX V
= 15V
DD
75
100
10
, AVALANCHE CURRENT (A)
AS
I
1
0.01 0.1 1 10 100
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R
0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
STARTING TJ = 150oC
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
100
VGS = 20V
75
VGS = 10V
VGS = 7V
50
, DRAIN CURRENT (A)
D
I
TJ = 25oC
25
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
TJ = 175oC
TJ = -55oC
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
0.022
0.020
0.018
0.016
0.014
DRAIN TO SOURCE ON RESISTANCE(mΩ)
0.012 0 102030405060
VGS = 6V
VGS = 10V
I
, DRAIN CURRENT (A)
D
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
50
, DRAIN CURRENT (A)
D
I
25
0
01234
2.5
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200
VGS = 6V
VGS = 5V
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS = 10V, ID =58A
TJ, JUNCTION TEMPERATURE (oC)
TC = 25oC
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2002 Fairchild Semiconductor Corporation FDP16AN08A0 / FDB1 6AN08A0 Rev. A1
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