Thermal Resistance Junction to Case TO-220,TO-2631.11
Thermal Resistance Junction to Ambient TO-220,TO-263 62
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea43
industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
FDB16AN08A0FDB16AN08A0TO-263AB330mm24mm800 units
FDP16AN08A0FDP16AN08A0TO-220ABTubeN/A50 units
FDP16AN08A0 / FDB16AN08A0
Electrical Characteristics
TC = 25°C unless otherwise noted
SymbolParameterTest Con ditionsMinTypMaxUnits
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag eID = 250µA, VGS = 0V75--V
V
= 60V--1
Zero Gate Voltage Drain Current
DS
= 0VTC = 150oC- -250
V
GS
Gate to Source Leakage CurrentVGS = ±20V--±100nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA2-4V
I
= 58A, VGS = 10V -0.0130.016
D
I
= 29A, VGS = 6V -0.0190.029
Drain to S ou r c e On Re si st ance
D
= 58A, VGS = 10V,
I
D
T
= 175oC
J
-0.0320.037
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitance-288-pF
Reverse Transfer Capacitance-88-pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10VVGS = 0V to 10V
Threshold Gate ChargeVGS = 0V to 2V-3.55nC
Gate to Source Gate Charg e-1 1-nC
Gate Charge Threshold to Plateau-7.6-nC
V
DD
I
= 58A
D
I
= 1.0m A
g
= 40V
Gate to Drain “Miller” Charge-6.4-nC
-1857-pF
2842nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-8-ns
Rise Time-82-ns
Turn-Off Delay Time-28-ns
Fall Time-30-ns
Turn-Off Time--86ns