Fairchild FDB10AN06A0, FDP10AN06A0 service manual

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FDB10AN06A0 / FDP10AN06A0
N-Channel PowerTrench® MOSFET 60V, 75A, 10.5m
FDB10AN06A0 / FDP10AN06A0
July 2002
Features
•r
•Q
• Low Miller Charge
• Low Qrr Body Diode
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
Formerly developmental type 82560
MOSFET Maximum Ratings T
= 9.5mΩ (Typ.), V
DS(ON)
(tot) = 28nC (Typ.), V
g
DRAIN
(FLANGE)
= 10V, ID = 75A
GS
= 10V
GS
TO-220AB
FDP SERIES
DRAIN
GA TE
SOURCE
= 25°C unless otherwise not ed
C
Applications
• Motor / Body Load Control
• ABS Systems
• Powertrain Management
• Injection Syste m s
• DC-DC converter s and Off-line UPS
• Distributed P ower Arc hitectures and VRMs
• Primary Switch for 12V and 24V systems
GATE
G
SOURCE
TO-263AB
FDB SERIES
DRAIN
(FLANGE)
D
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Sou r c e Voltage 60 V Gate to Source Voltage ±20 V Drain Curr e nt Continuous (T
I
D
Continuous (T
Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 54 A
C
= 25oC, VGS = 10V) with R
amb
= 43oC/W) 12 A
θJA
75 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 429 mJ Power dissipation 135 W
o
Derate above 25
C0.9W/
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
This product has been designed to meet the extreme test conditions an d environment dem anded by the au tomotive industry. For a
All Fairchild Semiconductor products are manufactu red, assembled and tested under ISO9000 and QS9000 quality systems
©2002 Fairchild Semiconductor Corporation
Thermal Resistance Junction t o Case TO-220, TO-263 1.11 Thermal Resistance Junction t o Ambient T O-220, TO-263 (Note 2) 62 Thermal Resistance Junction to Ambient TO-263, 1 in2 copper pad area 43
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be fou nd a t: http://ww w.f airc hilds e m i.co m /pr oduc ts/dis c rete/reliab ility/ind ex.html.
certification.
FDB10AN 06A0 / FDP 10AN06A0 Rev. A
o
C/W
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB10AN06A0 FDB10AN06A0 TO- 263AB 330mm 24mm 800 unit s FDP10AN06A0 FDP10AN06A0 TO- 220AB Tube N/A 50 unit s
FDB10AN06A0 / FDP10AN06A0
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Con ditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag e ID = 250µA, VGS = 0V 60 - - V
V
= 50V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- -250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
I
= 75A, VGS = 10V - 0.0095 0.0105
D
I
= 37A, VGS = 6V - 0.017 0.027
Drain to S ou r c e On Re si st ance
D
= 75A, VGS = 10V,
I
D
T
= 175oC
J
- 0.021 0.023
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 340 - pF Reverse Transfer Capacitance - 110 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 3.5 4.6 nC Gate to Source Gate Charg e - 11.7 - nC Gate Charge Threshold to Plateau - 8.2 - nC
V
DD
I
= 75A
D
I
= 1.0m A
g
= 30V
Gate to Drain “Miller” Charge - 7.4 - nC
- 1840 - pF
28 37 nC
µA
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 8 - ns Rise Time - 128 - ns Turn-Off D elay Time - 27 - ns Fall Time - 36 - ns Turn-Off Time - - 94 ns
(VGS = 10V)
V
= 30V, ID = 75A
DD
V
= 10V, RGS = 10
GS
--206ns
Drain-Source Diode Characteristics
I
= 75A - - 1.2 5 V
V
SD
t
rr
Q
RR
Notes: 1: Starting T 2: Pulse Width = 100s
©2002 Fairchild Semiconductor Corporation FDB10AN06A0 / FDP10AN06A0 Rev. A
Source to Drain Diode Voltage Reverse Recovery Time ISD = 75A, dISD/dt = 100A/µs- -27ns
Reverse Recovered Charge ISD = 75A, dISD/dt = 100A/µs- -23nC
= 25°C, L = 8.58mH, IAS = 10A.
J
SD
I
= 40A - - 1.0 V
SD
FDB10AN06A0 / FDP10AN06A0
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
10
80
60
40
, DRAIN CURRENT (A)
D
I
20
150
0
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t PEAK TJ = PDM x Z
-1
10
θJC
10
1/t2
x R
0
θJC
t
1
+ T
t
2
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
VGS = 10V
, PEAK CURRENT (A)
DM
I
100
70
-5
10
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2002 Fairchild Semiconductor Corporation FDB10AN06A0 / FDP10AN06A0 Rev. A
Typical Characteristics T
= 25°C unless otherwise noted
C
FDB10AN06A0 / FDP10AN06A0
500
100
OPERATION IN THIS
10
, DRAIN CURRENT (A)
D
1
I
0.1
AREA MAY BE
LIMITED BY r
SINGLE PULSE TJ = MAX RATED
T
= 25oC
C
110100
DS(ON)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
10µs 100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
500
100
10
, AVALANCHE CURRENT (A)
AS
I
1
0.01
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
150
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
125
V
= 15V
DD
100
75
TJ = 25oC
150
125
100
75
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
STARTING TJ = 150oC
0.1 1 10
tAV, TIME IN AVALANCHE (ms)
Capability
VGS = 10V
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
= 7V
V
GS
VGS = 6V
50
, DRAIN CURRENT (A)
D
I
TJ = 175oC
25
0
45678
TJ = -55oC
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
25
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
20
15
10
DRAIN TO SOURCE ON RESISTANCE(mΩ)
5
0 20406080
VGS = 6V
VGS = 10V
ID, DRAIN CURRENT (A)
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
50
, DRAIN CURRENT (A)
D
I
25
0
01234
2.5
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200
VDS, DRAIN TO SOURCE VOLTAGE (V)
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
TJ, JUNCTION TEMPERATURE (oC)
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
TC = 25oC
V
= 5V
GS
VGS = 10V, ID = 75A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2002 Fairchild Semiconductor Corporation FDB10AN06A0 / FDP10AN06A0 Rev. A
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