Fairchild FDB060AN08A0, FDP060AN08A0 service manual

FDB060AN08A0 / FDP060AN08A0
N-Channel PowerTrench® MOSFET 75V, 80A, 6.0m
FDB060AN08A0 / FDP060AN08A0
November 2002
•r
•Q
• Low Miller Charge
•Low Q
= 4.8mΩ (Typ .), V
DS(ON)
(tot) = 73nC (Typ.), V
g
Body Diode
RR
= 10V, ID = 80A
GS
= 10V
GS
Applications
• Elec tr on ic Valve Train Sys te m s
• DC-DC converters and Off -line UPS
• Distributed Power Architectures and VRMs
• Primary Switch for 24V and 48V systems
• UIS Capability (Single Pulse and Repetitive Pulse)
Formerly developmental type 82680
DRAIN
(FLANGE)
GATE
TO-220AB
FDP SERIES
MOSFET Maximum Ratings
SOURCE
DRAIN
GATE
SOURCE
TO-263AB
FDB SERIES
TC = 25°C unless otherwise noted
DRAIN
(FLANGE)
D
G
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Sou r c e Voltage 75 V Gate to Source Voltage ±20 V Drain Curr e nt
I
D
Continuous (T Continuous (T
< 127oC, VGS = 10V)
C
= 25oC, VGS = 10V, with R
amb
= 43oC/W) 16 A
θJA
80 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 350 mJ Power dissipation 255 W Derate above 25oC1.7W/ Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
Thermal Resistance Junction to Case TO-220,TO-263 0.58 Thermal Resistance Junction to Ambien t TO-220,TO -263 (Note 2) 62 Thermal Resistan ce Junction to Ambient TO-263, 1in2 copper pad ar ea 43
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
o
C/W
o
C/W
o
C/W
FDB060AN08A0 / FDP060AN08A0 Rev. C2©2002 Fairchild Semiconductor Corporation
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB060 AN08A0 FDB060AN08A0 TO-263AB 330mm 24mm 800 uni ts FDP060AN08A0 FDP060AN08A0 TO-220AB Tube N/A 50 unit s
FDB060AN08A0 / FDP060AN08A0
Electrical Characteristics
TC = 25°C unless othe rw ise noted
Symbol Parame ter Test Conditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag e ID = 250µA, VGS = 0V 75 - - V
V
= 60V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- -250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
ID = 80A, VGS = 10V - 0.0048 0.006 I
= 40A, VGS = 6V - 0.0066 0.010
Drain to S ou r c e On Re si st ance
D
= 80A, VGS = 10V,
I
D
T
= 175oC
J
- 0.010 0.013
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 800 - pF Reverse Transfer Capacitance - 230 - pF
V
= 25V, VGS = 0V,
DS
f = 1MHz
Total Gate Charge at 10V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 10 13 nC Gate to Source Gate Charg e - 2 9 - nC Gate Charge Threshold to Plateau - 19 - nC
VDD = 40V
= 80A
I
D
I
= 1.0m A
g
- 5150 - pF
73 95 nC
Gate to Drain “Miller” Charge - 16 - nC
µA
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 19 - ns Rise Time - 79 - ns Turn-Off Delay Time - 37 - ns Fall Time - 38 - ns Turn-Off Time - - 113 ns
(VGS = 10V)
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Notes: 1: Starting TJ = 25°C, L = 109µH, IAS = 80A. 2: Pulse width = 100s
Source to Drain Diode V oltage Reverse Recovery Time ISD = 75A, dISD/dt = 100A/µs- -37ns
Reverse Recovered Charge ISD = 75A, dISD/dt = 100A/µs- -38nC
--147ns
VDD = 40V, ID = 80A VGS = 10V, RGS = 3.9
I
= 80A - - 1.25 V
SD
= 40A - - 1.0 V
I
SD
FDB060AN08A0 / FDP060AN08A0 Rev. C2©2002 Fairchild Semiconductor Corporation
FDB060AN08A0 / FDP060AN08A0
Typical Characteristics
TC = 25°C unless othe rw ise noted
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
10
150
125
100
75
50
, DRAIN CURRENT (A)
D
I
25
0
150
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
CURRENT LIMITED BY PACKAGE
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-1
10
θJC
10
0
x R
t
1
t
2
2
+ T
θJC
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
TRANSCONDUCTANCE
1000
MAY LIMIT CURRENT IN THIS REGION
VGS = 10V
, PEAK CURRENT (A)
DM
I
100
70
-5
10
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
FDB060AN08A0 / FDP060AN08A0 Rev. C2©2002 Fairchild Semiconductor Corporation
FDB060AN08A0 / FDP060AN08A0
Typical Characteristics
1000
100
OPERATION IN THIS
10
, DRAIN CURRENT (A)
D
I
0.1
AREA MAY BE
LIMITED BY r
1
SINGLE PULSE
TJ = MAX RATED TC = 25oC
110100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TC = 25°C unless othe rw ise noted
10µs
100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
175
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
150
125
= 15V
V
DD
500
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
100
10
, AVALANCHE CURRENT (A)
AS
I
1
0.01 0.1 1 10 100
STARTING TJ = 150oC
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
DSS
STARTING TJ = 25oC
- VDD) +1]
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
175
150
125
VGS = 10V
V
= 7V
GS
VGS = 6V
100
75
, DRAIN CURRENT (A)
50
D
I
25
TJ = 25oC
0
3.5 4.0 4.5 5.0 5.5 6.0 VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 175oC
TJ = -55oC
100
75
, DRAIN CURRENT (A)
50
D
I
25
0
0 0.5 1.0 1.5 2.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
TC = 25oC
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
7.5
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
7.0
6.5
6.0
5.5
5.0
4.5
DRAIN TO SOURCE ON RESISTANCE(mΩ)
4.0 0 20406080
VGS = 6V
VGS = 10V
ID, DRAIN CURRENT (A)
2.5
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200 TJ, JUNCTION TEMPERATURE (oC)
VGS = 5V
VGS = 10V, ID = 80A
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
FDB060AN08A0 / FDP060AN08A0 Rev. C2©2002 Fairchild Semiconductor Corporation
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