Fairchild FDA70N20 service manual

FDA70N20
200V N-Channel MOSFET
FDA70N20 200V N-Channel MOSFET
TM
UniFET
Features
• Low gate charge ( typical 66 nC)
•Low C
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
( typical 89 pF)
rss
= 0.035 @VGS = 10 V
DS(on)
GSD
TO-3PN
FDA Series
Description
These N-Channel enhancement mode power field effect transis­tors are produced using Fairchild’s proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to mini­mize on-state resistance, provide superior switching perfor­mance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high effi­cient switched mode power supplies and active power factor correction.
D
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z
z
z
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G
z z
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S
Absolute Maximum Ratings
Symbol Parameter FDA70N20 Unit
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
T
J, TSTG
T
L
Drain-Source Voltage 200 V
Drain Current - Continuous (TC = 25°C)
- Continuous (T
Drain Current - Pulsed
Gate-Source voltage ±30 V
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 70 A
Repetitive Avalanche Energy (Note 1) 41.7 mJ
Power Dissipation (TC = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range -55 to +150 °C
Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
= 100°C)
C
(Note 1)
(Note 2)
(Note 3) 4.5 V/ns
70 45
280 A
1742 mJ
417
3.3
300 °C
A A
W
W/°C
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDA70N20 Rev. A
Thermal Resistance, Junction-to-Case -- 0.3 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDA70N20 FDA70N20 TO-3PN - - 30
FDA70N20 200V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min. Typ. Max Units
Off Characteristics
BV
DSS
BV / ∆T
I
DSS
I
GSSF
I
GSSR
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 200 -- -- V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current VDS = 200V, VGS = 0V
I
= 250µA, Referenced to 25°C--0.2--V/°C
D
= 160V, TC = 125°C
V
DS
--
--
--
--
1
10
µA µA
Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
Gate Threshold Voltage VDS = VGS, ID = 250µA3.0--5.0V
Static Drain-Source On-Resistance
Forward Transconductance VDS = 40V, ID = 35A
Input Capacitance VDS = 25V, VGS = 0V,
Output Capacitance -- 750 980 pF
= 10V, ID = 35A -- 0.029 0.035
V
GS
(Note 4)
-- 47 -- S
-- 3050 3970 pF
f = 1.0MHz
Reverse Transfer Capacitance -- 89 130 pF
Turn-O n Delay Time VDD = 100V, ID = 70A
= 25
R
Turn-On Rise Time -- 235 480 ns
G
-- 71 150 ns
Turn-Off Delay Time -- 65 140 ns
Turn-Off Fall Time -- 39 88 ns
Total Gate Charge VDS = 160V, ID = 70A
V
= 10V
Gate-Source Charge -- 19 -- nC
GS
Gate-Drain Charge -- 26 -- nC
(Note 4, 5)
-- 66 86 nC
(Note 4, 5)
Maximum Continuous Drain-Source Diode Forward Current -- -- 70 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 280 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 70A -- -- 1.4 V
Reverse Recovery Time VGS = 0V, IS = 70A
/dt =100A/µs (Note 4)
dI
Reverse Recovery Charge -- 4.1 -- µC
F
-- 175 -- ns
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 0.533mH, IAS = 70A, VDD = 50V, RG = 25, Starting TJ = 25°C
3. ISD 70A, di/dt 200A/µs, VDD BV
4. Pulse Test: Pulse width 300µs, Duty Cycle 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
, Starting TJ = 25°C
DSS
FDA70N20 Rev. A
2 www.fairchildsemi.com
Typical Performance Characteristics
FDA70N20 200V N-Channel MOSFET
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
, Drain Current [A] I
2
10
1
10
D
0
10
10
V Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V Bottom : 6.0 V
-1
GS
0
10
VDS, Drain-Source Voltage [V]
2
10
150oC
Notes :
1. 250µ s Pulse Test
2. T
= 25
C
1
10
1
10
, Drain Current [A]
D
I
0
10
24681012
25oC
VGS, Gate-Source Voltage [V]
-55oC
Notes :
1. VDS = 40V
2. 250µ s Pulse Test
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
0.06
0.05
VGS = 10V
0.04
VGS = 20V
[],Drain-Source On-Resistance
0.03
DS(ON)
R
0 25 50 75 100 125 150 175 200
Note : TJ = 25
ID, Drain Current [A]
2
10
1
10
, Reverse Drain Current [A]
DR
I
0
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1. 6 1.8
150
VSD, Source-Drain voltage [V]
25
Notes :
1. VGS = 0V
2. 250µ s Pulse Test
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
8000
6000
4000
Capacitances [pF]
2000
0
-1
10
FDA70N20 Rev. A
C
oss
C
iss
C
rss
0
10
VDS, Drain-Source Voltage [V]
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
Note ;
1. VGS = 0 V
2. f = 1 MHz
1
10
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0 10203040506070
VDS = 40V
VDS = 100V
VDS = 160V
Note : ID = 70A
QG, Total Gate Charge [nC]
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