FDA70N20
200V N-Channel MOSFET
FDA70N20 200V N-Channel MOSFET
TM
UniFET
Features
• 70A, 200V, R
• Low gate charge ( typical 66 nC)
•Low C
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
( typical 89 pF)
rss
= 0.035Ω @VGS = 10 V
DS(on)
GSD
TO-3PN
FDA Series
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor
correction.
D
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z
z
z
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G
z
z
z
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S
Absolute Maximum Ratings
Symbol Parameter FDA70N20 Unit
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
T
J, TSTG
T
L
Drain-Source Voltage 200 V
Drain Current - Continuous (TC = 25°C)
- Continuous (T
Drain Current - Pulsed
Gate-Source voltage ±30 V
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 70 A
Repetitive Avalanche Energy (Note 1) 41.7 mJ
Power Dissipation (TC = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range -55 to +150 °C
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
= 100°C)
C
(Note 1)
(Note 2)
(Note 3) 4.5 V/ns
70
45
280 A
1742 mJ
417
3.3
300 °C
A
A
W
W/°C
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDA70N20 Rev. A
Thermal Resistance, Junction-to-Case -- 0.3 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDA70N20 FDA70N20 TO-3PN - - 30
FDA70N20 200V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min. Typ. Max Units
Off Characteristics
BV
DSS
∆BV
/ ∆T
I
DSS
I
GSSF
I
GSSR
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 200 -- -- V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current VDS = 200V, VGS = 0V
I
= 250µA, Referenced to 25°C--0.2--V/°C
D
= 160V, TC = 125°C
V
DS
--
--
--
--
1
10
µA
µA
Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
Gate Threshold Voltage VDS = VGS, ID = 250µA3.0--5.0V
Static Drain-Source
On-Resistance
Forward Transconductance VDS = 40V, ID = 35A
Input Capacitance VDS = 25V, VGS = 0V,
Output Capacitance -- 750 980 pF
= 10V, ID = 35A -- 0.029 0.035 Ω
V
GS
(Note 4)
-- 47 -- S
-- 3050 3970 pF
f = 1.0MHz
Reverse Transfer Capacitance -- 89 130 pF
Turn-O n Delay Time VDD = 100V, ID = 70A
= 25Ω
R
Turn-On Rise Time -- 235 480 ns
G
-- 71 150 ns
Turn-Off Delay Time -- 65 140 ns
Turn-Off Fall Time -- 39 88 ns
Total Gate Charge VDS = 160V, ID = 70A
V
= 10V
Gate-Source Charge -- 19 -- nC
GS
Gate-Drain Charge -- 26 -- nC
(Note 4, 5)
-- 66 86 nC
(Note 4, 5)
Maximum Continuous Drain-Source Diode Forward Current -- -- 70 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 280 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 70A -- -- 1.4 V
Reverse Recovery Time VGS = 0V, IS = 70A
/dt =100A/µs (Note 4)
dI
Reverse Recovery Charge -- 4.1 -- µC
F
-- 175 -- ns
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 0.533mH, IAS = 70A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 70A, di/dt ≤ 200A/µs, VDD ≤ BV
4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
, Starting TJ = 25°C
DSS
FDA70N20 Rev. A
2 www.fairchildsemi.com
Typical Performance Characteristics
FDA70N20 200V N-Channel MOSFET
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
, Drain Current [A]
I
2
10
1
10
D
0
10
10
V
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
Bottom : 6.0 V
-1
GS
0
10
VDS, Drain-Source Voltage [V]
2
10
150oC
Notes :※
1. 250µ s Pulse Test
2. T
= 25℃
C
1
10
1
10
, Drain Current [A]
D
I
0
10
24681012
25oC
VGS, Gate-Source Voltage [V]
-55oC
Notes :※
1. VDS = 40V
2. 250µ s Pulse Test
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
0.06
0.05
VGS = 10V
0.04
VGS = 20V
[Ω ],Drain-Source On-Resistance
0.03
DS(ON)
R
0 25 50 75 100 125 150 175 200
Note : T※J = 25℃
ID, Drain Current [A]
2
10
1
10
, Reverse Drain Current [A]
DR
I
0
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1. 6 1.8
150℃
VSD, Source-Drain voltage [V]
25℃
Notes :※
1. VGS = 0V
2. 250µ s Pulse Test
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
8000
6000
4000
Capacitances [pF]
2000
0
-1
10
FDA70N20 Rev. A
C
oss
C
iss
C
rss
0
10
VDS, Drain-Source Voltage [V]
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
Note ;※
1. VGS = 0 V
2. f = 1 MHz
1
10
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0 10203040506070
VDS = 40V
VDS = 100V
VDS = 160V
Note : I※D = 70A
QG, Total Gate Charge [nC]
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