Fairchild FDA38N30 service manual

FDA38N30

TO-3PN FDA Series
GSD
D
G
S

N-Channel MOSFET

January 2012
UniFET
FDA38N30 N-Channel MOSFET
TM
Features
• R
• Low gate charge ( typical 60 nC)
•Low C
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• ESD Improved capability
•RoHS Compliant
MOSFET Maximum Ratings T
= 0.07Ω ( Typ.) @ VGS = 10V, ID = 19A
DS(on)
( typical 60 pF)
rss
= 25oC unless otherwise noted
C
Description
These N-Channel enhancement mode power field effect transis­tors are produced using Fairchild’s proprietary, planar stripe, DMOS technology
This advanced technology has been especially t mize on-state resistance, provide sup mance, and withstand high energy p commutation mode. These devices are well suited for high effi­cient switched mode power supplies and active power factor
ection.
corr
.
ailored to mini-
erior switching perfor-
ulse in the avalanche and
Symbol Parameter FDA38N30 Unit
V
DSS
V
GSS
I
D
I
DM
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
T
J, TSTG
T
L
Drain to Source Voltage 300 V
Gate to Source Voltage ±30 V
Drain Current
Drain Current
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 38 A
Repetitive Avalanche Energy (Note 1) 31 mJ
Power Dissipation

Operating and Storage Temperature Range -55 to +150 °C

Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
-Continuous (TC = 25oC) 38
-Continuous (T
- Pulsed
(T
= 25oC) 312
C
- Derate above 25
= 100oC) 22
C
(Note 1)
(Note 2)

(Note 3) 4.5 V/ns

o
C 2.5
150 A

1200 mJ

300 °C
W/
A
W
o
C
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FDA38N30 Rev. C0
Thermal Resistance, Junction-to-Case - 0.4 °C/W

Thermal Resistance, Case-to-Sink 0.24 - °C/W

Thermal Resistance, Junction-to-Ambient - 40 °C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape W i dth Quantity

FDA38N30 FDA38N30 TO-3PN - - 30

FDA38N30 N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min. Typ. Max Units
Off Characteristics
BV
DSS
ΔBV / ΔT
I
DSS
I
GSS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Q
g(tot)
Q
gs
Q
gd
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V, TC = 25oC 300 - - V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current

= 250μA, Referenced to 25°C - 0.3 - V/°C

I
D
V
= 300V, V
DS
V
= 240V, TC = 125oC
DS
= ±30V, V
V
GS
GS
DS
= 0V
= 0V
- - 1
- - 10
- -
Gate Threshold Voltage VDS = VGS, ID = 250μA 3.0 - 5.0 V
Static Drain-Source On-Resistance
Forward Transconductance VDS = 20V, ID = 19A
V
= 10V, ID = 19A
GS
(Note 4)
Input Capacitance
= 25V, VGS = 0V
V
Output Capacitance - 500 - pF
DS
f = 1MHz
-

0.07 0.085 Ω

- 6.3 - S

- 2600 - pF

Reverse Transfer Capacitance - 60 - pF
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
= 240V, ID = 38A
V
DS
V
= 10V
GS
(Note 4, 5)
Turn-On Delay Time
= 150V, ID = 38A
V
Turn-On Rise Time - 110 143 ns
Turn-Off Del ay Time - 11 8 153 ns
Turn-Off Fal l Time - 54 70 ns
DD
= 25Ω, VGS = 10V
R
G
(Note 4, 5)
- 60 - nC
- 17 - nC
- 28 - nC
- 53 69 ns
Maximum Continuous Drain to Source Diode Forward Current - - 38 A
Maximum Pulsed Drain-Source Diode Forward Current - - 150 A
Drain to Source Diode Forward Voltage V
Reverse Recovery Time VGS = 0V, I
Reverse Recovery Charge - 4.0 - μC
= 0V, I
GS
/dt = 100A/μs (Note 4)
dI
F
= 38A - - 1.4 V
SD
= 38A
SD
- 315 - ns
±100
μA
nA
NOTES:
1. Repetitive Rating: Pulse width limite
2. L = 1.7mH, IAS = 38A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. I
38A, di/dt 200A/μs, VDD BV
SD
4. Pulse Test: Pulse width 300μs, Duty Cycle 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
d by maximum junction temperature
, Starting TJ = 25°C
DSS
FDA38N30 Rev. C0
2 www.fairchildsemi.com
Typical Performance Characteristics
10
-1
10
0
10
1
10
0
10
1
10
2
V
GS
Top : 15. 0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V Bottom : 5.5 V
* Notes:
1. 250
μs Pul se Test
2. T
C
= 25oC
I
D
, Drain Current [A]
VDS, Drai n-Source Voltage [ V]
24681012
10
0
10
1
10
2
150oC
25oC
-55oC
* Notes:
1. V
DS
= 20V
2. 250
μs Pulse Test
I
D
, Drain Current [A]
VGS, Gate-Source Voltage [V]
0 25 50 75 100 125
0.05
0.06
0.07
0.08
0.09
0.10
0.11
0.12
0.13
VGS = 20V
VGS = 10V
* Note : TJ = 25
R
DS(ON)
[Ω],
Drain-Source On-Resistance
ID, Drain Current [A]
0.2 0.4 0. 6 0.8 1.0 1.2 1.4 1. 6 1.8
10
0
10
1
10
2
150oC
* Notes:
1. V
GS
= 0V
2. 250
μs Pulse Test
25oC
I
DR
, Reverse Drain Current [A]
VSD, Source-Drai n voltage [ V]
10
-1
10
0
10
1
0
2000
4000
6000
C
iss
= Cgs + Cgd (Cds = short ed)
C
oss
= Cds + C
gd
C
rss
= C
gd
* Note ;
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
0 102030405060
0
2
4
6
8
10
12
VDS = 150V
VDS = 60V
VDS = 240V
? Note : ID = 38A
V
GS
, Gate-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
FDA38N30 N-Channel MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDA38N30 Rev. C0
3 www.fairchildsemi.com
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