Fairchild FDA15N65 service manual

FDA15N65

650V N-Channel MOSFET

FDA15N65 650V N-Channel MOSFET
January 2007
TM
UniFET
• 16A, 650V, R
• Low gate charge ( typical 48.5 nC)
•Low C
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
( typical 23.6 pF)
rss
= 0.44Ω @VGS = 10 V
DS(on)
GSD
TO-3PN
FDA Series
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.
D
G
S
Absolute Maximum Ratings
Symbol Parameter FDA15N65 Unit
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
P
D
T
J, TSTG
T
L
Drain-Source Voltage 650 V
Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
Drain Current - Pulsed
Gate-Source voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 16 A
Repetitive Avalanche Energy (Note 1) 26 mJ
Power Dissipation (TC = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range -55 to +150 °C
Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
(Note 1)
(Note 2)
16
9.6
64
637 mJ
260
2.1
300 °C
W/°C
A A
A
W
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDA15N65 Rev. A
Thermal Resistance, Junction-to-Case -- 0.48 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Widt h Quantity
FDA15N65 FDA15N65 TO-3PN -- -- 30
FDA15N65 650V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min Typ Max Units
Off Characteristics
BV
DSS
ΔBV / ΔT
I
DSS
I
GSSF
I
GSSR
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Drain-Source Breakdown Voltage VGS = 0V, ID = 250μA, TJ = 25°C 650 -- -- V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current VDS = 650V, VGS = 0V
ID = 250μA, Referenced to 25°C -- 0.65 -- V/°C
VDS = 520V, TC = 125°C
--
--
--
--
Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
Gate Threshold Voltage VDS = VGS, ID = 250μA 3.0 -- 5.0 V
Static Drain-Source On-Resistance
Forward Transconductance VDS = 40V, ID = 8A
Input Capacitance VDS = 25V, VGS = 0V,
Output Capacitance -- 295 385 pF
VGS = 10V, ID = 8A -- 0.36 0.44 Ω
(Note 4)
-- 19.2 -- S
-- 2380 3095 pF
f = 1.0MHz
Reverse Transfer Capacitance -- 23.6 35.5 pF
Turn-O n Delay Time VDD = 325V, ID = 15A
Turn-O n Ris e Ti me -- 125 260 ns
RG = 21.7Ω
-- 65 140 ns
Turn-O ff Delay Time -- 105 220 ns
Turn-O ff Fall Time -- 65 140 ns
Total Gate Charge VDS = 520V, ID = 15A
Gate-Source Charge -- 14.0 -- nC
VGS = 10V
Gate-Drain Charge -- 21.2 -- nC
(Note 4, 5)
-- 48.5 63.0 nC
(Note 4, 5)
Maximum Continuous Drain-Source Diode Forward Current -- -- 16 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 64 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 16A -- -- 1.4 V
Reverse Recovery Time VGS = 0V, IS = 15A
Reverse Recovery Charge -- 5.69 -- μC
dIF/dt =100A/μs (Note 4)
-- 496 -- ns
10
1
μA μA
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 4.6mH, IAS = 16A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD 16A, di/dt 200A/μs, VDD BV
4. Pulse Test: Pulse width 300μs, Duty Cycle 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
, Starting TJ = 25°C
DSS
FDA15N65 Rev. A
2 www.fairchildsemi.com
Typical Performance Characteristics
24681012
10
0
10
1
10
2
150oC
25oC
-55oC
* Notes :
1. V
DS
= 40V
2. 250
μs Pulse Test
I
D
, Drain Current [A]
VGS, Gate-Source Voltage [V]
10
-1
10
0
10
1
10
-1
10
0
10
1
V
GS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V Bottom : 5.5 V
* Notes :
1. 250
μs Pulse Test
2. T
C
= 25oC
I
D
, Drain Current [A]
VDS, Drain-Source Voltage [V]
0 1020304050
0.0
0.2
0.4
0.6
0.8
1.0
VGS = 20V
VGS = 10V
* Note : TJ = 25oC
R
DS(ON)
[Ω],
Drain-Source On-Resistance
ID, Drain Current [ A]
0.2 0. 4 0.6 0.8 1.0 1. 2 1.4
10
0
10
1
150oC
* Notes :
1. V
GS
= 0V
2. 250
μs Pulse Test
25oC
I
DR
, Reverse Drain Current [A]
VSD, Source-Drain voltage [V]
0 10 20304050
0
2
4
6
8
10
12
VDS = 325V
VDS = 130V
VDS = 520V
* Note : ID = 15A
V
GS
, Gate-Source Voltage [V]
QG, Total Gate Charge [nC]
10
-1
10
0
10
1
0
1000
2000
3000
4000
5000
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
* Note ;
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
FDA15N65 650V N-Channel MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDA15N65 Rev. A
3 www.fairchildsemi.com
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