Industry-Standard Pinouts
4.5 to 18V Operating Range
5A Peak Sink/Source at V
4.3A Sink / 2.8A Source at V
DD
= 12V
= 6V
OUT
TTL Input Thresholds
Two Versions of Dual Independent Drivers:
- Dual Inverting (FAN3213)
- Dual Non-Inverting (FAN3214)
Internal Resistors Turn Driver Off If No Inputs
MillerDrive™ Technology
12ns / 9ns Typical Rise/Fall Times with 2.2nF Load
Typical Propagation Delay Under 20ns Matched
within 1ns to the Other Channel
Double Current Capability by Paralleling Channels
Standard SOIC-8 Package
Rated from –40°C to +125°C Ambient
Applications
Switch-Mode Power Supplies
High-Efficiency MOSFET Switching
Synchronous Rectifier Circuits
DC-to-DC Converters
Motor Control
Description
The FAN3213 and FAN3214 dual 4A gate drivers are
designed to drive N-channel enhancement-mode
MOSFETs in low-side switching applications by
providing high peak current pulses during the short
switching intervals. They are both available with TTL
input thresholds. Internal circuitry provides an undervoltage lockout function by holding the output LOW until
the supply voltage is within the operating range. In
addition, the drivers feature matched internal
propagation delays between A and B channels for
applications requiring dual gate drives with critical
timing, such as synchronous rectifiers. This also
enables connecting two drivers in parallel to effectively
double the current capability driving a single MOSFET.
The FAN3213/14 drivers incorporate MillerDrive™
architecture for the final output stage. This bipolarMOSFET combination provides high current during the
Miller plateau stage of the MOSFET turn-on / turn-off
process to minimize switching loss, while providing railto-rail voltage swing and reverse current capability.
The FAN3213 offers two inverting drivers and the
FAN3214 offers two non-inverting drivers. Both are
offered in a standard 8-pin SOIC package.
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (Θ
The value given is for natural convection with no heatsink, using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (
application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board
reference is defined as the PCB copper adjacent to pin 6.
6. Psi_JT (
the center of the top of the package for the thermal environment defined in Note 4.
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
JL
): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
JT
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
JA
): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
JB
): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
No Connect. This pin can be grounded or left floating.
Input to Channel A.
Ground. Common ground reference for input and output circuits.
Input to Channel A.
Input to Channel B.
Gate Drive Output A: Held LOW unless required input(s) are present and V
UVLO threshold.
Gate Drive Output B (inverted from the input): Held LOW unless required input is
present and V
is above UVLO threshold.
DD
Gate Drive Output B: Held LOW unless required input(s) are present and V
UVLO threshold.
Supply Voltage. Provides power to the IC.
Gate Drive Output A (inverted from the input):Held LOW unless required input is
present and V
is above UVLO threshold.
DD
Gate Drive Output A: Held LOW unless required input(s) are present and V
UVLO threshold.
No Connect. This pin can be grounded or left floating.
is above
DD
is above
DD
is above
DD
Output Logic
FAN3213 (x=A or B) FAN3214 (x=A or B)
INx
OUT
0 0 0
(7)
1
0 1 0
0 1 0
(7)
1
0 1 1
Note:
7. Default input signal if no external connection is made.
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VDD VDD to PGND -0.3 20.0 V
VIN INA, INA+, INA–, INB, INB+ and INB– to GND GND - 0.3 VDD + 0.3V
V
OUTA and OUTB to GND GND - 0.3 VDD + 0.3V
OUT
TL Lead Soldering Temperature (10 Seconds) +260 ºC
TJ Junction Temperature -55 +150 ºC
T
Storage Temperature -65 +150 ºC
STG
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.