3A Output Current
Over 95% Efficiency
Fully Synchronous Operation with Integrated
Schottky Diode on Low-side MOSFET Boosts
Efficiency
Programmable Frequency Operation (200KHz to
600KHz)
Power-good Signal
Accepts Ceramic Capacitors on Output
External Compensation for Flexible Design
Wide Input Range: 3V to 24V
Output Voltage Range: 0.8V to 90%V
The FAN2103 TinyBuck™ is an easy-to-use, cost- and
space-efficient, 3A synchronous buck solution. It
enables designers to solve high current requirements in
a small area with minimal external components.
External compensation, programmable switching
frequency, and current limit features allow for design
optimization and flexibility.
The summing current mode modulator uses lossless
current sensing for current feedback and over-current,
and includes voltage feedforward.
Fairchild’s advanced BiCMOS power process, combined
with low R
efficient MLP package provide the ability to dissipate
high power in a small package.
Output over-voltage, under-voltage, and thermal
shutdown protections plus power-good, help protect the
devices from damage during fault conditions.
internal MOSFETs and a thermally
DS(ON)
Related Application Notes
TinyCalc™ Design Tool
AN-6033 — TinyCalc™ Design Tool Guide
AN-5067 – PCB Land Pattern Design and Surface
Mount Guidelines for MLP Packages
Ordering Information
Part Number
FAN2103MPX -10°C to 85°C 25-Pin Molded Leadless Package (MLP) 5x6mm Tape and Reel
FAN2103EMPX -40°C to 85°C 25-Pin Molded Leadless Package (MLP) 5x6mm Tape and Reel
Switching Node.
Power Input Voltage. Connect to the main input power source.
Power Ground. Power return and Q2 source.
High-side Drive BOOT Voltage. Connect through capacitor (C
an internal synchronous bootstrap diode to recharge the capacitor on this pin to VCC when
SW is LOW.
Power-Good Flag. An open-drain output that pulls LOW when FB is outside a ±10% range
of the reference when EN is HIGH. PGOOD does not assert HIGH until the fault latch is
enabled.
ENABLE. Enables operation when pulled to logic HIGH or left open. Toggling EN resets the
regulator after a latched fault condition. This input has an internal pull-up when the IC is
functioning normally. When a latched fault occurs, EN is discharged by a current sink.
Input Bias Supply for IC. The IC’s logic and analog circuitry are powered from this pin.
Analog Ground. The signal ground for the IC. All internal control voltages are referred to
this pin. Tie this pin to the ground island/plane through the lowest impedance connection.
Current Limit. A resistor (R
limit trip threshold lower than the default setting.
Oscillator Frequency. A resistor (R
frequency.
Output Voltage Feedback. Connect through a resistor divider to the output voltage.
Compensation. Error amplifier output. Connect the external compensation network between
this pin and FB.
No Connect. This pin is not used.
Ramp Amplitude. A resistor (R
and provides voltage feedforward functionality.
) to SW. The IC includes
BOOT
) from this pin to AGND can be used to program the current-
ILIM
) from this pin to AGND sets the PWM switching
T
) connected from this pin to VIN sets the ramp amplitude
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter Conditions Min. Max. Unit
VIN to PGND 28 V
VCC to AGND AGND = PGND 6 V
BOOT to PGND 35 V
BOOT to SW -0.3 6.0 V
SW to PGND Transient (t < 20ns, f < 600KHz) -5 30 V
All other pins -0.3 VCC+0.3 V
ESD
Human Body Model, JEDEC JESD22-A114 2.0
Charged Device Model, JEDEC JESD22-C101 2.5
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Conditions Min. Typ. Max. Unit
VCC Bias Voltage VCC to AGND 4.5 5.0 5.5 V
VIN Supply Voltage VIN to PGND 3 24 V
TA Ambient Temperature
TJ Junction Temperature +125 °C
FAN2103M -10 +85 °C
FAN2103EM -40 +85 °C
Thermal Information
Symbol Parameter Min. Typ. Max. Unit
T
Storage Temperature -65 +150 °C
STG
TL Lead Soldering Temperature, 10 Seconds +300 °C
TVP Vapor Phase, 60 Seconds +215 °C
TI Infrared, 15 Seconds +220 °C
P1 (Q2) 4 °C/W
JC
J-PCB
PD Power Dissipation, TA = 25°C 2.8
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results
are dependent on mounting method and surface related to the design.