
4 Amp. Glass Passivated Bridge Rectifier
FBI4A7M1.......FBI4M7M1
Dimensions in mm.
25
3.2
_
+ 0.05
1
7.5 7.5
7.5
+
L suffix
17.5
8 –4
Plastic
Case
3.5
0.7
1
• Mounting Instructions
• High temperature soldering guaranteed: 260 ºC – 10 sc.
• Recommended mounting torque: 8 Kg.cm.
Voltage
50 to 1000 V.
• Glass Passivated Junction Chips.
• UL recognized under component index file
number E130180.
• Lead and polarity identifications.
• Case: Molded Plastic.
• Ideal for printed circuit board (P.C.B.).
• High surge current capability.
• The plastic material carries U/L recognition 94 V-O.
Maximum Ratings, according to IEC publication No. 134
VRRM
VRMS
FBI4A
Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)
7M1
50
35
FBI4B
7M1
100
70
FBI4D
7M1
200
140
FBI4G
7M1
400
280
Current
FBI4J
7M1
600
420
4.0 A.
®
FBI4K
7M1
800
560
FBI4M
7M1
1000
700
I
F(AV)
I
FSM
I2t
VDIS
T
T
Max. average Forward current with heatsink
without heatsink
10 ms. peak forward surge current
(Jedec Method)
Current squared time (rating for fusing)
(1ms.<t<10ms. Tc = 25ºC)
Dielectric strength (terminals to case, AC 1 min.)
Operating temperature range
j
Storage temperature range
stg
Electrical Characteristics at Tamb = 25°C
V
I
R
R
Max. forward voltage drop per diode at IF = 2.0 A
F
Max. reverse current at V
R
RRM
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
th (j-c)
Junction-Ambient. Without Heatsink.
th (j-a)
4.0 A at 100 ºC
3.0 A at 40 ºC
150 A
110 A2 sec
2000 V
– 55 to + 150 °C
– 55 to +150 ºC
0.95 V
5 A
5 ºC/W
22 ºC/W
Jan - 00

Characteristic Curves
FBI4 - 7M1
TYPICAL FORWARD CHARACTERISTIC
Tamb = 25° C
10
1.0
0.1
0
0.6 1.0 1.4
V
, instantaneous forward voltage (V)
F
FORWARD CURRENT DERATING CURVE
heatsink
4
3
2
on glass-epoxi substrate
1
_
+
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
Tc Tc
_
sine wave
R-load
on heatsink
0
0 50 100 150 175
12525 75
Tamb, ambient temperature (°C)
+
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
200
150
100
50
0
1
Number of cycles at 50 Hz.
10 100
Jan - 00