FAGOR FBI2.5M4S1, FBI2.5K4S1, FBI2.5J4S1, FBI2.5G4S1, FBI2.5D4S1 Datasheet

FBI2.5A

4S1

50

FBI2.5B

4S1

100

FBI2.5D

4S1

200

FBI2.5G

4S1

400

FBI2.5J

4S1

600

FBI2.5K

4S1

800

FBI2.5M

4S1

1000

• Mounting Instructions

• High temperature soldering guaranteed: 260 ºC – 10 sc.

• Recommended mounting torque: 8 Kg.cm.

FBI2.5A4S1.......FBI2.5M4S1

2.5 Amp. Glass Passivated Bridge Rectifier

Dimensions in mm.

Maximum Ratings, according to IEC publication No. 134

Peak recurrent reverse voltage (V)

Max. Average forward current with heatsink

without heatsink

8.3 ms. peak forward surge current
Rating for fusing ( t<8.3 ms.)

Dielectric strength

(terminals to case, AC 1 min.)

Operating temperature range
Storage temperature range

I

FSM

I2t
V

DIS

T

j

T

stg

4.5 A at 65 ºC

2.5 A at 25 ºC
100 A

15 A

2

sec

1500 V

– 55 to + 150 °C

– 55 to +150 ºC

Voltage

50 to 1000 V.

Current

2.5 A.

V

RRM

I

F(AV)

Plastic

Case

®

(Jedec Method)

Electrical Characteristics at Tamb = 25°C

V

F

Max. forward voltage drop per element at I

F

= 2.5 A

I

R

1.0 V

Max. reverse current per element at V

RRM

5 A

MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.

12 ºC/W
40 ºC/W

R

th (j-c)

R

th (j-a)

20

4

1

0.5

3.5

+

_

4 4

0.8

+ 0.05

L suffix

13.5
7 –4

• Glass Passivated Junction Chips.

• UL recognized under component index file

number E130180.

• Lead and polarity identifications.

• Case: Molded Plastic.

• Ideal for printed circuit board (P.C.B.).

• The plastic material carries U/L recognition 94 V-O.

Jan - 00

35 70 140 280 420 560 700

Maximum RMS voltage (V)

V

RMS

V

F

, instantaneous forward voltage (V)

0.6 1.0 1.4

0

0.1

1.0

10

Tamb = 25° C

Characteristic Curves

FBI2.5 - 4S1

Tamb, ambient temperature (°C)

1

3

4

5

0 50 100 150 175

0

12525 75

TYPICAL FORWARD CHARACTERISTIC FORWARD CURRENT DERATING CURVE

2

MAXIMUM NON-REPETITIVE PEAK

FORWARD SURGE CURRENT

Number of cycles at 60 Hz.

10 100

0

25

50

75

100

1

heatsink
Tc

Tc

sine wave
R-load
on heatsink

+

_

on glass-epoxi substrate

P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air

Jan - 00

+

_