FAGOR FBI1.5M4S1, FBI1.5K4S1, FBI1.5J4S1, FBI1.5G4S1, FBI1.5D4S1 Datasheet

FBI1.5G

4S1

400

FBI1.5D

4S1

200

FBI1.5J

4S1

600

FBI1.5K

4S1

800

FBI1.5M

4S1

1000

FBI1.5B

4S1

100

FBI1.5A

4S1

50

FBI1.5A4S1.......FBI1.5M4S1

1.5 Amp. Glass Passivated Bridge Rectifier

Dimensions in mm.

Maximum Ratings, according to IEC publication No. 134

Peak recurrent reverse voltage (V)

Max. Average forward current with heatsink
without heatsink

8.3 ms. peak forward surge current
Rating for fusing ( t<8.3 ms.)

Dielectric strength

(terminals to case, AC 1 min.)

Operating temperature range
Storage temperature range

I

FSM

I2t
V

DIS

T

j

T

stg

4.0 A at 65 ºC

1.5 A at 25 ºC
50 A

10 A

2

sec

1500 V

– 55 to + 150 °C

– 55 to +150 ºC

Electrical Characteristics at Tamb = 25°C

V

F

Max. forward voltage drop per element at I

F

= 1 A

I

R

1.0 V

Max. reverse current per element at V

RRM

Voltage

50 to 1000 V.

Current

1.5 A.

V

RRM

I

F(AV)

Plastic

Case

®

5 A

(Jedec Method)

MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.

12 ºC/W
45 ºC/W

R

th (j-c)

R

th (j-a)

• Glass Passivated Junction Chips.

• UL recognized under component index file

number E130180.

• Lead and polarity identifications.

• Case: Molded Plastic.

• Ideal for printed circuit board (P.C.B.).

• The plastic material carries U/L recognition 94 V-O.

• Mounting Instructions

• High temperature soldering guaranteed: 260 ºC – 10 sc.

• Recommended mounting torque: 8 Kg.cm.

20

4

1

0.5

3.5

+

_

4 4

0.8

+ 0.05

L suffix

13.5
7 –4

Jan - 00

280140 420 560 7007035

Maximum RMS voltage (V)

V

RMS

V

F

, instantaneous forward voltage (V)

0.6 1.0 1.4

0

0.1

1.0

10

Tamb = 25° C

Characteristic Curves

FBI1.5 - 4S1

Tamb, ambient temperature (°C)

1

2

3

4

0 50 100 150 175

0

12525 75

Number of cycles at 60 Hz.

10 100

0

10

20

30

40

50

60

TYPICAL FORWARD CHARACTERISTIC FORWARD CURRENT DERATING CURVE

MAXIMUM NON-REPETITIVE PEAK

FORWARD SURGE CURRENT

1

heatsink
Tc

Tc

sine wave
R-load
on heatsink

+

_

on glass-epoxi substrate

soldering land 5 mm ø
sine wave
R-load
free in air

P.C.B.

Jan - 00

+

_