Ezurio BL600 User Manual

Single Mode Bluetooth Low Energy
(BLE) Module

Part # BL600-SA, BL600-SC, BL600-ST

HARDWARE DATA SHEET AND INTEGRATION GUIDE

VERSION 0.5

Americas: [phone] Option 3
Europe: [phone]
Hong Kong: [phone]

BL600-Sx

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Revision

Description

Version

0.1

07/02/2013 – first stage internal release

Version

0.2

07/02/13 – includes Mt comments

Version

0.3

15Feb13 –RK initial updates in blue colour. (need to clear it with Nordic how much of
the data In their chipset specification we can copy over to our module specification. .

Version

0.4

22Mar13 –RK re-write thoroughly. When reviewed, need to clear it with Nordic how
much of the data In their chipset specification we can copy over to our module
specification.

Version

0.5

Modify TCB Review Feedback

Single Mode BLE Module

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REVISION HISTORY

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Single Mode BLE Module

CONTENTS

Revision History .......................................................................................................................... 2

Contents ..................................................................................................................................... 3

Overview and Key Features .................................................................................................... 4 1

Specification summary .......................................................................................................... 5 2

Hardware Specifications ........................................................................................................ 7 3

Power Consumption ............................................................................................................ 11 4

Functional Description ........................................................................................................ 15 5

5.1 Power management (includes brown-out and power on reset) ..................................... 15

5.2 Clocks ........................................................................................................................................... 15

5.3 Memory for smart BASIC application code .......................................................................... 16

5.4 RF ................................................................................................................................................... 16

5.5 UART Interface ............................................................................................................................ 16

5.6 SPI Bus ........................................................................................................................................... 17

5.7 I2C Interface ............................................................................................................................... 17

5.8 General Purpose I/O and ADC ............................................................................................... 18

HW integration guide .......................................................................................................... 20 6

6.1 Circuit Components Required on Host PCB ......................................................................... 20

6.2 BL600-Sx General PCB Layout on Host PCB........................................................................... 20

6.3 BL600-SA Layout on Host PCB .................................................................................................. 20

6.4 BL600-ST Layout on Host PCB ................................................................................................... 21

Tools For development of applications ................................................................................ 22 7

Application Note for Surface Mount Modules ...................................................................... 23 8

8.1 Introduction ................................................................................................................................. 23

8.2 Shipping ....................................................................................................................................... 23

8.3 Reflow Parameters ..................................................................................................................... 24

FCC and IC Regulatory Statments ........................................................................................ 25 9

Japan (MIC) Regulatory ........................................................................................................ 29 10

CE Regulatory ...................................................................................................................... 29 11

EU DECLARATIONS OF CONFORMITY ................................................................................... 29 12

Mechanical Details .............................................................................................................. 32 13

ORDERING INFORMATION .................................................................................................... 33 14

Bluetooth SIG Approvals ...................................................................................................... 34 15

15.1 End Product Listings (EPLs) ........................................................................................................ 34

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Features & Benefits

Application Areas

 Bluetooth v4.0 - Single Mode
 External or Internal Antennas
 smart BASIC programming language
 Full Bluetooth EPL
 Compact Footprint
 Class 2 output - 4dBm
 UART, GPIO, ADC, I2C and SPI interfaces
 Fast Time to Market
 FCC, CE, IC certified and other regulatory

certifications on request

 No external components needed

 Medical devices
 Wellness devices
 iOS ‘appcessories’
 Fitness sensors
 Location Awareness
 Home automation


Single Mode BLE Module

OVERVIEW AND KEY FEATURES 1

Every BL600 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy
(BLE) to small, portable, power –conscious devices. The BL600 modules are enabled with Laird’s

smart BASIC, an event-driven programming language that enables OEMs to make their BLE

product development quicker, and simpler, significantly reducing time to market. Smart BASIC
enables customers to develop a complete embedded application inside the compact BL600
hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC or GPIO
interfaces.

Based on the world-leading Nordic Semiconductor nRF51822 chipset, the BL600 modules provide
ultra-low power consumption with outstanding wireless range via 4dBm of transmit power. A
broad range of BLE profiles including Temperature and Heart Rate are available and smart BASIC
provides the ideal mechanism to support any BLE profile development of your choice.

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Categories

Feature

Implementation

Wireless Specification

Bluetooth®

V4.0 – Single Mode
Slave (in base FW v1.1.50.0)

Frequency

2.402 - 2.480 GHz

Max Transmit Power

Min Transmit Power

TX Whisper Mode1 Transmit
Power
TX Whisper Mode2 Transmit

Power

4dBm into integrated antenna
4dBm into IPEX antenna connector

-20dBm (in 4dB steps with smart BASIC
command)

-30dBm (min) with smart BASIC
command

-55dBm (min) with smart BASIC
command

Receive Sensitivity

Better than -91 dBm (typical)

Link Budget

95 dB (@ 1 Mbps)

Range

Up to 150 m in free space

TX Whisper Modes

Range reduction (NFC like) feature with
TX Whisper Modes with sm art BASIC
command

Raw Data Rates

Up to 1Mbps (over the air)

Host Interface

TOTAL

28 x Multifunction I/O lines

UART

TX, RX, CTS, RTS
DCD, RI, DTR, DSR, CTS, RTS (Note1)
Default 9600, n,8, 1
From 1,200 to 115,200bps

GPIO

Up to 28 lines

ADC

6 lines
Up to 10 bit resolution

I2C

2 lines

SPI
3 lines (Note 2)

Profiles

Services supported
(base FW v1.1.50.0)

Heart Rate Service
Health Thermometer Service
Battery Alert Service
Blood Pressure Service
Device Information Service
Immediate Alert Service
IOPT (Interoperability)
Link Loss Service

Single Mode BLE Module

SPECIFICATION SUMMARY 2

Table 1: Detailed specifications

2.1 Specification summary

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Categories

Feature

Implementation

Transmit Power Service

Control Protocols

Any

User defined via smart BASIC

Firmware Upgrade

Base Firmware Upgrade via JTAG
interface on DVK-BL600. In Future FW,
through UART

smart BASIC App Code

upgrade

Via UART

Supply Voltage

Supply

2.1 – 3.6 V – internal DCDC converter

1.8 – 3.6 V – internal LDO

Power Consumption

Active Modes (Tx pwr
4dBm)

Advertising TBD mA peak
TBD uA Avg

Connected Mode TBD mA peak
TBD uA Avg

Ultra Low Power Modes

Standby Doze ( ) 3.5 uA
Deep Sleep 400 nA(*1)
(no RAM retention)
(*1),current silicon

1uA.

Antenna Options

Internal

Multilayer ceramic – BL600-SA

External

Connection via IPEX MH4 – BL6000-SC
Trace Pads – BL600-ST

Physical

Dimensions
Weight

19 mm x 12.5 mm x 3 mm
<1 gram

Environmental

Operating

-25 ˚C to +75 ˚C

Storage

-40 ˚C to +85 ˚C

Miscellaneous

Lead Free

Lead-free and RoHS compliant

Warranty

1 Year

Development Tools

Development Kit

Development Kit DVK-BL600-Sx and
Free Software Tools

Approvals

Bluetooth®

End Product Listing (EPL)

FCC / IC / CE / MIC

All BL600 Series

Single Mode BLE Module

Note1: DSR, DTR, RI, and DCD can be implemented in smart BASIC.
Note 2: SPI CS is controlled from smart BASIC application allowing multi-dropping.

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44 connection pads

UART GPIO ADC I2C SPI

16K RAM

256K Flash

BLE Radio

OR UFL

Internal

Antenna

ARM Cortex M0

(smartBASIC)

Pin No

Pin
Designation

Default
Function

Alternate
Function

Default
Direction

Notes

Comment

1

GND

2

SIO_1

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage
scaling

3

GND

4

SIO_2

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage
scaling

5

SIO_3

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage
scaling

6

SIO_4

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage

Single Mode BLE Module

HARDWARE SPECIFICATIONS 3

Figure 3: Functional Block Diagram

TBD

Table 2: Pin definitions

3.1 SW Block diagram

3.2 3.1 Pin Definitions

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Pin No

Pin
Designation

Default
Function

Alternate
Function

Default
Direction

Notes

Comment

scaling

7

SIO_5

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage
scaling

8

SIO_6

DIO

AIN

IN

1,2,3,4,5

8,9,10 bit resolution, Voltage
scaling

9

SIO_7

DIO

IN

1,2 10

VCC

11

GND

12

SIO_8

DIO

I2C SDA

IN

1,2,4,5,6

I2COPEN() in smart BASIC
selects I2C function

13

SIO_9

DIO

I2C SCL

IN

1,2,4,5,6

14

SIO_10

DIO

SPI MOSI

IN

1,2,4,5,6

SPIOPEN() in smart BASIC
selects SPI function, MOSI
and CLK will be outputs
when in SPI master mode

15

SIO_11

DIO

SPI MISO

IN

1,2,4,5,6

16

SIO_12

DIO

SPI CLK

IN

1,2,4,5,6
17

GND

18

SIO_13

DIO

IN

1,2 19

SIO_14

DIO

IN

1,2 20

SIO_15

DIO

IN

1,2

Laird Devkit : Buzzer output

21

SIO_16

DIO

IN

1,2

Laird Devkit : Button 0 input

22

nRESET

IN System Reset (Active low)

23

NC

DO NOT CONNECT

24

SIO_17

DIO

IN

1,2

Laird Devkit : Button 1 input

25

SIO_18

DIO

IN

1,2

Laird Devkit : LED 0

26

SIO_19

DIO

IN

1,2

Laird Devkit : LED 1

27

SIO_20

NC Reserved for future use

28

GND

29

GND

30

RF_ANT

31

GND

32

SIO_21

UART TX

DIO

OUT

1,2,4,6,7

UARTCLOSE() selects DIO
functionality and
UARTOPEN() selects uart
comms behaviour

33

SIO_22

UART RX

DIO

IN

1,2,4,6,7

34

SIO_23

UART RTS

DIO

OUT

1,2,4,6,7

35

SIO_24

UART CTS

DIO

IN

1,2,4,6,7

36

SIO_25

DIO

IN

1,2

Laird Devkit : UART_DTR via
CON12

37

GND

38

SIO_26

NC

Reserved for future use. Do
NOT connect.

39

SIO_27

NC

40

SIO_28

nAutoRUN

IN

In ONLY

Laird Devkit: UART_DSR via
CON12

Single Mode BLE Module

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Pin No

Pin
Designation

Default
Function

Alternate
Function

Default
Direction

Notes

Comment

41

SIO_29

DIO

IN

1,2

Laird Devkit : UART_DCD
via CON12

42

SIO_30

DIO

IN

1,2

Laird Devkit : UART_RI via
CON12

43

GND

44

SIO_0

DIO

IN

1,2

Parameter

Min

Max

Unit

Voltage at VCC pin

-0.3

+3.6

V

Voltage at GND pin

0 V

Voltage at SIO pin

-0.3

VCC+0.3

V

Storage temperature

-40

+85

ºC

Single Mode BLE Module

Notes: 1. Secondary function is selectable in smart BASIC BASIC application

2. DIO = Digital Input or Output

3. AIN = Analog Input

4. DIO or AIN functionality is selected using the GpioSetFunc() function in smart BASIC

5. AIN configuration selected using GpioSetFunc() function

6. I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC

7. SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up.

SIO lines can be configured through smart BASIC to be either inputs or outputs with weak or strong
pull-ups or pull-downs.

At reset, all SIO lines are configured as the defaults shown above. In other words, BL600 module
shipped form production the loaded base FW, all the SIO pins (with “default function” of “DIO”
are inputs).

UART_RX, UART_TX, UART_CTS are all 3.3 v level logic. For example, when RX and TX are idle they
will be sitting at 3.3V. Conversely for handshaking pins CTS and RTS at 0v is treated as an assertion.

Pin 40 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL600-sx) it is
connected so that the state is driven by the host’s DTR output line.

3.3 Electrical Specifications

3.3.1 Absolute Maximum ratings

Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the
Module are listed below; exceeding these values will cause permanent damage.

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Parameter

Min

Typ

Max

Unit

VCC

1.8 3 3.6 V VCC (with internal DCDC enabled)

2.1 3 3.6 V VCC rise time (0 to 1.8V) Note1

60

mS

Operating Temperature Range

-25

25

+75

ºC

Parameter

Min

Typ

Max

Unit

VIH Input high voltage

0.7VCC

VCC

V

VIL Input low voltage

VSS 3.6

V

VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA)

Note2

VCC-0.3
VCC-0.3

VCC
VCC

V
V

VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA)

VSS
VSS

0.3

0.3

V
V

Parameter

Min

Typ

Max

Unit

ADC Internal reference voltage

-1.5%

1.2V

+1.5%

%

ADC pin input
internal selectable scaling

1/1
1/3
2/3

scaling

ADC input pin voltage maximum (w.r.t scaling)
1/1
1/3
2/3

Checking
with

NORDIC

1.2
VCC/3
VCC(2/3)

V

Time required to convert single sample in
10bit mode (see note)

68 Us

Time required to convert single sample in 9bit
mode

36 us

Time required to convert single sample in 8bit
mode

20 us

Single Mode BLE Module

3.3.2 Recommended Operating Parameters

3.3.2.1 Power Supply

Note: The on-chip power-on reset circuitry may not work properly for rise times outside the

noted interval.

3.3.2.2 Signal Levels for Interface, SIO

Note: Maximum number of pins with 5mA high drive is 3.

3.3.2.3 ADC specification

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Parameter

Min

Typ

Max

Unit

Active mode (Advertising or Connection)

TX only run peak current @TXpwr= +4dBm
TX only run peak current @TXpwr= 0dBm
TX only run peak current @TXpwr= -4dBm
TX only run peak current @TXpwr= -8dBm
TX only run peak current @TXpwr= -12dBm
TX only run peak current @TXpwr= -16dBm
TX only run peak current @TXpwr= -20dBm

TX Whisper mode 1

TX only run peak current @TXpwr= -30dBm

TX Whisper mode 2

TX only run peak current @TXpwr= -55dBm

16

10.5
8
7

6.5
6

5.5

5.5

Need to
measure

mA
mA
mA
mA
mA
mA
mA

mA

Active Mode

RX only current

13

mA

Ultra Low Power Mode1 (note1)

Standby Doze

Standby Doze (UART on)

3.5

1.33mA to
be
measured
again

uA

Ultra Low Power Mode2 Note2

Deep Sleep (no RAM retention)
Deep Sleep (8kB RAM retention)
Deep Sleep (16kB RAM retention)

400
600
800

nA
nA
nA

Single Mode BLE Module

Note: Current production FW (v1.1.50.0) allows only 10bit mode.

POWER CONSUMPTION 4

4.1 Power Consumption

Note 1: In Standby Doze, all functional blocks independently are in IDLE or RUN mode

depending on needed functionality. All peripherals that are enabled stay on and

Note 2: In Deep Sleep everything is disabled and the only wake-up sources are reset and

may wake the chip again. Depending on active peripherals, current consumption will
be from ~2-3 µA up to > 1 mA. See individual peripherals current consumption in
Table xx on page.

change on pins on which sense is enabled. The current consumption is ~1000nA to
1200nA (in current Nordic silicon). Current base FW ((v1.1.50.0) allows coming out of