EVERLIGHT SA EL SMD 40BL Datasheet

Display  Surface-mount

Features

Description

Applications

ELSS-406UBWA/C470/S290

• Industrial standard size.

• Packaged in tape and reel for SMT manufacturing.

• The thickness is thinness than tradition display.

• Low power consumption.

• Categorized for luminous intensity.

• Pb free and RoHS compliant.

• The ELSS-406UBWA/C470/S290 is a 10.0mm (0.39") digit height seven-segment display.

• The display provides excellent reliability in bright ambient light.

• The device is made with white segments and gray surface.

• Home appliances

• Instrument panels

• Digital readout displays

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DATASHEET

Device Se

Absolute Maximum Ratings (Ta=25

Electro

Display  Surface-mount ELSS-406UBWA/C470/S290

lection Guide

Chip Materials Emitted Color Resin Color

InGaN Blue White Diffusion

)℃

Parameter Symbol Rating Unit

Reverse Voltage V

Forward Current I

Peak Forward Current

I

(Duty 1/10 @1KHz)

FP

Power Dissipation Pd

Operating Temperature T

Storage Temperature T

Soldering Temperature

≦(Soldering time 5 seconds)

T

F

opr

stg

sol

R

5

25

100

110

-40 ~ +105

260 ℃

V

mA

mW

℃ ℃

-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Intensity

*1

Peak Wavelength

Dominant Wavelength

Spectrum Radiation Bandwidth

Forward Voltage

Reverse Current

Iv

λp

λd

Δλ

V

I

15.0 40.5 -----

----- 468 -----

----- 470 -----

----- 35 -----

F

R

----- 3.3 3.7

----- ----- 50

mcd IF=10mA

nm IF=20mA

nm I

V I

=20mA

F

=20mA

F

μA VR=5V

Note:

1. Luminous Intensity is a average value which is measured one 7-segment.

2. Tolerance of Luminous Intensity: ± 10 ％

3. Tolerance of Forward Voltage: ± 0.1V

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DATASHEET

Bin Range of Luminous Intensity

Display  Surface-mount ELSS-406UBWA/C470/S290

Bin Code Min. Max. Unit Condition

S 15.0 24.0 T 21.0 34.0 U 30.0 48.0 V 42.0 67.0

W 59.0 94.0

mcd I

=10mA

F

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DATASHEET

Typical Electro

Display  Surface-mount ELSS-406UBWA/C470/S290

-Optical Characteristics Curves

Spectrum Distribution (Ta=25 )℃ Forward Current vs. Forward Voltage (Ta=25 )℃

Forward Current (mA)

Relative luminous intensity (％)

Wavelength λp (nm) Forward Voltage (V)

Forward Current Derating Curve

50

40

30

25

20

10

Forward Current (mA)

0

Ambient Temperature (°C )

402060 10580

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DATASHEET

Package Dimension

Display  Surface-mount ELSS-406UBWA/C470/S290

& Internal Circuit Diagram

(B) 9.8

7.6

3.8

8910 67

A

(C) 3.75

0.6

1.7

1.6

1.5

G

D

321 54

B

2.25

C

1.4

DP

0.5

1.2

REF

0.03

F

10.0

13.0

(A) 15.0

E

10-R0.7

6

.

SS406UBWA

Date Bin

2

Note: Tolerances unless mentioned ±0.25mm. Unit = mm

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DATASHEET

Packing Materials

Label Explanation

Reel Dimensions

Carrier Tape Dimensions: Loaded Quantity

Display  Surface-mount ELSS-406UBWA/C470/S290

SS406UBWA/C470/S290

CPN: Customer’s Product Number‧ P/N: Product Number‧ QTY: Pack‧ ing Quantity CAT: Luminous Intensity Rank

‧

HUE: Reference‧ REF: Reference‧

‧

LOT No: Lot Number DC: Year and Weekly

‧

REFERENCE: Volume Label code‧

E:1.75

P2:2.0

F11.5

W

R0.3

Note: Tolerances unless mentioned ±0.25mm. Unit = mm

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1000 PCS Per Reel

P0:4.0

P

D1:2.0

A1:10.2

T:0.35

D0:1.5

12.3

20°

B0:15.4

16.57

K0:4.15

7.1 A0:11.4

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DATASHEET

Packing Process

Precautions for Use

1. Soldering Condition

1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile

Note:

R

Preheat

Temperature min (T

150 °C

Temperature max (T

200°CTime (T

60

Average ramp

smax

3 °C/second max

Other

Liquidus Temperature (T

217 °C

Display  Surface-mount ELSS-406UBWA/C470/S290

1000 PCS/Roll 1 Roll/Bag

1 Bag/Small box 7 Small boxes/Box

eference: IPC/JEDEC J-STD-020D

)

smin

)

smax

smin

7

Revision : 5

to T

) (ts)

smax

-up rate (T

)

L

-120 seconds

to Tp)

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DATASHEET

Time above Liquidus Temperature (t

60

Peak Temperature (T

260

Time within 5 °C of Actual Peak Temperature: T

30 s

Ramp

6

Time 25°C to peak temperature

8 minutes max.

Reflow times

1 time

All parameters are maximum body case temperature values and cannot be considered as a soldering profile. The body

case temperature was measured by soldering a thermal couple to the soldering point of LEDs.

Application Restrictions

Display  Surface-mount ELSS-406UBWA/C470/S290

)

P

- Down Rate from Peak Temperature

1.2 (B) Recommend soldering pad

)

L

- 5°C

P

-150 seconds

°C

econds

°C/second max.

1. specification described in this document. Above specification may be changed without notice. EVERLIGHT will

reserve authority on material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in

these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the

product which does not comply with the absolute maximum ratings and the instructions included in these

specification sheets.

3. These specification sheets include materials protected under copyright of EVERLIGHT Corporation. Please don’t

reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.

4. ESD (Electrostatic Discharge)  The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.

When handling the products, the following measures against electrostatic discharge are strongly

recommended:

Eliminating the charge

Grounded wrist strap, ESD footwear, clothes, and floors

Grounded workstation equipment and tools

ESD table/shelf mat made of conductive materials

 Proper grounding is required for all devices, equipment, and machinery used in product assembly.

Surge protection should be considered when designing of commercial products.

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DATASHEET Display  Surface-mount ELSS-406UBWA/C470/S290

 If tools or equipment contain insulating materials such as glass or plastic,

the following measures against electrostatic discharge are strongly recommended:

Dissipating static charge with conductive materials

Preventing charge generation with moisture

Neutralizing the charge with ionizers

5. The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not

subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it

may cause migration resulting in LED damage.

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