EVERLIGHT LED EL SMD RGB Datasheet

Page 1
Technical Data Sheet
0.35mm Height Chip LED with Full Color 19-337/R6GHBHC-A01/2T
Features
Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow
solder process.
Full-color type. Pb-free
The product itself will remain within RoHS
compliant version.
Descriptions
The 19-337 SMD LED is much smaller
than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch. Telecommunication: indicator and backlighting in
telephone and fax.
Flat backlight for LCD, switch and symbol.General use.
Device Selection Guide
Chip
Type Material Emitted Color
R6 AlInGaN Brilliant Red GH InGaN Brilliant Green BH InGaN Blue
Resin Color
Water Clear
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 1 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 2
Package Outline Dimensions
1.6
1.6
1
2
3
1.1
4
5
6
G
Cathode mark
B R
1.0
0.35
0.8
0.350.35
0.150.15
0.6
0.4 0.4
0.5
0.6
0.5
Note: The tolerances unless mentioned is ±0.1mm,Unit = mm
0.6 0.6
0.8
0.2 0.2
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 2 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 3
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF
Peak Forward Current
IFP
(Duty 1/10 @1KHz)
Power Dissipation Pd
R6:25 GH:25 BH:25
R6:60
GH:100 BH:100
R6:60 GH:95 BH:95
mA
mA
mW
Electrostatic Discharge(HBM) ESD
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol
R6:2000
GH:150 BH:150
Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.
V
℃ ℃
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 3 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 4
Electro-Optical Characteristics (Ta=25)
Parameter Symbol Min. Typ. Max. Unit Condition
R6
Luminous Intensity
Viewing Angle 2θ1/2 ----- 120 ----- deg
Peak Wavelength
Dominant Wavelength
Iv GH
BH
R6
λp GH
BH
R6
λd GH
BH
72
112
28.5
-----
-----
100 180
50
632 518 468 624 525 470
----- mcd
----- nm
-----
nm
IF=20mA
R6
Spectrum Radiation
Bandwidth
Forward Voltage
Reverse Current
△λ GH
BH
R6 VF GH
BH
R6
IR GH
BH
-----
-----
----- -----
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1V
20 35 35
2.0
3.3
3.3
-----
2.4
3.9
3.9 10
50 50
nm
V
μA
VR=5V
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 4 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 5
Typical Electro-Optical Characteristics Curves
R6
Spectrum Distribution
Ta=25°C
I (mA)Forward Current
F
Relative luminous intensity (%)
Wavelength λ (nm)
Forward Current vs. Forward Voltage
Forward Voltage V (V)
Ta=25°C
F
Luminous Intensity vs.
Ambient Temperature
) %
(
Relative luminous intensity
Ambient Temperature Ta (°C)
Forward Current Derating Curve
I (mA)
F
Luminous Intensity vs. Forward Current
) %
(
Relative luminous intensity
Radiation Diagram
Ta=25°C
Ta=25°C
Forward Current
Ambient Temperature Ta (°C)
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 5 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 6
Typical Electro-Optical Characteristics Curves
GH
Spectrum Distribution
) %
(
Relative luminous intensity
100
75
50
25
0
400
Wavelength λ (nm)
500450
Ta=25°C
550
600
50
40
I (mA)
F
30
25 20
10
Forward Current
Forward Current vs.
Forward Voltage
0
2.6
Forward Voltage V (V)
Ta=25°C
4.53.83.0 3.4 4.2
F
Luminous Intensity vs Forward Current
f
=
1
K
H
u
D
t
y
=
100
10
1
10
Forward Current
Radiation Diagram
1.0
0.9
0.8
0.7
Ta=25°C
z
1
/
1
0
10
0.10.30.5
10
I (mA)
F
Ta=25°C
20°10°
0.40.2 0.6
30°
40°
50°
60°
70°
80° 90°
) %
(
Relative luminous intensity
I (mA)
Forward Current
Luminous Intensity vs.
1000
100
F
Ambient Temperature
10
1
-60
Ambient Temperature Ta (°C)
Forward Current Derating Curve
50
40
30 25
20
10
0
20
0
Ambient Temperature Ta (°C)
200-40 -20
40
60
)
%
(
1000
Relative luminous intensity
80 10040
85 10060
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 6 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 7
Typical Electro-Optical Characteristics Curves
BH
Spectrum Distribution
Ta=25°C
550
600
F
I (mA)
Forward Current
Relative luminous intensity (%)
100
75
50
25
0
400
450 500
Wavelength λ (nm)
Forward Current vs. Forward Voltage
50
40
30 25 20
10
0
2.6
Forward Voltage V (V)
Ta=25°C
4.23.43.0 3.8 4.5
F
1000
100
10
Relative luminous intensity (%)
1
-60
50
F
I (mA)
40
30 25
20
Forward Current
10
0
0
Luminous Intensity vs.
Ambient Temperature
-20-40 0 206040 10080
Ambient Temperature Ta (°C)
Forward Current Derating Curve
402060 10085
Ambient Temperature Ta (°C)
1000
100
10
Relative luminous intensity (%)
1.0
0.9
0.8
0.7
Luminous Intensity vs.
Forward Current
1
=
f
H
K
z
u
D
t
=
y
/
1
1
0
1
10
1
10
Forward Current I (mA)
Radiation Diagram
Ta=25°C
2
10
F
10°
0.20.10.5 0.3 0.4
Ta=25°C
20°
30°
40°
50°
60°
70°
80° 90°
0.6
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 7 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 8
Label Explanation
CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank
Pb
CPN : P
N : XXXXXXXXXXXXX
XXXXXXXXXXXXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
EVERLIGHT
MADE IN TAIWAN
RoHS
CAT : XXX HUE : XXX REF : XXX
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 8 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 9
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant Label
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 9 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 10
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below. Confidence level:90%
LTPD10%
No. Items Test Condition
Temp. : 260℃±5
1 Reflow Soldering
Max. 10sec.
H : +100 15min
2 Temperature Cycle
5 min
L : -40 15min
H : +100 5min
3 Thermal Shock
10 sec
Hours/Cycles
300 Cycles
300 Cycles
Test
6 Min.
Sample
Ac/Re
Size
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
L : -10 5min
4
High Temperature
Temp. : 100
Storage
5
Low Temperature
Temp. : -40
Storage
6 DC Operating Life IF = 20 mA
7
High Temperature /
85/ 85%RH
High Humidity
1000 Hrs.
1000 Hrs.
1000 Hrs. 1000 Hrs.
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 10 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
Page 11
Precautions For Use
1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30 or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
Above255°C 30sec.M ax.
3°C/sec.M ax.
Pre-heating 150~200°C
60~120sec.
Above 217°C
60~150sec.
260°C Max.
10sec. Max.
6°C/sec.M ax.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
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Page 12
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within
once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.
5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2 Page: 12 of 12 Device No. : DSE-0002657 Prepared date: 07-May-2010 Prepared by : Ashley Kuo
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