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LAMP
333-2UTC/S400-A6
•Popular 5mm package
•High luminous power
•Typical chromaticity coordinates x=0.29, y=0.30
according to CIE1931
•Bulk, available taped on reel.
•The product itself will remain within RoHS compliant version
•Compliance with EU REACH
•Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm)
•The series is designed for application required high luminous intensity.
•The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal white.
•Message panels
•Optical Indicators
•Backlighting
•Marker Lights
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DATASHEET
Absolute Maximum Ratings (Ta=25 )℃
LAMP
333-2UTC/S400-A6
Chip
Materials
InGaN White White clear
Parameter Symbol Rating Unit
Continuous Forward Current IF
Peak Forward Current (Duty 1/10 @ 1KHZ) IFP
Reverse Voltage VR
Power Dissipation Pd
Operating Temperature T
Storage Temperature Tstg
Zener Reverse Current I
Soldering Temperature
Emitted Color Resin Color
opr
T
sol
30
100
5
100
-40 ~ +85
-40 ~ +100
z
100 mA
260 ℃ for 5 sec.
mA
mA
V
mW
℃
℃
2
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DATASHEET
Bin Range of Luminous Intensity
Forward Voltage Combination
LAMP
333-2UTC/S400-A6
-Optical Characteristics (Ta=25 )℃
Parameter Symbol Min. Typ. Max. Unit Condition
θ1/2
2
VF
IR
VZ
IV
x
y
2.8 ----- 3.6
----- ----- 50
5.3 ----- 7.1
3600 ---- 9000
---- 15 ----
---- 0.29 ----
---- 0.30 ----
Forward Voltage
Reverse Current
Zener Reverse Voltage
Luminous Intensity
Viewing Angle
Chromaticity Coordinates
Measurement Uncertainty of Luminous Intensity: ±10%
Bin Code Min. Max. Unit Condition
Q
R
3600 4500
4500 5650
S 5650 7150
T 7150 9000
Note:
Tolerance of Luminous Intensity: ±10%
V I
uA VR=5V
V Iz=5mA
mcd I
deg IF=20mA
----
----
mcd IF=20mA
=20mA
F
=20mA
F
IF=20mA
Bin Code Min. Max. Unit Condition
0 2.8 3.0
1 3.0 3.2
2 3.2 3.4
3 3.4 3.6
Note:
Measurement Uncertainty of Forward Voltage:±0.1V
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=20mA
F
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Page 4

DATASHEET
LAMP
333-2UTC/S400-A6
Note:
1. Measurement uncertainty of the color coordinates:±0.01
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Page 5

DATASHEET
LAMP
333-2UTC/S400-A6
-Optical Characteristcs Curves
Relative Intensity vs. Wavelength (Ta=25 )℃ Directivity (Ta=25 )℃
1.0
0.8
0.6
0.4
0.2
Radiation Angle
Relative Intensity (a.u.)
0.0
350 400 450 500 550 600 650 700 750 800
Wavelength (nm) Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25 )℃ Relative Intensity vs. Forward Current (Ta=25 )℃
25
20
15
10
5
Forward Current (mA)
0
2.0 2.5 3.0 3.5 4.0 4.5
1.5
1.0
0.5
Relative Intensity(a.u.)
0.0
0 5 10 15 20 25
Chromaticity Coordinate vs. Forward Current(Ta=25 )℃
Chromaticity Coordinate
5
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Forward Voltage (V) Forward Current (mA)
Forward Current vs. Ambient Temp.
Forward Current (mA)
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DATASHEET
LAMP
333-2UTC/S400-A6
Forward Current (mA)
Ambient Temperature Ta(
℃)
Note: Note:
1.All dimensions are in millimeters, and tolerance is
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
6
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DATASHEET
Moisture Resistant Packing Materials
LAMP
333-2UTC/S400-A6
Pb
EVERLIGHT
RoHS
‧CPN: Customer’s Production Number
‧P/N : Production Number
X
‧QTY: Packing Quantity
‧CAT: Ranks of Luminous Intensity
‧HUE: Color Rank
‧ Forward Voltage
REF:
LOT No: Lot Number
‧
■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton
Pb
EL ECTROSTATIC ELECTRONAGNETIC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■ Packing Quantity
1. Min200-Max500 PCS/1 Bag, 5Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
7
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Page 8

DATASHEET
LAMP
333-2UTC/S400-A6
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more,
they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture
absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of iron
300 Max. (30W℃
Max.)
Preheat temp.
Soldering time 3 sec Max. Bath temp. & time
3mm Min.(From
Distance
solder joint to
Distance
epoxy bulb)
100 Max. (60 sec℃
Max.)
260 Max., 5 sec
Max
3mm Min. (From
solder joint to epoxy
bulb)
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DATASHEET
LAMP
333-2UTC/S400-A6
Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for
a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause
damage to the LED
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of
LED application. The current should be de-rated appropriately by referring to the de-rating
curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer
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Page 10

DATASHEET
LAMP
333-2UTC/S400-A6
to the data sheet de-rating curve.
6. Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage
rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows
through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but
current can’t flow through causing others to light down. In new design, the LED is parallel
with zener diode. if either piece of LED is no light up but current can flow through causing
others to light up.
7. ESD (Electrostatic Discharge)
The products are sensitive to static electricity or surge voltage. ESD can damage a die and
its reliability.
When handling the products, the following measures against electrostatic discharge are
strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product
assembly.
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Page 11

DATASHEET
LAMP
333-2UTC/S400-A6
Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
8. Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so
that the
LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is
continuously
applied to the LEDs, it may cause migration resulting in LED damage.
9. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
When using this product, please observe the absolute maximum ratings and the
instructions for using outlined in these specification sheets. EVERLIGHT assumes no
responsibility for any damage resulting from use of the product which does not comply
with the absolute maximum ratings and the instructions included in these specification
sheets.
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
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