EVERLIGHT LED EL 5-14250WW Datasheet

Page 1
LAMP
Features
Description
Applications
• Popular T-1 3/4 round package
• High luminous power
• Typical chromaticity coordinates x=0.40, y=0.39 according to CIE1931
• Bulk, available taped on reel.
• ESD-withstand voltage: up to 4KV
• The product itself will remain within RoHS compliant version
• Compliance with EU REACH
• Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm)
• The series is designed for application required high luminous intensity.
• The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal warm white.
• Message panels
• Optical Indicators
• Backlighting
• Marker Lights
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Page 2
DATASHEET
Device Selection Guide
Absolute Maximum Ratings (Ta=25
Electro
LAMP 334-15/X1C3-1TVA
Chip
Materials
Emitted Color Resin Color
InGaN Warm White Water Clear
)
Parameter Symbol Rating Unit
Continuous Forward Current I
Peak Forward Current (Duty 1/10 @ 1KHZ) I
Reverse Voltage V
Power Dissipation P
Operating Temperature T
Storage Temperature T
ESD ESD
Zener Reverse Current I
Soldering Temperature
T
FP
F
opr
stg
z
sol
R
d
HBM
30
100
5
110
-40 ~ +85
-40 ~ +100
4K
100 mA
260 for 5 sec.
mA
mA
V
mW
℃ ℃
V
-Optical Characteristics (Ta=25 )
Parameter Symbol Min. Typ. Max. Unit Condition
Forward Voltage
Zener Reverse Voltage
Reverse Current
Luminous Intensity
Viewing Angle
Chromaticity Coordinates
θ1/2
2
V
Vz
I
I
x
y
F
2.8 ----- 3.6
5.2 ----- -----
R
V
----- ----- 50
7150 ---- 14250
---- 30 ----
---- 0.40 ----
---- 0.39 ----
V I
V Iz=5mA
μA VR=5V
mcd I
deg IF=20mA
----
----
=20mA
F
=20mA
F
I
=20mA
F
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Page 3
DATASHEET
Bin Range of Luminous Intensity
Forward Voltage Combination
Color Combination ( at 20mA)
LAMP 334-15/X1C3-1TVA
Bin Code Min. Max. Unit Condition
T 7150 9000
U 9000 11250
V 11250 14250
Note: Tolerance of Luminous Intensity: ±10%
Bin Code Min. Max. Unit Condition
0 2.8 3.0
1 3.0 3.2
2 3.2 3.4
3 3.4 3.6
Note:
Measurement Uncertainty of Forward Voltage±0.1V
mcd I
V I
=20mA
F
=20mA
F
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Group Bins
1 D1+D2+E1+E2+F1+F2
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Page 4
DATASHEET
CIE Chromaticity Diagram
Color Ranks (I
CIE-Y
LAMP 334-15/X1C3-1TVA
1.0
0.8
0.6
0.4
4600K
D2
3200K
3800K
E1
D1
E2
2500K
F1
F2
0.2
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
CIE-X
=20mATa=25)
F
Color Ranks CIE
D1
D2
E1
E2
X 0.357 0.361 0.398 0.389
Y 0.361 0.385 0.411 0.382
X 0.354 0.357 0.389 0.382
Y 0.340 0.361 0.382 0.358
X 0.389 0.398 0.439 0.425
Y 0.382 0.411 0.431 0.400
X 0.382 0.389 0.425 0.412
Y 0.358 0.382 0.400 0.372
F1
F2
Note:
Measurement uncertainty of the color coordinates±0.01
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X 0.425 0.439 0.497 0.477
Y 0.400 0.431 0.466 0.413
X 0.412 0.425 0.477 0.458
Y 0.372 0.400 0.413 0.383
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Page 5
DATASHEET
100
Typical Electro
-
Optical Characteristics Curves
LAMP 334-15/X1C3-1TVA
Relative Intensity vs. Wavelength (Ta=25 ) Directivity (Ta=25 )
1.0
O
O
0.8
0.6
0.4
0.2
90
1.0
0.5
Radiation Angle
O
60
Relative Intensity (a.u.)
0.0 350 400 450 500 550 600 650 700 750 800
0
Wavelength (nm) Relative Intensity (a.u.)
Forward Current vs. Forward Voltage (Ta=25 ) Relative Intensity vs. Forward Current (Ta=25 )
O
30
O
0
10
O
20
O
30
0
0.5
O
40
O
50
O
60
O
70
O
80
O
90
1.0
30
25
20
15
10
5
Forward Current (mA)
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5
Forward Voltage (V) Forward Current (mA)
Chromaticity Coordinate vs. Forward Current(Ta=25 )
0.420
0.410
0.400
0.390
x
y
1.5
1.0
0.5
Relative Intensity(a.u.)
0.0 0 5 10 15 20 25
Forward Current vs. Ambient Temp.
40
30
20
0.380
0.370
Chromaticity Coordinate
0.360 0 10 20 30 40 50
Forward Current (mA)
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Forward Current (mA)
0
0 20 40 60 80
Ambient Temperature Ta(
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)
Page 6
DATASHEET
Package Dimension
LAMP 334-15/X1C3-1TVA
Note: Note:
1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
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Page 7
DATASHEET
Moisture Resistant Packing Materials
Label Explanati
Packing Specification
LAMP 334-15/X1C3-1TVA
on
CPN: Customer’s Production NumberP/N : Production NumberQTY: Packing QuantityCAT: Ranks of Luminous Intensity and Forward VoltageHUE: Color Rank
REF: Reference LOT No: Lot Number
Anti-electrostatic bag Inner Carton Outside Carton
Pb
EL ECTROSTATIC ELECTRONAGNETIC MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
Packing Quantity
1. Min 200 to Max 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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Page 8
DATASHEET
Notes
LAMP 334-15/X1C3-1TVA
Production Designation
334-15/X1C3-□ □ □ □
Voltage Group
Luminous Intensity Bins
Color Group
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s
characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of
the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED.
If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade
the LEDs.
2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the
storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a
sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where
condensation can occur.
3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to
epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
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Hand Soldering DIP Soldering
300 Max. (30W
Temp. at tip of iron
Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From
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Max.)
solder joint to epoxy bulb)
Preheat temp.
Distance 3mm Min. (From solder
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100 Max. (60 sec
Max.)
joint to epoxy bulb)
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DATASHEET LAMP 334-15/X1C3-1TVA
Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when
soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the
LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the
lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time
in the solder wave.
4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no
more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning
on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning
shall be pre-qualified to ensure this will not cause damage to the LED
5. Circuit Protection Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the
zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep
the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through
causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no
light up but current can flow through causing others to light up.
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Page 10
DATASHEET LAMP 334-15/X1C3-1TVA
6. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The
current should be de-rated appropriately by referring to the de-rating curve found in each product
specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet
de-rating curve.
7. ESD (Electrostatic Discharge) The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly
recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
8. Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not
subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it
may cause migration resulting in LED damage.
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Preventing charge generation with moisture
Neutralizing the charge with ionizers
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Page 11
DATASHEET LAMP 334-15/X1C3-1TVA
9. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for
above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined
in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of
the product which does not comply
with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please
don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
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