EVERLIGHT LED EL 3-7150WS Datasheet

LAMP 204-15UTC/S400-X9

Features

• Popular T-1 round package

• High luminous power

• Typical chromaticity coordinates x=0.29, y=0.28 according to CIE1931

• Bulk, available taped on reel.

• ESD-withstand voltage: up to 4KV

• The product itself will remain within RoHS compliant version

Description

• The series is designed for application required high luminous intensity.

• The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal white.

Applications

• Message panels

• Optical Indicators

• Backlighting

• Marker Lights

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Device Selection Guide

Chip

Materials

Emitted Color Resin Color

InGaN White Water Clear

Absolute Maximum Ratings (Ta=25 )℃

Parameter Symbol Rating Unit

Continuous Forward Current I

Peak Forward Current (Duty 1/10 @ 1KHZ) I

Reverse Voltage V

Power Dissipation P

Operating Temperature Topr

Storage Temperature Tstg

ESD ESD

Zener Reverse Current I

Soldering Temperature

Tsol 260

FP

F

R

d

z

HBM

30

100

5

110

-40 ~ +85

-40 ~ +100

4K

100 mA

℃ for 5 sec.

mA

V

mW

℃ ℃

V

Electro-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Forward Voltage

Zener Reverse Voltage

Reverse Current

Luminous Intensity

Viewing Angle

Chromaticity Coordinates

V

F

Vz

I

R

I

V

2θ1/2

x

y

2.8 ----- 3.6

5.2 ----- -----

----- ----- 50

2850 ---- 7150

---- 25 ----

---- 0.29 ----

---- 0.28 ----

V I

=20mA

F

V Iz=5mA

μA VR=5V

mcd I

deg I

----

=20mA

F

=20mA

F

I

=20mA

F

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Bin Range of Luminous Intensity

Bin Code Min. Max. Unit Condition

G2 2850 3600 H1 3600 4500 H2 4500 5650

J1 5650 7150

Note: Tolerance of Luminous Intensity: ±10%

Forward Voltage Combination

Bin Code Min. Max. Unit Condition

mcd I

=20mA

F

0 2.8 3.0 1 3.0 3.2 2 3.2 3.4 3 3.4 3.6

Note:

Measurement Uncertainty of Forward Voltage：±0.1V

V I

=20mA

F

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CIE Chromaticity Diagram

0.90

520

0.80

0.70

0.60

550

570

500

0.50

0.40

CIE (Y)

0.30

D

600

C

0.20

480

B

A

0.10

470

0.00

0.10 0.30 0.50 0.700.00 0.20 0.40 0.60 0.80

CIE (X)

Color Ranks (IF=20mA，Ta=25℃)

Color Ranks

A1

A2

B1

B2

C1

C2

D1

D2

Note:

Measurement uncertainty of the color coordinates：±0.01

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Min. Max. Min. Max.

0.215 0.245 0.155 0.215

0.245 0.260 0.185 0.245

0.260 0.275 0.215 0.275

0.275 0.290 0.245 0.295

0.290 0.305 0.275 0.315

0.305 0.320 0.295 0.335

0.320 0.340 0.315 0.355

0.340 0.360 0.335 0.385

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CIE Y

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DATASHEET

100

LAMP 204-15UTC/S400-X9

Typical Electro-Optical Characteristics Curves

Relative Intensity vs. Wavelength (Ta=25 )℃ Directivity (Ta=25 )℃

1.0

0.8

0.6

0.4

1.0

0.5

O

90

O

60

O

30

O

0

10

O

20

O

30

O

40

O

50

60

Radiation Angle

Relative Intensity (a.u.)

0.2

0.0 350 400 450 500 550 600 650 700 750 800

0

0.5

Wavelength (nm) Relative Intensity (a.u.)

Forward Current vs. Forward Voltage (Ta=25 )℃ Relative Intensity vs. Forward Current (Ta=25 )℃

30

25

20

15

1.5

1.0

O

70

1.0

O

80

O

90

10

5

Forward Current (mA)

0

1.5 2.0 2.5 3.0 3.5 4.0 4.5

Forward Voltage (V) Forward Current (mA)

Chromaticity Coordinate vs. Forward Current(Ta=25 )℃

0.300

0.290

x

y

0.280

0.270

Chromaticity Coordinate

0.260 0 10 20 30 40 50

0.5

Relative Intensity(a.u.)

0.0 0 5 10 15 20 25

Forward Current vs. Ambient Temp.

40

30

20

10

Forward Current (mA)

0

0 20 40 60 80

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Forward Current (mA)

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Ambient Temperature Ta(

Expired Period: Forever

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Package Dimension

Note: Note:

1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.

2.Lead spacing is measured where the lead emerges from the package.

3.Protruded resin under flange is 1.5mm Max. LED.

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Moisture Resistant Packing Materials

Label Explanation

‧CPN: Customer’s Production Number ‧P/N : Production Number ‧QTY: Packing Quantity ‧CAT: Ranks of Luminous Intensity and Forward Voltage ‧HUE: Color Rank ‧

REF: Reference LOT No: Lot Number‧

Packing Specification

■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton

Pb

EL ECTROSTATIC ELECTRONAGNETIC MAGNETIC OR RADIOACTIVE RELDS

anti-static for 750

■ Packing Quantity

1. Min 200 to Max 1000 PCS/1 Bag, 5 Bags/1 Inner Carton

2. 10 Inner Cartons/1 Outside Carton

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Notes

1. Lead Forming

 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

 Lead forming should be done before soldering.

 Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s

characteristics or it may break the LEDs.

 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of

the LEDs.

 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED.

If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade

the LEDs.

2. Storage  The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the

storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a

sealed container with a nitrogen atmosphere and moisture absorbent material.

 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where

condensation can occur.

3. Soldering  Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to

epoxy bulb, and soldering beyond the base of the tie bar is recommended.

 Recommended soldering conditions:

Hand Soldering DIP Soldering

300 Max. (30W

Temp. at tip of iron

Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From

 Recommended soldering profile

℃

Max.)

solder joint to epoxy bulb)

Preheat temp.

Distance 3mm Min. (From solder

laminar wave

100 Max. (60 sec

℃

Max.)

joint to epoxy bulb)

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 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when

soldering.

 Dip and hand soldering should not be done more than one time

 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the

LEDs return to room temperature.

 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

 Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the

lowest possible temperature is desirable for the LEDs.

 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time

in the solder wave.

4. Cleaning  When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no

more than one minute. Dry at room temperature before use.

 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning

on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning

shall be pre-qualified to ensure this will not cause damage to the LED

5. Circuit Protection  Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the

zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep

the voltage at exactly Vz.

 When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through

causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no

light up but current can flow through causing others to light up.

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6. Heat Management  Heat management of LEDs must be taken into consideration during the design stage of LED application. The

current should be de-rated appropriately by referring to the de-rating curve found in each product

specification.

 The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet

de-rating curve.

7. ESD (Electrostatic Discharge)

 Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

 An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

 All devices, equipment and machinery must be properly grounded.

 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as

a result of friction between LEDs during storage and handing.

8. Other  Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for

above specification.

 When using this product, please observe the absolute maximum ratings and the instructions for using outlined

in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of

the product which does not comply

with the absolute maximum ratings and the instructions included in these specification sheets.

 These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please

don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.

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