EVERLIGHT HIR 7373B-L289 Datasheet

5mm Infrared LED HIR7373B/L289

Features

․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version.

Description

․EVERLIGHT’s Infrared Emitting Diode (HIR7373B/L289) is a high intensity diode , molded in a black plastic package. ․The device is spectrally matched with phototransistor , photodiode and infrared receiver module.

Applications

․Infrared applied system

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DATASHEET

5.0mm Infrared LED HIR7373B/L289

Device Selection Guide

Chip

Materials

Lens Color

GaAlAs Black

Absolute Maximum Ratings (Ta=25 )℃

Parameter Symbol Rating Unit

Continuous Forward Current I

Peak Forward Current(*1) I

Reverse Voltage V

Operating Temperature T

Storage Temperature T

Soldering Temperature(*2) T

F

FP

R

opr

stg

sol

Power Dissipation at (or below)

P

25℃Free Air Temperature

d

Notes: *1:IFP Conditions--Pulse Width≦100μs and Duty≦1%.

*2:Soldering time

≦5 seconds.

100

1.0

5

-40 ~ +85

-40 ~ +100

260

150

mA

A

V

℃ ℃ ℃

mW

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DATASHEET

5.0mm Infrared LED HIR7373B/L289

Electro-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

I

=20mA

Radiant Intensity

I

e

21 40 -----

mW/sr

----- 200 -----

F

=100mA

I

F

Peak Wavelength

Spectral Bandwidth

Forward Voltage

Reverse Current

View Angle

λp

Δλ

VF

I

R

2θ1/2

----- 850 -----

----- 45 -----

----- 1.45 1.6

----- 1.80

2.4

---- ---- 10

---- 25 ----

nm I

V

uA V

deg I

=20mA

F

=20mA

F

I

=20mA

F

I

=100mA

F

=5V

R

=20mA

F

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5.0mm Infrared LED HIR7373B/L289

Typical Electro-Optical Characteristics Curves

Forward Current vs. Ambient Temperature Spectral Distribution

140 120

100

80

100

80 60

40 20

0

-40 -20 40200 60 10080

Peak Emission Wavelength vs. Ambient Temperature Forward Current vs. Forward Voltage

60

40

20

0

790

810 830 850

870 890910 930 950

IF=20mA Ta=25° C

900

875

850

825

800

-25

4

10

3

10

2

10

1

10

0

25

50

75

100

0

21 3 4 5 6 7 8

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5.0mm Infrared LED HIR7373B/L289

Radiant Intensity vs. Forward Current Relative Radiant Intensity vs. Angular Displacement

1000

100

10

Ie-Radiant Intensity(mW/sr)

0

10

0

10

IF-Forward Current (mA)

2 3

10110

10

-20

-10

0 2010

30

1.0

0.9

0.8

0.7

40

50 60 70

80

4

0.6

0.20.4 0 0.2 0.4 0.6

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5.0mm Infrared LED HIR7373B/L289

Package Dimension

Note: Tolerances unless dimensions ±0.25mm

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5.0mm Infrared LED HIR7373B/L289

Label Form Specification

Pb

HIR7373B/L289

EVERLIGHT

RoHS

CPN: Customer’s Product Number‧ P/N: Product Number‧

X

QTY: Packing Quantity‧ CAT: Luminous Intensity Rank‧ HUE: Dom. Wavelength Rank‧ REF: Forward Voltage Rank‧ LOT No: Lot Number

‧ ‧X: Month

Reference: Identify Label Number

‧

Packing Specification

■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton

■ Packing Quantity

1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton

2. 10 Inner Cartons/1 Outside Carton

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5.0mm Infrared LED HIR7373B/L289

Notes

1. Lead Forming

 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

 Lead forming should be done before soldering.

 Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it

may break the LEDs.

 Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.

 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs

are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

2. Storage  The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits

are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a

nitrogen atmosphere and moisture absorbent material.

 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can

occur.

3. Soldering  Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,

and soldering beyond the base of the tie bar is recommended.

 Recommended soldering conditions:

Hand Soldering DIP Soldering

300

Temp. at tip of iron Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder

 Recommended soldering profile

Fluxing

℃ Max. (30W Max.)

joint to epoxy bulb)

Prehead

Preheat temp.

Distance 3mm Min. (From solder

laminar wave

100

℃ Max. (60 sec Max.)

joint to epoxy bulb)

 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.

 Dip and hand soldering should not be done more than one time

 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to

room temperature.

 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

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5.0mm Infrared LED HIR7373B/L289

Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest

possible temperature is desirable for the LEDs.

 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder

wave.

4. Cleaning  When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than

one minute. Dry at room temperature before use.

 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs

depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to

ensure this will not cause damage to the LED

5. Heat Management  Heat management of LEDs must be taken into consideration during the design stage of LED application. The current

should be de-rated appropriately by referring to the de-rating curve found in each product specification.

 The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating

curve.

6. ESD (Electrostatic Discharge)

 Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.

 An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.

 All devices, equipment and machinery must be properly grounded.

 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of

friction between LEDs during storage and handing.

7. Other  Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above

specification.

 When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these

specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does

not comply

with the absolute maximum ratings and the instructions included in these specification sheets.

 These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t

reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.

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EVERLIGHT HIR 7373B-L289 Datasheet

Specifications and Main Features

Frequently Asked Questions

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