EVERLIGHT EVL 19-21SDRC Datasheet

EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet
0603 Package Chip LED (0.8 mm Height)

19-21SDRC/S530-XX/TR8

Features

․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.
․Pb-free.
․The product itself will remain within ROHS complaint version.

Descriptions

․The 19-21 SMD LED is much smaller than lead

frame type components, thus enable smaller
board size, higher packing density, reduced
storage space and finally smaller equipment to be
obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Automotive: backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.
․General use.

Device Selection Guide

Part No.

Material Emitted Color

19-21SDRC/S530-XX/TR8 AlGaInP

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

Chip

Dark-Red

Lens Color

Water Clear

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Package Outline Dimensions

19-21SDRC/S530-XX/TR8

-

+

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

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19-21SDRC/S530-XX/TR8

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR 5 V
Forward Current IF 25 mA

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40~ +90 ℃

Electrostatic Discharge(HBM) ESD 2000 V

Power Dissipation Pd 60 mW

Peak Forward Current

IFP 60 mA

(Duty 1/10 @1KHz)

Reflow Soldering : 260 ℃ for 10 sec.

Soldering Temperature Tsol

Hand Soldering : 350 ℃ for 3 sec.

Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol

Min. Typ. Max. Unit Condition

Rank

A2 15 27 ----­A3 25 33 -----

*Chip

Luminous Intensity Iv

Viewing Angle 2θ1/2 ----- ----- 100 ----- deg

Peak Wavelength λp ----- ----- 650 ----- nm

Dominant Wavelength

Spectrum Radiation

Bandwidth

Forward Voltage VF

Reverse Current IR ----- ----- -----

λd ----- ----- 639 ----- nm

△λ ----- -----

A4 30 40 ----­A5 40 50 ----­A6 50 60 -----

20 -----

----- 1.7 2.0 2.4
10

mcd

nm

V

μA

IF=20 mA

VR=5V

*19-21SDRC/S530-XX/TR8

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

Chip Rank

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Typical Electro-Optical Characteristics Curves

19-21SDRC/S530-XX/TR8

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Label explanation

CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank

Reel Dimensions

19-21SDRC/S530-XX/TR8

xxxxxx
xxxxxx

RoHS

xxxxxxxxxxxx

xxxx

xxxxxxxx

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

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19-21SDRC/S530-XX/TR8

Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

Moisture Resistant Packaging

Label

Aluminum moistue-proof bag

LabelDesiccant

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

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19-21SDRC/S530-XX/TR8

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.
Confidence level：90%

LTPD：10%

No. Items Test Condition

Temp. : 260℃±5℃

1 Reflow Soldering

Min. 5sec.

H : +100℃ 15min

2 Temperature Cycle

∫ 5 min

L : -40℃ 15min

H : +100℃ 5min

3 Thermal Shock

∫ 10 sec

L : -10℃ 5min

Hours/Cycles

300 Cycles

300 Cycles

Test

6 Min.

Sample

Ac/Re

Size

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

4

High Temperature

Temp. : 100℃

Storage

5

Low Temperature

Temp. : -40℃

Storage

6 DC Operating Life IF = 20 mA

7

High Temperature /

85℃/ 85%RH

High Humidity

1000 Hrs.

1000 Hrs.

1000 Hrs.
1000 Hrs.

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

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19-21SDRC/S530-XX/TR8

Precautions For Use

1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali

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E

19-21SDRC/S530-XX/TR8

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and
do soldering of each terminal. Be careful because the damage of the product is often started at the time
of the hand solder.

5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used (as below figure). It should be confirmed beforehand
whether the characteristics of the LEDs will or will not be damaged by repairing.

VERLIGHT ELECTRONICS CO., LTD. Tel: [phone]

Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: [phone]
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com

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Device No:SZDSE-191-009 Prepared date: 20-Aug-2005 Prepared by: Meng Yali