Page 1
Technical Data Sheet
0603 Package Chip LED (0.6 mm Height)
19-213/BHC-AP1Q2/3T
Features
․Package in 8mm tape on 7 〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS complaint version
Descriptions
․ The 19-213 SMD LED is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
․ Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide
Part No.
19-213/BHC-AP1Q2/3T InGaN Blue Water Clear
Chip
Emitted Color Resin Color
Material
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 1 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 2
Package Outline Dimensions
19-213/BHC-AP1Q2/3T
-
+
Note: The tolerances unless mentioned is ± 0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 2 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 3
19-213/BHC-AP1Q2/3T
Absolute Maximum Ratings (Ta=25℃ )
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
Peak Forward Current
IFP 100 mA
(Duty 1/10 @1KHz)
Power Dissipation Pd 95 mW
Electrostatic Discharge(HBM) ESD 150 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Reflow Soldering : 260 ℃ for 10 sec.
Soldering Temperature Tsol
Hand Soldering : 350 ℃ for 3 sec.
℃
℃
Electro-Optical Characteristics (Ta=25 ℃)
Parameter Symbol Min. Typ. Max. Unit Condition
Luminous Intensity Iv 45 ----- 112 mcd
Viewing Angle 2θ 1/2 ----- 120 ----- deg
Peak Wavelength λp ----- 468 ----- nm
Dominant Wavelength
λ d
Spectrum Radiation
Bandwidth
Forward Voltage VF
Reverse Current IR ----- ----- 50 μA
△λ ----- 25 ----- nm
464.5 ----- 476.5
2.70 3.30 3.70
nm
V
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ± 1nm
IF =20mA
VR =5V
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 3 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 4
19-213/BHC-AP1Q2/3T
Bin Range Of Dom. Wavelength
Group Bin Min Max Unit Condition
A9 464.5 467.5
A
A10 467.5 470.5
A11 470.5 473.5
A12 473.5 476.5
Bin Range Of Luminous Intensity
Bin Min Max Unit Condition
P1 45.0 57.0
P2 57.0 72.0
Q1 72.0 90.0
Q2 90.0 112.0
nm IF=20mA
mcd IF=20mA
Notes:
1. Tolerance of Luminous Intensity ±11%
2. Tolerance of Dominant Wavelength ± 1nm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 4 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 5
Typical Electro-Optical Characteristics Curves
Ta=25°C
)
%
(
Forward Current I (mA)
Relative luminous intensity
Wavelength λ(nm)
1000
%)
(
)
%
(
19-213/BHC-AP1Q2/3T
Ta=25°C
Forward Voltage V (V)
F
Ta=25°C
100
10
Relative luminous intensity
I (mA)
Forward Current
1
-60
-20 -40 0 206040
Ambient Temperature T (°C
Ambient Temperature T (°C
100 80
)
a
)
a
Relative luminous intensity
1.0
0.9
0.8
0.7
Forward Current I (mA)
10° 20°
0°
0.5 0.3 0.1
Ta=25°C
30°
40°
50°
60°
70°
80°
90°
0.6 0.2 0.4
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 5 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 6
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
19-213/BHC-AP1Q2/3T
Note: The tolerances unless mentioned is ± 0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 6 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 7
19-213/BHC-AP1Q2/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant Label
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 7 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 8
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD: 10%
No. Items Test Condition
Hours/Cycles
Temp. : 260℃±5℃
1 Reflow Soldering
Min. 5sec.
6 Min.
H : +100℃ 15min
2 Temperature Cycle
∫ 5 min
300 Cycles
L : -40℃ 15min
H : +100℃ 5min
3 Thermal Shock
∫ 10 sec
300 Cycles
L : -10℃ 5min
19-213/BHC-AP1Q2/3T
Test
Sample
Ac/Re
Size
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
4
High Temperature
Temp. : 100℃
Storage
5
Low Temperature
Temp. : -40℃
Storage
6 DC Operating Life IF = 20 mA
7
High Temperature /
85℃ / 85%RH
High Humidity
1000 Hrs.
1000 Hrs.
1000 Hrs.
1000 Hrs.
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
22 PCS. 0/1
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 8 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 9
19-213/BHC-AP1Q2/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 9 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin
Page 10
19-213/BHC-AP1Q2/3T
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of
the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 10 of 10
Device No: DSE-0002142 Prepared date: 25-Aug-2009 Prepared by: Huangyongxin