Page 1
Technical Data Sheet
0402 Package Chip LED (0.2mm Height)
16-219A/R6C-AM1N2BY/3T
Features
․Package in 8mm tape on 7〞 diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS
compliant version.
․ The maximum height is 0.25mm
Descriptions
․ The 16-219A SMD LED is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
․ Besides, lightweight makes them ideal for
miniature applications. etc
Applications
․ Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General
Device Selection Guide
16-219A/R6C-AM1N2BY/3T
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.4 Page: 1 of 11
Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
Revision : 4
Part No.
Chip
Material Emitted Color
AlGaInP
Brilliant Red Water Clear
Release Date:2012-10-01 13:44:05.0
Resin Color
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Package Outline Dimensions
16-219A/R6C-AM1N2BY/3T
Note: The tolerances unless mentioned is ± 0.1mm ,Unit = mm
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 3
Absolute Maximum Ratings (Ta=25 )℃
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
16-219A/R6C-AM1N2BY/3T
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation Pd 60 mW
Electrostatic Discharge(HBM) ESD 2000 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol
IFP 60 mA
℃
℃
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 4
Electro-Optical Characteristics (Ta=25 )℃
Parameter Symbol Min. Typ. Max. Unit Condition
16-219A/R6C-AM1N2BY/3T
Luminous Intensity
Viewing Angle 2θ 1/2 ----
Iv 18.0 ---- 45.0
120 -----
Peak Wavelength λ p ---- 632 ----- nm
Dominant Wavelength
Bandwidth
Forward Voltage VF
λd
△λ
617.5
---- 20 -----
1.75 ----- 2.35
---- 633.5
Reverse Current IR ---- ----- 10 μ A
Note :
1.Tolerance of Luminous Intensity ± 11%
2.Tolerance of Dominant Wavelength ± 1nm
3.Tolerance of Forward Voltage ± 0.1V
mcd
deg
nm
nm
V
I
F=5mA
VR =5V
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Bin Range Of Luminous Intensity
Bin Min Max Unit Condition
M1 18.0 22.5
16-219A/R6C-AM1N2BY/3T
M2 22.5 28.5
N1 28.5 36.0
N2 36.0 45.0
mcd I
Bin Range Of Dom. Wavelength
Group Bin Min Max Unit Condition
E4 617.5 621.5
A
E5 621.5 625.5
nm IF=5mA
E6 625.5 629.5
E7 629.5 633.5
Bin Range Of Forward Voltage
Group Bin Min Max Unit Condition
0 1.75 1.95
B
1 1.95 2.15
nm IF=5mA
F=5mA
2 2.15 2.35
Note :
1.Tolerance of Luminous Intensity ± 11%
2.Tolerance of Dominant Wavelength ± 1nm
3.Tolerance of Forward Voltage ± 0.1V
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Typical Electro-Optical Characteristics Curves
16-219A/R6C-AM1N2BY/3T
Spectrum Distribution
Ta=25°C
I (mA)
F
Forward Current
Relative luminous intensity (%)
Wavelength λ (nm)
Luminous Intensity vs.
Ambient Temperature
% )
% )
(
(
Forward Current vs.
Forward Voltage
Forward Voltage V (V)
Luminous Intensity vs.
Forward Current
Ta=25°C
F
Ta=25°C
Relative luminous intensity
Ambient Temperature Ta (°C)
Forward Current Derating Curve
I (mA)
F
Forward Current
Ambient Temperature Ta (°C)
Relative luminous intensity
Radiation Diagram
Ta=25°C
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 7
Label Explanation
16-219A/R6C-AM1N2BY/3T
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Pb
CPN :
N : XXXXXXXXXXXXX
P
XXXXX XXXXXXXX
QTY : XXX
LOT NO : XXXXXX XXXX
Reference : XXXXXXXX
EVERLIGHT
MADE IN TAIWAN
RoHS
CAT : XXX
HUE : XXX
REF : XXX
Note: The tolerances unless mentioned is ± 0.1mm ,Unit = mm
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 8
16-219A/R6C-AM1N2BY/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ± 0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant Label
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 9
16-219A/R6C-AM1N2BY/3T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level
LTPD: 10%
: 90%
No. Items Test Condition
Temp. : 260
℃± 5℃
1 Reflow Soldering
Max. 10sec.
℃ 15min
∫ 5 min
℃ 15min
℃ 5min
∫ 10 sec
℃ 5min
℃
2 Temperature Cycle
3 Thermal Shock
High Temperature
4
H : +100
L : -40
H : +100
L : -10
Temp. : 100
Storage
5
Low Temperature
Temp. : -40
℃
Storage
6 DC Operating Life IF = 20 mA
Test
Hours/Cycles
6 Min.
300 Cycles
300 Cycles
1000 Hrs.
1000 Hrs.
1000 Hrs.
Sample
Ac/Re
Size
22 PCS.
0/1
22 PCS. 0/1
22 PCS. 0/1
22 PCS.
22 PCS.
0/1
0/1
22 PCS. 0/1
7
High Temperature /
85
℃ / 85%RH
1000 Hrs.
22 PCS.
0/1
High Humidity
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 10
16-219A/R6C-AM1N2BY/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60± 5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
Above255°C
30sec.M ax.
3°C/sec.M ax.
Pre-heating
150~200°C
60~120sec.
Above 217°C
60~150sec.
260°C M ax.
10sec. Max.
6°C/sec.M ax.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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Page 11
16-219A/R6C-AM1N2BY/3T
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within
once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering
of each terminal. Be careful because the damage of the product is often started at the time of the hand
solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com
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Device No. : DSE-0000570 Prepared date:25-Sep-2012 Prepared by: Jack Chiu
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