EVERLIGHT EVL 16-213/BHC Datasheet

EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet

0402 Package Chip LED (0.45mm Height)

Features

․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS

compliant version.

Descriptions

․The 16-213 SMD Taping is much smaller than

lead frame type components, thus enable smaller
board size, higher packing density, reduced
storage space and finally smaller equipment to be
obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.
․General use.
․Indoor signboard use.

16-213/BHC-AN1P2/3T

Device Selection Guide

Part No.

16-213/BHC-AN1P2/3T

Material Emitted Color

InGaN Blue Water Clear

Chip

Lens Color

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EVERLIGHT ELECTRONICS CO.,LTD.

16-213/BHC-AN1P2/3T

Package Outline Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

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16-213/BHC-AN1P2/3T

Absolute Maximum Ratings (Ta=25℃)

Parameter

Reverse Voltage VR 5 V
Forward Current IF 25 mA

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40 ~ +90 ℃

Soldering Temperature Tsol 260 (for 5 seconds) ℃

Electrostatic Discharge (HBM) ESD 150 V

Power Dissipation Pd 110 mW

Peak Forward Current

(Duty 1/10 @1KHz)

Soldering Temperature Tsol

Symbol Rating Unit

IFP 100 mA

Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

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16-213/BHC-AN1P2/3T

Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Intensity

Peak Wavelength

Dominant

Wavelength

Spectrum Radiation

Bandwidth

Viewing Angle

Forward Voltage

Reverse Current

Iv 28.5 ---- 72.0

λp

λd

△λ

2θ1/2

VF

---- 468 ----

464.5 ---- 476.5

---- 35 ----

---- 120 ----

2.7 3.3 3.7

IR ---- ---- 50

Notes:

1.Tolerance of Luminous Intensity ±10%

2.Tolerance of Dominant Wavelength ±1nm

mcd

nm

nm

nm

deg

V

μA

IF=20mA

VR=5V

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16-213/BHC-AN1P2/3T

Bin Range Of Dom. Wavelength

Group Bin Min Max Unit Condition

A9 464.5 467.5

A

A10 467.5 470.5
A11 470.5 473.5
A12 473.5 476.5

Bin Range Of Luminous Intensity

Bin Min Max Unit Condition

N1 28.5 36.0
N2 36.0 45.0

P1 45.0 57.0
P2 57.0 72.0

Notes:

1.Tolerance of Luminous Intensity ±10%

2.Tolerance of Dominant Wavelength ±1nm

nm IF=20mA

mcd IF=20mA

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16-213/BHC-AN1P2/3T

Typical Electro-Optical Characteristics Curves

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16-213/BHC-AN1P2/3T

Label explanation

CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank

Reel Dimensions

Note: The tolerances unless mentioned is ±0.1mm , Unit = mm

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16-213/BHC-AN1P2/3T

Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

Moisture Resistant Packaging

Label

Aluminum moisture-proof bag

Desiccant Label

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Device No. : DSE-163-B03 Prepared date: 09-Jan-2006 Prepared by: Ashley Kuo

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16-213/BHC-AN1P2/3T

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.
Confidence level：90%

LTPD：10%

No. Items Test Condition

Test

Hours/Cycles

Temp. : 260℃±5℃

1 Reflow Soldering

Min. 5sec.

6 Min.

H : +100℃ 15min

2 Temperature Cycle

∫ 5 min

300 Cycles

L : -40℃ 15min

H : +100℃ 5min

3 Thermal Shock

∫ 10 sec

300 Cycles

L : -10℃ 5min

4

High Temperature

Temp. : 100℃

1000 Hrs.

Storage

5

Low Temperature

Temp. : -40℃

1000 Hrs.

Storage

6 DC Operating Life IF = 20 mA

1000 Hrs.

Sample

Ac/Re

Size

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

7

High Temperature /

85℃/ 85%RH

1000 Hrs.

22 PCS. 0/1

High Humidity

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Device No. : DSE-163-B03 Prepared date: 09-Jan-2006 Prepared by: Ashley Kuo

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16-213/BHC-AN1P2/3T

Precautions For Use

1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

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Device No. : DSE-163-B03 Prepared date: 09-Jan-2006 Prepared by: Ashley Kuo

EVERLIGHT ELECTRONICS CO.,LTD.

16-213/BHC-AN1P2/3T

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of the
hand solder.

5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.

EVERLIGHT ELECTRONICS CO., LTD. Tel: [phone]
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: [phone]
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com

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Device No. : DSE-163-B03 Prepared date: 09-Jan-2006 Prepared by: Ashley Kuo