EVERLIGHT EVL 15-21SYGC/S2 Datasheet

EVERLIGHT ELECTRONICS CO.,LTD.

Technical Data Sheet
1206 Package Chip LED (1.1 mm Height)

15-21SYGC/S530-XX/TR8

Features

․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS complaint version.

Descriptions

․The 15-21 SMD Taping is much smaller

than lead frame type components, thus
enable smaller board size, higher
packingdensity, reduced storage space and
finally smaller equipment to be obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.
․General use.

Device Selection Guide

Part No.

Material Emitted Color

15-21SYGC/S530-XX/TR8 AlGaInP Brilliant Yellow Green Water Clear

Chip

Lens Color

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

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15-21SYGC/S530-XX/TR8

Package Outline Dimensions

1.5

Note: Tolerances Unless Dimension is ±0.1mm , Unit = mm

3.2

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15-21SYGC/S530-XX/TR8

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR 5 V
Forward Current IF 25 mA

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40~ +90 ℃

Electrostatic Discharge(HBM) ESD 2000 V

Power Dissipation Pd 60 mW

Peak Forward Current

(Duty 1/10 @1KHz)

Soldering Temperature Tsol

IF 60 mA

Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Electro-Optical Characteristics (Ta=25℃)

Symbol *Chip

Parameter

Min. Typ. Max. Unit

Rank

Luminous Intensity

Iv

E2 15 21 -----
E3 25 32 -----
E4 35 43 -----
E5 45 54 -----

Viewing Angle 2θ1/2 ----- ----- 130 ----- deg

Peak Wavelength

λp

Dominant Wavelength

λd

----- ----- 575 ----- nm

----- ----- 573 ----- nm

mcd

IF=20 mA

Spectrum

RadiatioBandwidth

Forward Voltage VF

Reverse Current IR ----- ----- ----- 10 μA

△λ

----- ----- 20

----- 1.7 2.0 2.4

----- nm

V

VR=5V

*15-21SYGC/S530-XX/TR8

Chip Rank

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

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15-21SYGC/S530-XX/TR8

Typical Electro-Optical Characteristics

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

VV

EVERLIGHT ELECTRONICS CO.,LTD.

15-21SYGC/S530-XX/TR8

Label explanation

CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank

Reel Dimensions

xxxxxx
xxxxxx

RoHS

xxxxxxxxxxxx

xxxx

xxxxxxxx

Note: The tolerances unless mentioned are ±0.1, Unit = mm.

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

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15-21SYGC/S530-XX/TR8

Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel

Note: Tolerances Unless Dimension is ±0.1mm , Unit = mm

Moisture Resistant Packaging

Label

Aluminum moistue-proof bag

LabelDesiccant

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

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15-21SYGC/S530-XX/TR8

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.
Confidence level：90%

LTPD：10%

No. Items Test Condition

Test

Hours/Cycles

Temp. : 260℃±5℃

1 Reflow Soldering

5 sec.

6 Min.

H : +100℃ 15min

2 Temperature Cycle

∫ 5 min

300 Cycles

L : -40℃ 15min

H : +100℃ 5min

3 Thermal Shock

∫ 10 sec

300 Cycles

L : -10℃ 5min

4

High Temperature

Temp. : 100℃

1000 Hrs.

Storage

5

Low Temperature

Storage

6 DC Operating Life IF = 20 mA

Temp. : -40℃

1000 Hrs.

1000 Hrs.

Sample

Ac/Re

Size

22 Pcs. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

22 PCS. 0/1

7

High Temperature /

85℃/85%RH

1000 Hrs.

22 PCS. 0/1

High Humidity

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

EVERLIGHT ELECTRONICS CO.,LTD.

15-21SYGC/S530-XX/TR8

Precautions For Use

1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

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Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali

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E

15-21SYGC/S530-XX/TR8

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of
the hand solder.

5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.

VERLIGHT ELECTRONICS CO., LTD. Tel: [phone]

Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: [phone]
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com

Everlight Electronics Co., Ltd. http://www.everlight.com Rev 1 Page: 9 of 9
Device No:SZDSE-151-022 Prepared date: 19-Aug-2005 Prepared by: Meng Yali