Eurotech Catalyst LP Design-in Manual

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www.eurotech.com

DESIGN-IN GUIDE

Catalyst LP

High Performance Module

Rev 5 – September 2011 – 110125-10005

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Initial release

Sept 2011

Trademarks

All trademarks both marked and not marked appearing in this document are the property of their respective owners.

Document Revision History

REVISION DESCRIPTION DATE

Preliminary release

Appendix D removed

Aug 2010

Oct 2010

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Table of Contents

Trademarks .................................................................................................................................................... 2

Document Revision History ............................................................................................................................ 2

Table of Contents ............................................................................................................................................ 3

Important User Information ............................................................................................................................ 5

Safety Notices and Warnings ......................................................................................................................... 5

Life Support Policy ......................................................................................................................................... 6

Warranty ......................................................................................................................................................... 6

WEEE ............................................................................................................................................................. 6

RoHS .............................................................................................................................................................. 6

Technical Assistance ..................................................................................................................................... 6

Conventions ................................................................................................................................................... 7

Product Overview ............................................................................................................................................ 8

Block Diagram ................................................................................................................................................ 8

Features ......................................................................................................................................................... 9

Design Checklist .......................................................................................................................................... 10

Development Kit ........................................................................................................................................... 13

Related Documents ...................................................................................................................................... 13

Software Specifications ................................................................................................................................ 14

Operating System Support ........................................................................................................................... 14

BIOS ............................................................................................................................................................. 14

Software Development Kit ............................................................................................................................ 14

Everyware™ Software Framework ................................................................................................................ 14

Hardware Specifications ............................................................................................................................... 15

Core Processor ............................................................................................................................................ 15

Intel Atom Processor .............................................................................................................................. 15

Intel I/O Controller Hub ........................................................................................................................... 15

Embedded Controller .............................................................................................................................. 15

Trusted Platform Management (option) .................................................................................................. 16

Memory ........................................................................................................................................................ 16

Synchronous DRAM ............................................................................................................................... 16

Non-Volatile Memory .............................................................................................................................. 16

Flash SSD (option) ................................................................................................................................. 16

External Memory Interfaces .................................................................................................................... 17

Communications .......................................................................................................................................... 18

PCI Express ............................................................................................................................................ 18

USB......................................................................................................................................................... 19

Gigabit Ethernet ...................................................................................................................................... 19

Carrier I2C Bus ........................................................................................................................................ 20

System Management Bus ...................................................................................................................... 20

Display and User Interface ........................................................................................................................... 21

LVDS Display and Backlight Control ...................................................................................................... 21

VGA Display ........................................................................................................................................... 22

Inputs and Outputs ....................................................................................................................................... 22

Low Pin Count Bus ................................................................................................................................. 22

Reset Signals .......................................................................................................................................... 23

General-Purpose Input and Output ........................................................................................................ 23

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Intel High Definition Audio ............................................................................................................................ 23

Power Requirements .................................................................................................................................... 24

Low Power States ................................................................................................................................... 24

Power Supply Architecture ..................................................................................................................... 25

Power State Signals ............................................................................................................................... 27

Mechanical Specifications ............................................................................................................................ 31

Mechanical Design ....................................................................................................................................... 31

Mechanical Drawing ............................................................................................................................... 31

Total Stack Height .................................................................................................................................. 32

Mounting Holes ....................................................................................................................................... 33

Insertion and Removal ............................................................................................................................ 33

Thermal Management .................................................................................................................................. 33

Carrier Board Design ..................................................................................................................................... 35

Design Guidelines ........................................................................................................................................ 35

Design Constraints ................................................................................................................................. 35

EMI/RFI Protection ................................................................................................................................. 35

Routing Guidelines ................................................................................................................................. 36

Power Planes .......................................................................................................................................... 37

Requirements and Recommendations ................................................................................................... 37

Test and Debug ............................................................................................................................................ 38

Connectors ..................................................................................................................................................... 39

Identifying Connectors ................................................................................................................................. 39

Signal Headers ............................................................................................................................................. 40

J1: Docking Connector: Data ................................................................................................................ 40

J2: Docking Connector: Power ............................................................................................................. 44

J3: ITP Debug Port ................................................................................................................................ 44

System Specifications................................................................................................................................... 45

Power ........................................................................................................................................................... 45

Power Supply .......................................................................................................................................... 45

Power Consumption ............................................................................................................................... 46

Performance ................................................................................................................................................. 46

Electrical ....................................................................................................................................................... 46

Reset Signals .......................................................................................................................................... 46

PCIe Clock Generator............................................................................................................................. 47

USB......................................................................................................................................................... 47

Carrier I2C Bus ........................................................................................................................................ 47

SMBus .................................................................................................................................................... 47

LVDS Display and Backlight ................................................................................................................... 48

VGA Display ........................................................................................................................................... 48

General-purpose Inputs and Outputs ..................................................................................................... 49

Intel High Definition Audio ...................................................................................................................... 49

General ......................................................................................................................................................... 49

Crystal Frequencies ................................................................................................................................ 49

Real-Time Clock ..................................................................................................................................... 50

Environmental .............................................................................................................................................. 50

Appendix A – Reference Information .......................................................................................................... 51

Appendix B – Board Revision ...................................................................................................................... 52

Eurotech Worldwide Presence ..................................................................................................................... 53

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requirements set out for the environment that the equipment will be deployed in.

Important User Information

In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must observe the following precautions as well as good technical judgment, whenever this product is installed or used.

All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech assumes no liability resulting from any error/omission in this document or from the use of the information contained herein.

Eurotech reserves the right to revise this document and to change its contents at any time without obligation to notify any person of such revision or changes.

Safety Notices and Warnings

The following general safety precautions must be observed during all phases of operation, service, and repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the equipment. Eurotech assumes no liability for the customer’s failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware. You, as the user of the product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.

Installation in Enclosures

In the event that the product is placed within an enclosure, together with other heat generating equipment, ensure proper ventilation.

Do Not Operate in an Explosive Atmosphere

Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical equipment in such an environment constitutes a definite safety hazard.

Alerts that can be found throughout this manual

The following alerts are used within this manual and indicate potentially dangerous situations.

Danger, electrical shock hazard:

Information regarding potential electrical shock hazards:

• Personal injury or death could occur. Also damage to the system, connected peripheral devices, or software could occur if the warnings are not carefully followed.

• Appropriate safety precautions should always be used, these should meet the

Warning:

Information regarding potential hazards:

• Personal injury or death could occur. Also damage to the system, connected peripheral devices, or software could occur if the warnings are not carefully followed.

• Appropriate safety precautions should always be used, these should meet the requirements set out for the environment that the equipment will be deployed in.

Information and/or Notes:

These will highlight important features or instructions that should be observed.

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Use an Appropriate Power Supply

• Only start the product with a power supply that conforms to the voltage requirements as specified in

Power Supply, page 45. In case of uncertainty about the required power supply, please contact your

local Eurotech Technical Support Team.

• Use power supplies that are compliant with SELV regulation.

• Avoid overcharging power-points.

Antistatic Precautions

To avoid damage caused by ESD (Electro Static Discharge), always use appropriate antistatic precautions when handing any electronic equipment.

Life Support Policy

Eurotech products are not authorized for use as critical components in life support devices or systems without the express written approval of Eurotech.

Warranty

For Warranty terms and conditions users should contact their local Eurotech Sales Office. See Eurotech Worldwide Presence, page 53 for full contact details.

WEEE

The information below is issued in compliance with the regulations as set out in the 2002/96/EC directive, subsequently superseded by 2003/108/EC. It refers to electrical and electronic equipment and the waste management of such products. When disposing of a device, including all of its components, subassemblies, and materials that are an integral part of the product, you should consider the WEEE directive.

This device is marketed after August 13, 2005 and you must separate all of its components when possible and dispose of them in accordance with local waste disposal legislations.

• Because of the substances present in the equipment, improper use or disposal of the refuse can cause damage to human health and to the environment.

• With reference to WEEE, it is compulsory not to dispose of the equipment with normal urban refuse and arrangements should be instigated for separate collection and disposal.

• Contact your local waste collection body for more detailed recycling information.

• In case of illicit disposal, sanctions will be levied on transgressors.

RoHS

This device, including all its components, subassemblies and the consumable materials that are an integral part of the product, has been manufactured in compliance with the European directive 2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances). This directive targets the reduction of certain hazardous substances previously used in electrical and electronic equipment (EEE).

Technical Assistance

If you have any technical questions, cannot isolate a problem with your device, or have any enquiry about repair and returns policies, contact your local Eurotech Technical Support Team.

See Eurotech Worldwide Presence, page 53 for full contact details.

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Convention

Explanation

GND

Digital ground plane

Active low signal

+ or P

Positive signal in differential pair

- or N

Negative signal in differential pair

Type

Explanation

Analog signal

Open-drain

CMOS

3.3 V CMOS

LVCMOS

1.05 V CMOS

LVTTL

Low Voltage TTL

5 V signal level

HDA

PCIe

SATA

SATA differential signal

No Connection

Reserved

Use is reserved to Eurotech

Termination

Explanation

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material and placed in a sturdy box with enough packing material to adequately cushion it.

Warning:

Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the warranty.

Conventions

The following table describes the conventions for signal names used in this document.

The following table describes the abbreviations for direction and electrical characteristics of a signal used in this document.

3.3

IDE

LVDS

Signal is an input to the system Signal is an output from the system Signal may be input or output Power and ground

3.3 V signal level

5 V tolerant signal High Definition Audio, 3.3 V signal Low Voltage Differential Signalling PCI Express signal

Some signals include termination on the Catalyst LP. The following table describes the abbreviations that specify the signal termination.

Pull-up resistor to the specified voltage Pull-down resistor Series resistor Series capacitor

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Intel® ICH8M

GigE MDI

Intel® Atom™

Processor

(N450 or D510)

IDE/PATA

USB0-8

LVDS Display

HD Audio

Embedded

Ctrl

SMBus

LPC Bus

VBAT (RTC)

V Reg

BIOS

Catalyst LP

I2C Bus Sys Mgmt I/O

GPIO1-2

DDR-2 DRAM

TPM

VGA Display

BKLT Ctrl

SATA1

SD/MMC0

SATA2

PCIe3

PCIe

PCIe to

Expansion

Host Ctrl

PHY

PCIe0 PCIe1 PCIe2

PCIe to

Expansion

Host Ctrl

GPIO3-4

SD/MMC1

eMMC

Flash SSD

Product Overview

The Catalyst LP is a high-performance module based on the Intel® Atom™ processor N450 (single core) or Intel the Intel Atom processor and Intel

Atom™ processor D510 (dual core). It uses an integrated two-chip solution comprised of

I/O Controller Hub (Intel® ICH8M). The Intel Atom processor contains an integrated 2D/3D graphics engine supporting hardware-accelerated graphics display and video processing capabilities, while the Intel ICH8M supports extensive I/O and data storage capabilities. The Catalyst LP maximizes the performance capabilities of the Intel Atom processor offering a feature-dense embedded solution.

An application-specific carrier board integrates with the Catalyst LP for a total production solution. This flexible, modular architecture enables easy customization and quick time-to-market. A Eurotech carrier board is available that implements several industry-standard interfaces allowing development across a broad spectrum of end-use applications.

The Catalyst LP is available with a variety of operating systems. Support is also available for the Java Virtual Machine and Eurotech’s Everyware

™

Software Framework, which offers an easy-to-use, Javabased development environment that minimizes time to market and allows for easy portability for future expansion.

Block Diagram

The following diagram illustrates the system organization of the Catalyst LP. Notice that the data connector has been divided into two sections for this illustration. Dotted lines indicate options.

Figure 1. Catalyst LP Block Diagram

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Features

Processor

• Intel® Atom™ processor N450 (single core) or Intel® Atom™ processor D510 (dual core)

• 200 MHz graphics engine (single core) or 400 MHz graphics engine (dual core)

• Intel

Integrated System Functions

• Embedded Controller

• Optional Trusted Platform Management (Contact Eurotech for details)

Memory

• Up to 2 GB DDR-2 DRAM

• Optional on-board eMMC flash SSD (Contact Eurotech for details)

• Integrated system BIOS

• Battery-backed real-time clock

• External memory support

I/O Controller Hub (Intel® ICH8M)

o IDE/PATA disk drive o SATA disk drive o USB disk drive o SD/MMC card o PCI Express card

Product Overview

Communications

• Up to four PCI Express one lane slots

o Custom configuration option for one PCI Express four lane slot

• Nine USB 2.0 ports operating at low, full, and high speeds

• Gigabit Ethernet with physical layer transceiver

• I

C bus with I2C master device

• System Management Bus

User Interface and Display

• Independent LVDS display output and VGA display output

• Backlight interface with control signals for intensity and power

Inputs and Outputs

• Low Pin Count bus for general-purpose I/O expansion

• Four general-purpose inputs and outputs

Audio Interface

• Intel® High Definition Audio supporting up to two external audio codecs

Power Supply

• 3.3 V and 5 V main power inputs

• ACPI power management

Mechanical

• 67 mm x 100 mm dimensions

• Less than 10 mm total stack height

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Design Checklist

Eurotech provides a host of services to ensure that your product is up and running from the first prototype release. We recommend the following process for every Catalyst LP carrier board design:

Kickoff Stage

During the Kickoff Stage, you will develop your block diagram and identify any customizations your application may require.

 Gather your reference materials

Eurotech provides several documents that include key information for designing a custom carrier board. Use the following resources and ask questions:

• Catalyst LP Design-In Guide

• Catalyst LP Development Kit User Manual

• Carrier Board Routing Guidelines

• 3D CAD models

• Reference Carrier Board Schematic

• Reference Carrier Board Bill of Materials

 Define your requirements

Define your system’s requirement. Be sure to include requirements such as the product features, the input power, the type of transient protection on the power supply, connectivity to the module, and all I/O to your system.

 Create a block diagram

Create a block diagram of your proposed design. This step helps to formulate the best way to connect different devices to the module.

 Identify customizations

Identify any customizations that your application requires. Examples of customizations are custom LCD panel timings and backlight control, custom module configurations, or supporting a device that is not included on Eurotech’s standard carrier board. Customizations may require updates to the BIOS.

 Utilize the Catalyst LP Development Kit

Utilize the Catalyst LP Development Kit for validating your proposed design. For example, if a USB device is to be used on USB port 6, test that device by connecting it to USB port 6 on the Catalyst LP Development Kit. This testing also allows you to validate your OS image with all required drivers loaded.

 Kickoff review

Early in the development of your carrier board, meet with your Eurotech representative to review your block diagram and discuss customizations. Incorporate any changes into your design.

Preliminary Design Stage

During the Preliminary Design Stage, you will finalize your block diagram, agree on customizations, and begin your preliminary schematic.

 Use the reference schematic

Use Eurotech’s reference carrier board schematic as a starting point for your design. This schematic includes many commonly used interfaces. Using the same connectivity to the module will minimize the time spent in debugging your design.

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 Select components from the reference bill of materials

Select the same components as those used in Eurotech’s reference carrier board bill of materials. Eurotech selects components that are optimized for embedded systems based on quality, low-power consumption, availability, reliability, and industrial temperature options. Selecting the same components also allows you to use the drivers Eurotech has already integrated with the OS builds.

 Follow the design requirements and recommendations

Follow the design requirements and recommendations listed in Carrier Board Design, page 35 of this design-in guide. This section provides details about circuitry to include on the carrier board.

 Preliminary design review

Stay in contact with your Eurotech representative during your preliminary design. Together, finalize your block diagram and agree on customizations needed. Continue to ask questions as you move towards finalizing your design.

Critical Design Stage

During the Critical Design Stage, you will finalize your schematic making sure that you have met all the module’s electrical, thermal, and mechanical design requirements.

 Implement power supply sequencing

Implement the exact power supply sequencing described in Power State Signals, page 27 of this design-in guide. The module has very specific power-on sequence requirements in order to power-up and operate correctly. Power sequencing the multiple voltage rails, as described in this section, is CRITICAL. If your design does not meet these requirements, the module will not boot.

 Provide a system-level reset

Buffer and use the system reset signal RST# (J1 B56), described in Reset Signals, page 23, to reset all devices on the carrier board. The embedded controller controls the de-assertion of this signal with appropriate timings relative to power being stable. Timing requirements for power stable to reset deasserted and reset de-asserted to device available are critical.

 Create a power budget

Create a power budget that takes into account the current requirement of the module, as specified in

Power Supply, page 45, and of the devices that are used with the module. Design your power supply

to handle the maximum current requirement.

 Determine thermal management

Determine what type of thermal management is required for your design. Use your power budget and the information provided in Thermal Management, page 33 of this design-in guide to design a heat spreader, if necessary.

 Follow the module’s mechanical requirements

Follow the exact mechanical requirements given in Mechanical Design, page 31 for mounting holes placement, position of the board-to-board connectors, and stack height on your carrier board design.

 Use advanced layout and high-speed routing techniques

Follow the design constraints and routing guidelines described in Carrier Board Design, page 35 of this design-in guide. Adhering to good design practices for high-speed PCB design is essential. You should have your schematic 95% complete, especially the high-speed signals and buses of the module, power sequencing, and system reset, before you start board layout. Meet with your Eurotech representative to review your schematic before you begin layout. After your layout is complete, meet again to review your complete design.

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 Have a strategy to debug your design

Review your strategy to bring-up and to debug your design. Ensure that you have included the necessary support in your design. The maintenance serial port is extremely important in bring-up of a new design. Eurotech highly recommends including an external connection to SMC_UART_RX (J1 B57) and SMC_UART_TX (J1 B106) on your carrier board.

 Critical design review

Do an in-depth review of your finished design, including final schematic and board layout, to ensure that you have met all the requirements described in this checklist and throughout this design-in guide. Again, ask your Eurotech representative questions.

Prototype Bring-up Stage

Eurotech provides assistance in bringing-up your prototype at your site or ours. We have several tools that can assist the process including "stand-alone" BIOS releases, BIOS modifications to meet specific platform or test requirements, and power monitoring applications for the module. The "stand-alone" BIOS sets up the internal functions of the module and basic I/O functions. It is not dependent on any specific carrier board, devices, or circuits. This BIOS provides "basic" level functionality and can be used as a tool in the bring-up or debug of your unique carrier board.

 Begin with the basics

Begin by checking basic functionality such as power, reset, and clocks. Verif y that the power sequencing is as it should be and that the voltage regulator outputs are at nominal levels. Check that the system reset signal is asserted and deasserted according to the power sequencing requirements. Ensure all clocks necessary for bring-up are running properly.

 Start with minimal devices

Minimize the number of devices required for bring-up. Using Eurotech’s "debug" set of firmware is a good start. This firmware can be used (on case-by-case) basis as a debug and bring-up tool for your specific design prototyping or in the debugging phases of your development. It disables all NONCritical-to-BOOT functions to simplify the system functionality to base level. After you have verified this base level, enable each subsystem as needed. Adding one device at a time will help determine which subsystem, if any, is having problems.

 Utilize the maintenance port

Utilize the maintenance port output to identify problems during bring-up. This port provides important debug information including BIOS POST codes and error messages that enable you to monitor the operation of the module.

 Use your Catalyst LP Development Kit

Use your Catalyst LP Development Kit to isolate problems. If a problem occurs during bring-up of your carrier board, try to duplicate the problem on the development kit.

 Prototype bring-up review

Review your bring-up process and share lessons learned with your Eurotech representative.

Acceptance of Customizations

Eurotech is committed to your design success. Using our support services throughout the development cycle ensures a complete and robust solution with which to move forward.

 Customization Acceptance

Meet with your Eurotech representative to discuss acceptance of any customizations and to plan the steps toward production of your Catalyst LP design.

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Product Overview

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Document

Catalyst XL - Catalyst LP Compatibility Technical Bulletin

Catalyst LP Development Kit Quick Start

Catalyst Module Display Adapter User Manual

110122-4000

Catalyst Module Installation and Removal

110122-2014

Catalyst System Management Programmer Reference

110122-2021

Catalyst I2C Bus Programmer Reference

Development Kit

The Catalyst LP Development Kit is designed to get the developer up and running quickly. The development kit includes the Catalyst LP, a standard development kit carrier board, and supporting peripheral devices. To provide flexibility and allow development across a broad spectrum of end-use applications, the carrier board maximizes the Catalyst LP functionality and implements many industrystandard interfaces. This configuration allows you to become familiar with the Catalyst LP functionality prior to customization for your specific application. In addition, the standard development kit carrier board provides a reference for custom carrier board design.

For a complete description of the Catalyst LP Development Kit, refer to the Catalyst LP Development Kit User Manual (Eurotech document 110125-4000).