* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.
2.3Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:
Espressif Systems4ESP32-WROOM-32DC Datasheet V0.1
2. Pin Definitions
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset and brownout reset), the latches of the
strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset, the strapping pins work as normal-function pins.
Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
PinDefault3.3 V1.8 V
MTDIPull-down01
Booting Mode
PinDefaultSPI BootDownload Boot
GPIO0Pull-up10
GPIO2Pull-downDon’t-care0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
PinDefaultU0TXD ActiveU0TXD Silent
MTDOPull-up10
Timing of SDIO Slave
PinDefault
MTDOPull-up0011
GPIO5Pull-up0101
Falling-edgeInput
Falling-edge Output
Falling-edgeInput
Rising-edge Output
Rising-edgeInput
Falling-edge Output
Rising-edgeInput
Rising-edge Output
Note:
CONFIDENTIAL
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up.
Espressif Systems5ESP32-WROOM-32DC Datasheet V0.1
3. Functional Description
3.Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32DC.
3.1CPU and Internal Memory
ESP32-D0WD contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory
includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in
the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
ESP32-WROOM-32DC integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto
the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI
CONFIDENTIAL
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.
3.3Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
Espressif Systems6ESP32-WROOM-32DC Datasheet V0.1
3. Functional Description
3.4RTC and Low-Power Management
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.
CONFIDENTIAL
Espressif Systems7ESP32-WROOM-32DC Datasheet V0.1
4. Peripherals and Sensors
4.Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6 Schematics.
CONFIDENTIAL
Espressif Systems8ESP32-WROOM-32DC Datasheet V0.1
5. Electrical Characteristics
5.Electrical Characteristics
5.1Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device.
Table 4: Absolute Maximum Ratings
SymbolParameterMinMaxUnit
VDD33Power supply voltage–0.33.6V
T
store
1
I
O
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
Storage temperature–40150°C
Cumulative IO output current-1,100mA
5.2Recommended Operating Conditions
Table 5: Recommended Operating Conditions
SymbolParameterMinTypicalMaxUnit
VDD33Power supply voltage2.73.33.6V
I
V DD
TOperating temperature–40-85°C
Current delivered by external power supply0.5--A
5.3DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
SymbolParameterMinTypMaxUnit
C
IN
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
CONFIDENTIAL
High-level source currentVDD3P3_CPU power domain
I
OH
I
OL
R
P U
(VDD1= 3.3 V, VOH>= 2.64 V,VDD3P3_RTC power domain
PAD_DRIVER = 3)VDD_SDIO power domain
Low-level sink current
(VDD1= 3.3 V, VOL= 0.495 V, PAD_DRIVER = 3)
Pin capacitance-2-pF
High-level input voltage0.75×VDD1-VDD1+0.3V
Low-level input voltage–0.3-0.25×VDD1V
High-level input current--50nA
Low-level input current--50nA
High-level output voltage0.8×VDD1--V
Low-level output voltage--0.1×VDD1V
1, 2
-40-mA
1, 2
-40-mA
1, 3
Pull-up resistor-45-kΩ
-20-mA
-28-mA
Espressif Systems9ESP32-WROOM-32DC Datasheet V0.1
5. Electrical Characteristics
SymbolParameterMinTypMaxUnit
R
P D
V
IL_nRS T
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
Low-level input voltage of CHIP_PU to reset the chip--0.6V
FCC Statement
Any Changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate
the equipment.
This device complies with part 15 of the FCC Rules. Operation is
subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including
interference that may cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth
for an uncontrolled environment .This equipment should be installed
and operated with minimum distance 20cm between the radiator&
your body.
FCC Label Instructions:
The outside of final products that contains this module device must
display a label referring to the enclosed module. This exterior label
can use wording such as: “Contains Transmitter Module
FCC ID: 2AC7Z-ESPWROOM32DC”,or “Contains
FCC ID: 2AC7Z-ESPWROOM32DC”, Any similar wording that
expresses the same meaning may be used.