ESPRESSIF SYSTEMS ESP-WROOM-02D4 Datasheet

www.espressif.com
Version 1.7
Espressif Systems
Copyright © 2020
Includes:
ESP-WROOM-02D
ESP-WROOM-02U
About This Guide
This document provides introduction to the specifications of ESP-WROOM-02D and ESP­WROOM-02U hardware.
Release Notes
Documentation Change Notification
Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at https://www.espressif.com/en/subscribe.
Certification
Download certificates for Espressif products from https://www.espressif.com/en/
certificates.
Date
Version
Release notes
2017.11
V1.0
First release.
2018.03
V1.1
Updated the figure of ESP-WROOM-02U dimensions.
2018.08
V1.2
Updated Table 1-1 and Table 1-2;
Updated module dimensions;
Added PCB pattern;
Updated document cover.
2019.04
V1.3
Added MSL information in table 1-2;
Added notes in Figure 5-1 and Figure 5-2.
2019.08
V1.4
Updated Chapter 6 Peripheral Schematics.
2019.12
V1.5
Added a note for the reflow profile;
Added feedback links.
2019.12
V1.6
Updated a typo in ESP-WROOM-02D dimensions.
2020.07
V1.7
Updated Note in Chapter 6;
Updated links in Appendix.
Table of Contents
1. Overview 1 ................................................................................................................................
2. Pin Description 3 ......................................................................................................................
3. Functional Description 5 ..........................................................................................................
3.1. CPU! 5"..........................................................................................................................................
3.2. Memory! 5"....................................................................................................................................
3.2.1. Internal SRAM and ROM! 5"...........................................................................................
3.2.2. SPI Flash! 5"....................................................................................................................
3.3. Crystal Oscillator! 6"......................................................................................................................
3.4. Interface Description! 6"................................................................................................................
4. Electrical Characteristics 8 ......................................................................................................
4.1. Electrical Characteristics! 8"..........................................................................................................
4.2. Wi-Fi Radio! 8"...............................................................................................................................
4.3. Power Consumption! 9".................................................................................................................
4.4. Reflow Profile! 10".........................................................................................................................
4.5. Electrostatic Discharge! 11"..........................................................................................................
5. Schematics 12 ..........................................................................................................................
6. Peripheral Schematics 14 ........................................................................................................
7. Dimensions 15 ..........................................................................................................................
8. Recommended PCB Land Pattern 17 .....................................................................................
9. U.FL Connector Dimensions 19 ...............................................................................................
A. Appendix—Learning Resources 20 .........................................................................................
A.1. Must-Read Documents! 20"..........................................................................................................
A.2. Must-Have Resources! 21............................................................................................................
!
1. Overview

1. Overview

ESP-WROOM-02D and ESP-WROOM-02U are ESP8266EX-based modules developed by Espressif. Compared to ESP-WROOM-02, the RF performance of ESP-WROOM-02D and
ESP-WROOM-02U are optimized. Besides, ESP-WROOM-02U integrates a U.FL connector. Please see Chapter 8 for details of U.FL connector.
Table 1-1. ESP-WROOM-02D vs. ESP-WROOM-02U
Module
ESP-WROOM-02D
ESP-WROOM-02U
Core
ESP8266
ESP8266
Antenna
Onboard antenna
IPEX antenna
Dimensions
(unit: mm)
(18.00 ± 0.10) x (20.00 ± 0.10) x (3.20 ±
0.10)
See Figure 6-1 for details.
(18.00 ± 0.10) x (14.30 ± 0.10) x (3.20 ±
0.10)
See Figure 6-2 for details.
Schematics
See Figure 5-1 for details.
See Figure 5-2 for details.
📖 Note:
For more information on ESP8266EX, please refer to ESP8266EX Datasheet.
Table 1-2. ESP-WROOM-02D/ESP-WROOM-02U Specifications
Categories
Items
Specifications
Certification
RF certification
SRRC, FCC, CE (RED), IC, NCC, KCC, TELEC (MIC)
Green certification
RoHS, REACH
Test
Reliablity
HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi
Wi-Fi protocols
802.11 b/g/n
Frequency range
2.4 GHz ~ 2.5 GHz (2400 MHz ~ 2483.5 MHz)
Hardware
Peripheral interface UART/HSPI/I2C/I2S/IR Remote Control
GPIO/PWM
Operating voltage
2.7 V ~ 3.6 V
Operating current
Average: 80 mA
Minimum current delivered by power supply
500 mA Operating temperature range
-40 °C ~ 85 °C
Storage temperature
-40 °C ~ 85 °C
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1. Overview
External interface
-
Moisture sensitivity level
Level 3
Software
Wi-Fi mode
Station/SoftAP/SoftAP + Station
Security
WPA/WPA2
Encryption
WEP/TKIP/AES
Firmware upgrade
UART Download/OTA (via network)/Download and write firmware via host
Software development
Supports Cloud Server Development/SDK for custom firmware development
Network protocols
IPv4, TCP/UDP/HTTP/FTP
User configuration
AT Instruction Set, Cloud Server, Android/iOS app
Categories
Items
Specifications
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2. Pin Description

2. Pin Description

Figure 2-1 shows the pin distribution of the ESP-WROOM-02D.
!
Figure 2-1. ESP-WROOM-02D Pin Layout (Top View)
ESP-WROOM-02D and ESP-WROOM-02U have 18 pins. Please see the pin definitions in Table 2-1.
19GND
PCB ANTENNA
GND
IO16
TOUT
RST
IO5
GND
TXD
RXD
IO4
3V3
EN
IO14
IO12
IO13
IO15
IO2
IO0
GND
9
8
7
6
5
4
3
2
1
10
11
12
13
14
15
16
17
18
📖 Note:
The pin layout of ESP-WROOM-02U is the same with that of ESP-WROOM-02D, but it has no keepout zone for PCB antenna.
Table 2-1. ESP-WROOM-02U/ESP-WROOM-02D Pin Definitions
No.
Pin Name
Functional Description
1
3V3
3.3 V power supply (VDD)
📖 Note:
It is recommended the maximum output current a power supply provides be of 500 mA or above.
2ENChip enable pin. Active high.
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2. Pin Description
3
IO14
GPIO14; HSPI_CLK
4
IO12
GPIO12; HSPI_MISO
5
IO13
GPIO13; HSPI_MOSI; UART0_CTS
6
IO15
GPIO15; MTDO; HSPICS; UART0_RTS
Pull down.
7
IO2
GPIO2; UART1_TXD
Floating (internal pull-up) or pull up.
8
IO0
GPIO0
UART download: pull down.
Flash boot: floating or pull up.
9
GND
GND
10
IO4
GPIO4
11
RXD
UART0_RXD, receive end in UART download;
GPIO3
12
TXD
UART0_TXD, transmit end in UART download, floating or pull up;
GPIO1
13
GND
GND
14
IO5
GPIO5
15
RST
Reset
16
TOUT
It can be used to test the power-supply voltage of VDD3P3 (Pin3 and Pin4) and the input power voltage of TOUT (Pin6). These two functions cannot be used simultaneously.
17
IO16
GPIO16; used for Deep-sleep wake-up when connected to RST pin.
18
GND
GND
No.
Pin Name
Functional Description
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3. Functional Description

3. Functional Description

3.1. CPU
The ESP8266EX integrates a Tensilica L106 32-bit RISC processor, which achieves extra­low power consumption and reaches a maximum clock speed of 160 MHz. The Real-Time
Operating System (RTOS) and Wi-Fi stack allow 80% of the processing power to be available for user application programming and development. The CPU includes the interfaces as below:
Programmable RAM/ROM interfaces (iBus), which can be connected with memory controller, and can also be used to visit flash.
Data RAM interface (dBus), which can connected with memory controller.
AHB interface which can be used to visit the register.

3.2. Memory

3.2.1. Internal SRAM and ROM

ESP8266EX Wi-Fi SoC integrates the memory controller and memory units including ROM and SRAM. MCU can access the memory units through iBus, dBus, and AHB interfaces. All memory units can be accessed upon request. A memory arbiter determines the running
sequence in the arrival order of requests.
According to our current version of SDK, the SRAM space available to users is assigned as follows:
RAM size < 50 kB, that is, when ESP8266EX is working in Station mode and
connects to the router, available space in the Heap + Data sector is around 50 kB.
There is no programmable ROM in ESP8266EX, therefore, the user program must be
stored in an external SPI flash.

3.2.2. SPI Flash

ESP8266EX supports SPI flash. Theoretically speaking, ESP8266EX can support an up­to-16-MB SPI flash.
ESP-WROOM-02D and ESP-WROOM-02U currently integrate a 2-MB SPI flash. ESP­WROOM-02U supports these SPI modes: Standard SPI, DIO (Dual I/O), DOUT (Dual Output), QIO (Quad I/O) and QOUT (Quad Output).
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3. Functional Description

3.3. Crystal Oscillator

ESP-WROOM-02U and ESP-WROOM-02D use a 26-MHz crystal oscillator. The accuracy of the crystal oscillator should be ±10 PPM.
When using the download tool, please select the right type of crystal oscillator. In circuit design, capacitors C1 and C2 which connect to the earth are added to the input and output terminals of the crystal oscillator respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF, however, the specific capacitive values depend on
further testing of, and adjustment to, the overall performance of the whole circuit. Normally, the capacitive values of C1 and C2 are within 10 pF for the 26-MHz crystal oscillator.

3.4. Interface Description

Table 3-1. Interface Description
Interface
Pin
Functional Description
HSPI
IO12 (MISO), IO13 (MOSI), IO14 (CLK), IO15 (CS)
Connects to SPI Flash, display screen, and MCU.
PWM
IO12 (R), IO15 (G),IO13 (B)
Currently the PWM interface has four channels, but users can extend it to eight channels. PWM interface can realize the control of LED lights, buzzers, relays, electronic machines, etc.
IR
IO14 (IR_T), IO5 (IR_R)
The functionality of the infrared remote control interface can be realized via software programming. The interface uses NEC coding, modulation, and demodulation. The frequency of the modulated carrier signal is 38 kHz.
ADC
TOUT
Tests the power supply voltage of VDD3P3 (Pin3 and Pin4) and the input power voltage of TOUT (Pin6). However, these two functions cannot be used simultaneously. This interface is typically used in sensors.
I2C
IO14 (SCL), IO2 (SDA)
Connects to external sensors and display screens, etc.
UART
UART0: TXD (U0TXD),
RXD (U0RXD), IO15 (RTS), IO13 (CTS)
UART1: IO2 (TXD)
Communicates with the UART device.
Downloading: U0TXD + U0RXD or GPIO2 + U0RXD
Communicating: (UART0): U0TXD, U0RXD, MTDO (U0RTS), MTCK (U0CTS)
Debugging: UART1_TXD (GPIO2) can be used to print debugging information.
By default, UART0 will output some printed information when you power on ESP8266EX. If this issue influences some specific applications, users can exchange the inner pins of UART when initializing ESP8266EX, that is, exchange U0TXD and U0RXD with U0RTS and U0CTS. Users can connect MTDO and MTCK to the serial port of the external MCU to realize the communication.
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3. Functional Description
I2S
I2S input:
IO12 (I2SI_DATA) ;
IO13 (I2SI_BCK );
IO14 (I2SI_WS);
Collects, processes and transmits audio data.
I2S output:
IO15 (I2SO_BCK );
IO3 (I2SO_DATA);
IO2 (I2SO_WS ).
Interface
Pin
Functional Description
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4. Electrical Characteristics

4. Electrical Characteristics

4.1. Electrical Characteristics

4.2. Wi-Fi Radio

📖 Note:
Unless otherwise specified, measurements are based on VDD = 3.3 V, TA = 25 °C.
Table 4-1. Electrical Characteristics
Parameter
Symbol
Min
Typ
Max
Unit
Operating temperature
-
40
2085℃
Maximum soldering temperature (Condition: IPC/JEDEC J-STD-020)
---
260
Supply voltage
VDD
2.7
3.3
3.6
V
Input logic level low
VIL–0.3-0.25 VDD
V
Input logic level high
VIH0.75 VDD
-
VDD + 0.3
V
Output logic level low
VOL--0.1 VDD
V
Output logic level high
VOH0.8 VDD
--V
Table 4-2. Wi-Fi Radio Characteristics
Description
Min
Typ
Max
Unit
Input frequency
2412
-
2483.5
MHz
Input reflection
- -–10
dB
Output Impedance
-*-
Ω
Output Power
PA output power at 72.2 Mbps
131415
dBm
PA output power in 11b mode
19.52020.5
dBm
Sensitivity
DSSS, 1 Mbps
-
–98-dBm
CCK, 11 Mbps
-
–91-dBm
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4. Electrical Characteristics

4.3. Power Consumption

The following power consumption data were obtained from the tests with a 3.3 V power supply and a voltage stabilizer, in 25 °C ambient temperature. All data are based on 50%
duty cycle in continuous transmission mode.
6 Mbps (1/2 BPSK)
-
–93-dBm
54 Mbps (3/4 64-QAM)
-
–75-dBm
HT20, MCS7 (65 Mbps, 72.2 Mbps)
-
–72-dBm
Adjacent channel rejection
OFDM, 6 Mbps
-37-
dB
OFDM, 54 Mbps
-21-
dB
HT20, MCS0
-37-
dB
HT20, MCS7
-20-
dB
Description
Min
Typ
Max
Unit
📖 Note:
For the module that uses an IPEX antenna, the output impedance is 50 Ω.
Table 4-3. Power Consumption
Modes
Min
Typ
Max
Unit
Tx 802.11 b, CCK 11 Mbps, POUT = +17 dBm
-
170-mA
Tx 802.11 g, OFDM 54 Mbps, POUT = +15 dBm
-
140-mA
Tx 802.11 n, MCS7, POUT = +13 dBm
-
120-mA
Rx 802.11 b, 1024 bytes packet length , 80 dBm
-50-
mA
Rx 802.11 g, 1024 bytes packet length , –70 dBm
-56-
mA
Rx 802.11 n, 1024 bytes packet length , –65 dBm
-56-
mA
Modem-sleep
-15-
mA
Light-sleep
-
0.9-mA
Deep-sleep
-20-
μA
Power Off
-
0.5-μA
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4. Electrical Characteristics
4.4. Reflow Profile
Figure 4-1. ESP-WROOM-02D/ESP-WROOM-02U Reflow Profile
📖 Notes:
Modem-sleep is used when such applications as PWM or I2S require the CPU to be working. In cases
where Wi-Fi connectivity is maintained and data transmission is not required, the Wi-Fi Modem circuit can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 15 mA.
Light-sleep is used for applications whose CPU may be suspended, such as Wi-Fi switch. In cases
where Wi-Fi connectivity is maintained and data transmission is not required, the Wi-Fi Modem circuit and CPU can be shut down to save power, according to 802.11 standards (such as U-APSD). For example, in DTIM3, when ESP8266EX sleeps for 300 ms and wakes up for 3 ms to receive Beacon packages from AP, the overall average current consumption is about 0.9 mA.
Deep-sleep is for applications that do not require Wi-Fi connectivity but only transmit data over long time
lags, e.g., a temperature sensor that measures temperature every 100s. For example, when ESP8266EX sleeps for 300 s then wakes up to connect to AP (taking about 0.3 ~ 1 s), the overall average current consumption is far less than 1 mA. The current consumption of 20 μA was obtained at the voltage of 2.5 V.
50
150
0
25
1 ~ 3/s
0
200
250
200
-1 ~ -5/s
Cooling zone
100
217
50
100 250
Reflow zone
217 60 ~ 90s
Temperature ()
Preheating zone
150 ~ 200 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150 Time: 60 ~ 90s Ramp-up rate: 1 ~ 3/s Preheating zone — Temp.: 150 ~ 200 T ime: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8/s Reflow zone — Temp.: >217 60 ~ 90s; Peak Temp.: 235 ~ 250 (<245 recommended) Time: 30 ~ 70s Cooling zone — Peak Temp. ~ 180 Ramp-down rate: -1 ~ -5/s Solder — Sn&Ag&Cu Lead-free solder (SAC305)
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4. Electrical Characteristics
4.5. Electrostatic Discharge
📖 Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final reflow.
Table 4-4. Electrostatic Discharge Parameters
Name
Symb ol
Reference
Level
Max
Unit

Electrostatic Discharge

(Human - Body Model)
VESD (HBM)
Temperature: 23 ± 5
Based%on ANSI/ESDA/JEDEC JS - 001 - 2014
2
2000
V Electrostatic Discharge
(Charged - Device Model)
VESD (CDM)
Temperature: 23 ± 5
Based%on JEDEC EIA/JESD22 - C101F
C2
500
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5. Schematics

5. Schematics

!
Figure 5-1. ESP-WROOM-02D Schematics!
5
4
3
2
1
The values of C4, L1 and L2
vary with the actual PCB board.
The values of C1 and C2 vary with
the selection of the crystal.
GPIO15
RST
SD_D1
SD_D0
SD_CLK
SD_CMD
SD_D3
SD_D2
SD_CLK
SD_CMD
SD_D2
UTXDA
WIFI_ANT
GPIO14
GPIO12
URXD
GPIO13
GPIO16
GPIO0
CH_PU
GPIO2
GPIO4
GPIO5
CH_PU
GPIO14
GPIO12
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO5
URXD
UTXD
RST
TOUT
GPIO16
TOUT
SD_D3
SD_D0
SD_D1
UTXD
GND
GND
VDD33
GND
GNDGND
GND
VDD33
GND
VDD33
GND
GND
GND
GND
VDD33
GND
GND
GND
VDD33
GND
GND
GND
GND
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ANT1
1
2
C2
10pF
D1
LESD8D3.3CAT5G
J18
CON1
1
R1
12K±1%
J5
CON1
1
C7
TBD(NC)
C1
10pF
C3
0.1uF
L3
4.3nH
J10
CON1
1
J13
CON1
1
C8
1uF(NC)
J4
CON1
1
J15
CON1
1
J9
CON1
1
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK6/HOLD
7
VCC
8
L1
TBD
R3 200R
J12
CON1
1
J3
CON1
1
C4
TBD
L2
TBD
J8
CON1
1
C6
1uF
J2
CON1
1
U1
26MHz±10ppm
XIN
1
GND2XOUT
3
GND
4
J11
CON1
1
J7
CON1
1
J1
CON1
1
J14
CON1
1
U2ESP8266EX
VDDA1LNA2VDD3P33VDD3P34VDD_RTC5TOUT6CHIP_EN7XPD_DCDC
8
MTMS
9
MTDI
10
VDDPST
11
MTCK
12
MTDO
13
GPIO2
14
GPIO0
15
GPIO4
16
VDDPST
17
SD_DATA_2
18
SD_DATA_3
19
SD_CMD
20
SD_CLK
21
SD_DATA_0
22
SD_DATA_1
23
GPIO5
24
U0RXD
25
U0TXD
26
XTAL_OUT
27
XTAL_IN
28
VDDD
29
VDDA
30
RES12K
31
EXT_RSTB
32
GND
33
C5
10uF
J16
CON1
1
J6
CON1
1
R2 499R±1%
J17
CON1
1
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5. Schematics
!
Figure 5-2. ESP-WROOM-02U Schematics!
5
4
3
2
1
The values of C4, L1 and L2
vary with the actual PCB board.
The values of C1 and C2 vary with
the selection of the crystal.
GPIO15
RST
SD_D1
SD_D0
SD_CLK
SD_CMD
SD_D3
SD_D2
SD_CLK
SD_CMD
SD_D2
UTXDA
WIFI_ANT
GPIO14
GPIO12
URXD
GPIO13
GPIO16
GPIO0
CH_PU
GPIO2
GPIO4
GPIO5
CH_PU
GPIO14
GPIO12
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO5
URXD
UTXD
RST
TOUT
GPIO16
TOUT
SD_D3
SD_D0
SD_D1
UTXD
GND
GND
VDD33
GND
GNDGND
GND
GND
VDD33
GND
VDD33
GND
GND
GND
GND
VDD33
GND
GND
GND
VDD33
GND
GND
GND
GND
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A3
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A3
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C2
10pF
D1
LESD8D3.3CAT5G
J18
CON1
1
R1
12K±1%
J5
CON1
1
C7
0.1uF(NC)
C1
10pF
C3
0.1uF
L2
TBD
L3
4.3nH
J10
CON1
1
J13
CON1
1
C8
1uF(NC)
J4
CON1
1
J15
CON1
1
J9
CON1
1
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK6/HOLD
7
VCC
8
L1
TBD
R3 200R
J12
CON1
1
J3
CON1
1
J8
CON1
1
C6
1uF
J2
CON1
1
U1
26MHz±10ppm
XIN
1
GND2XOUT
3
GND
4
J11
CON1
1
CON1
IPEX
1
2
3
J7
CON1
1
J1
CON1
1
J14
CON1
1
U2
ESP8266EX
VDDA1LNA2VDD3P33VDD3P34VDD_RTC5TOUT6CHIP_EN7XPD_DCDC
8
MTMS
9
MTDI
10
VDDPST
11
MTCK
12
MTDO
13
GPIO2
14
GPIO0
15
GPIO4
16
VDDPST
17
SD_DATA_2
18
SD_DATA_3
19
SD_CMD
20
SD_CLK
21
SD_DATA_0
22
SD_DATA_1
23
GPIO5
24
U0RXD
25
U0TXD
26
XTAL_OUT
27
XTAL_IN
28
VDDD
29
VDDA
30
RES12K
31
EXT_RSTB
32
GND
33
C5
10uF
C4
TBD
J16
CON1
1
J6
CON1
1
R2 499R±1%
J17
CON1
1
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6. Peripheral Schematics

6. Peripheral Schematics

!
Figure 6-1. ESP-WROOM-02D/ESP-WROOM-02U Peripheral Schematics
EN IO14 IO12 IO13 IO15 IO2 IO0
IO16
IO5
IO4
ADC
RXD
RST
TXD
VDD33
GND
VDD33
GND
GND
GNDGND
GND
GND
J2
BOOT OPTION
1
2
U1
3V3
1
EN
2
IO14
3
IO12
4
IO13
5
IO15
6
IO2
7
IO0
8
GND1
9
IO4
10
RXD
11
TXD
12
GND2
13
IO5
14
RST
15
TOUT
16
IO16
17
GND3
18
P_GND
19
J1
UART DOWNLOAD
1
2
3
C2 0.1uF
C3 0.1uF
R2 10K
C1 10uF
R1 10K
📖 Note:
1. Soldering Pad 19 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste
is applied.
2. To ensure the power supply to the ESP8266EX chip during the power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 0.1 uF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset timing of the ESP8266 chip. For ESP8266EX’s Power-up and Reset Timing Diagram, please refer to Electrical Characteristics in ESP8266EX Datasheet.
3. To improve module’s anti-inference capability, it is advised to reserve an RC delay circuit at the RST pin.
The recommended setting for the RC delay circuit is usually R= 10 kΩ and C = 0.1 uF.
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7. Dimensions

7. Dimensions

!
Figure 7-1. ESP-WROOM-02D Dimensions!
Module Length
Unit: mm
Module Width
Top View
Side View
Bottom View
12.00±0.10
12.30±0.10
15.70±0.10
0.90±0.10
0.85±0.1
0.90±0.10
20.00±0.10
20.00±0.10
18.00±0.10
18.00±0.10
ESP-WROOM-02D DIMENSIONS
6.00±0.10
Antenna Area
1.50±0.10
0.90±0.10
1.50±0.10
12.00±0.10
PCB Thickness
Module Thickness
0.80±0.10
3.20±0.10
0.90±0.10
0.45±0.10
󳊺
0.50±0.10
4.00±0.10
4.00±0.10
6.00±0.10
4.30±0.10
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7. Dimensions
!
Figure 7-2. ESP-WROOM-02U Dimensions!
PCB Thickness
Module Thickness
Module Length
Unit: mm
Module Width
18.00±0.10
14.30±0.10
3.94±0.10
3.90±0.10
4.37±0.10
8.12±0.10
0.90±0.10
0.85±0.1
3.20±0.10
0.80±0.10
18.00±0.10
14.30±0.10
12.00±0.10
1.50±0.10
0.90±0.10
Top View
Side View
Bottom View
2.80±0.10
3.00±0.10
15.70±0.10
12.75±0.10
8.85±0.10
11.50±0.10
0.90±0.10
0.45±0.10
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8. Recommended PCB Land Pattern

8. Recommended PCB Land Pattern

!
Figure 8-1. Recommended PCB Land Pattern of ESP-WROOM-02D
Unit:mm
7.1
1.5x8=12
20
6
1.5
17.5
4
4.29
4
0.9
1
9
10
18
7.1
18
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8. Recommended PCB Land Pattern
!
Figure 8-2. Recommended PCB Land Pattern of ESP-WROOM-02U
Unit:mm
1.5x8=12
1.5
17.5
4
4.29
4
0.9
1
9
10
18
7.1
1.4
14.3
18
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9. U.FL Connector Dimensions

9. U.FL Connector Dimensions

!
Figure 8-1. Dimensions of ESP-WROOM-02U’s U.FL Connector!
Unit: mm
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Appendix A
A. Appendix—Learning
Resources

A.1. Must-Read Documents

ESP8266 Quick Start Guide
Description: This document is a quick user guide to getting started with ESP8266. It includes an introduction to the ESP-LAUNCHER, how to download firmware on to the board and run it, how to compile the AT application, structure and the debugging
method of RTOS SDK. Basic documentation and other related resources for the ESP8266 are also provided.
ESP8266 SDK Getting Started Guide
Description: This document takes ESP-LAUNCHER and ESP-WROOM-02U as examples to introduce how to use ESP8266 SDK. The contents include preparations
before compilation, SDK compilation and firmware download.
ESP-WROOM-02 PCB Design and Module Placement Guide
Description: The ESP-WROOM-02U module is designed to be soldered to a host PCB. This document compares six different placements of the antenna on a host board and
provides notes on designing PCB.
ESP8266 Hardware Resources
Description: This zip package includes manufacturing specifications of the ESP8266 board and the modules, manufacturing BOM and schematics.
ESP8266 AT Command Examples
Description: This document introduces some specific examples of using Espressif AT commands, including single connection as a TCP Client, UDP transmission and transparent transmission, and multiple connection as a TCP server.
ESP8266 AT Instruction Set
Description: This document provides lists of AT commands based on ESP8266_NONOS_SDK, including user-defined AT commands, basic AT commands,
Wi-Fi AT commands and TCP/IP-related AT commands. It also introduces the downloading of AT firmware into flash.
TCP/UDP UART Passthrough Test Demonstration
Description: This guide is intended to help users run a TCP & UDP passthrough test on the ESP8266 IoT platform.
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Appendix A
FAQ

A.2. Must-Have Resources

ESP8266 SDKs
Description: This website page provides links to the latest version of ESP8266 SDK and
the older ones.
ESP8266 Tools
Description: This website page provides links to the ESP8266 flash download tools and
ESP8266 performance evaluation tools.
ESP8266 App
ESP8266 Certification and Test Guide
ESP8266 BBS
ESP8266 Resources!
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged.
Copyright © 2020 Espressif Inc. All rights reserved.
Espressif IoT Team"
www.espressif.com
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