ESP32WROVERE &
ESP32WROVERIE
Datasheet
www.espressif.com
Version 1.4
Espressif Systems
Copyright © 2021
About This Document
This document provides the specifications for the ESP32-WROVER-E and ESP32-WROVER-IE modules.
Document Updates
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Contents
1 Overview 1
2 Block Diagram 3
3 Pin Definitions 4
3.1 Pin Layout 4
3.2 Pin Description 4
3.3 Strapping Pins 6
4 Functional Description 8
4.1 CPU and Internal Memory 8
4.2 External Flash and SRAM 8
4.3 Crystal Oscillators 8
4.4 RTC and Low-Power Management 9
5 Peripherals and Sensors 10
6 Electrical Characteristics 11
6.1 Absolute Maximum Ratings 11
6.2 Recommended Operating Conditions 11
6.3 DC Characteristics (3.3 V, 25 °C) 11
6.4 Wi-Fi Radio 12
6.5 BLE Radio 13
6.5.1 Receiver 13
6.5.2 Transmitter 13
6.6 Reflow Profile 14
7 Schematics 15
8 Peripheral Schematics 17
9 Physical Dimensions 18
10 Recommended PCB Land Pattern 19
11 U.FL Connector Dimensions 20
12 Learning Resources 21
12.1 Must-Read Documents 21
12.2 Must-Have Resources 21
Revision History 23
List of Tables
1 Ordering Information 1
2 ESP32-WROVER-E & ESP32-WROVER-IE Specifications 2
3 Pin Definitions 5
4 Strapping Pins 6
5 Absolute Maximum Ratings 11
6 Recommended Operating Conditions 11
7 DC Characteristics (3.3 V, 25 °C) 11
8 Wi-Fi Radio Characteristics 12
9 Receiver Characteristics – BLE 13
10 Transmitter Characteristics – BLE 13
List of Figures
1 ESP32-WROER-E Block Diagram 3
2 ESP32-WROVER-IE Block Diagram 3
3 Pin Layout (Top View) 4
4 Reflow Profile 14
5 Schematics of ESP32-WROVER-E 15
6 Schematics of ESP32-WROVER-IE 16
7 Peripheral Schematics 17
8 Physical Dimensions 18
9 Recommended PCB Land Pattern 19
10 U.FL Connector Dimensions 20
1 Overview
1 Overview
ESP32-WROVER-E and ESP32-WROVER-IE are two powerful, generic WiFi-BT-BLE MCU modules that target a
wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as
voice encoding, music streaming and MP3 decoding.
ESP32-WROVER-E comes with a PCB antenna, and ESP32-WROVER-IE with an IPEX antenna. They both
feature a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM (PSRAM). The information in
this datasheet is applicable to both modules.
The ordering information of the two modules is listed as follows:
Table 1: Ordering Information
Module Chip embedded Flash PSRAM Module dimensions (mm)
ESP32-WROVER-E (PCB)
ESP32-WROVER-IE (IPEX)
ESP32-D0WD-V3 4 MB
Notes:
1. The module with 8 MB flash or 16 MB flash is available for custom order.
2. For detailed ordering information, please see Espressif Product Ordering Information.
3. For dimensions of the IPEX connector, please see Chapter 11.
1
8 MB (18.00±0.15)×(31.40±0.15)×(3.30±0.15)
At the core of the module is the ESP32-D0WD-V3 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The chip also has a low-power co-processor that can be used instead of the CPU to
save power while performing tasks that do not require much computing power, such as monitoring of
peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth®, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2 provides the specifications of the two modules.
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1 Overview
Table 2: ESP32WROVERE & ESP32WROVERIE Specifications
Categories Items Specifications
Certification RF certification FCC/CE-RED/SRRC
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Wi-Fi
Protocols
A-MPDU and A-MSDU aggregation and 0.4 µs guard in-
terval support
Frequency range 2412 ~ 2484 MHz
Protocols Bluetooth v4.2 BR/EDR and BLE specification
NZIF receiver with –97 dBm sensitivity
Bluetooth
Radio
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
Module interfaces
I2S, IR, pulse counter, GPIO, capacitive touch sensor,
ADC, DAC, Two-Wire Automotive Interface (TWAI®, com-
patible with ISO11898-1)
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Hardware
Integrated SPI flash 4 MB
Integrated PSRAM 8 MB
Operating voltage/Power supply 3.0 V ~ 3.6 V
Minimum current delivered by
power supply
Recommended operating tem-
perature range
500 mA
–40 °C ~ 85 °C
Package size (18.00±0.15) mm × (31.40±0.15) mm × (3.30±0.15) mm
Moisture sensitivity level (MSL) Level 3
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2 Block Diagram
ESP32-D0WD-V3
RF Matching
40 MHz
Crystal3V3
ESP32-WROVER-E
EN GPIOs
Antenna
SPI FLASH
SPICS0
FLASH_CLK
SPIDI
SPIDO
SPIWP
SPIHD
VDD_SDIO
SPI PSRAM
PSRAM_CLK
SPICS1
VDD_SDIO
SIO0
SIO1
SIO2
SIO3
SPI FLASH
ESP32-D0WD-V3
RF Matching
40 MHz
Crystal
SPICS0
FLASH_CLK
SPIDI
SPIDO
SPIWP
SPIHD
3V3
VDD_SDIO
ESP32-WROVER-IE
EN GPIOs
Antenna
SPI PSRAM
PSRAM_CLK
SPICS1
VDD_SDIO
SIO0
SIO1
SIO2
SIO3
2 Block Diagram
Figure 1: ESP32WROERE Block Diagram
Figure 2: ESP32WROVERIE Block Diagram
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3 Pin Definitions
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
15
16
17
18
19
GND
IO13
NC
NC
NC
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
NC
NC
IO4
IO0
Pin 39
GND
Keepout Zone
GND
GND GND GND
GND
GNDGNDGND
24
23
22
21
20
IO2
IO15
NC
NC
NC
3 Pin Definitions
3.1 Pin Layout
Figure 3: Pin Layout (Top View)
3.2 Pin Description
The module has 38 pins. See pin definitions in Table 3.
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3 Pin Definitions
Table 3: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
IO32 8 I/O
IO33 9 I/O
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O
IO12 14 I/O
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
NC * 17 - -
NC * 18 - -
NC * 19 - -
NC * 20 - -
NC * 21 - -
NC * 22 - -
IO15 23 -
IO2 24 I/O
IO0 25 I/O
IO4 26 I/O
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
NC 27 - -
NC 28 - -
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
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3 Pin Definitions
Name No. Type Function
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins GPIO6 to GPIO11 on the ESP32-D0WD-V3 chip are connected to the SPI flash integrated on the module and are
not led out.
3.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 7 Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
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3 Pin Definitions
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default
FE Sampling
FE Output
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• FE: falling-edge, RE: rising-edge.
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• Internal pull-up resistor (R9) for MTDI is not populated in the module, as the flash and SRAM in the module only
support a power voltage of 3.3 V (output by VDD_SDIO).
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4 Functional Description
4 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROVER-E and
ESP32-WROVER-IE.
4.1 CPU and Internal Memory
ESP32-D0WD-V3 contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory
includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
4.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
ESP32-WROVER-E and ESP32-WROVER-IE integrate a 4 MB SPI flash and an 8 MB PSRAM for more memory
space.
4.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
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4 Functional Description
4.4 RTC and LowPower Management
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.
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5 Peripherals and Sensors
5 Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected
to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s integrated PSRAM.
For details, please see Section 7 Schematics.
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6 Electrical Characteristics
6 Electrical Characteristics
6.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
1
I
output
T
store
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX in ESP32 Datasheet for IO’s power domain.
Cumulative IO output current - 1,100 mA
Storage temperature –40 85 °C
6.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
I
V DD
Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
6.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
C
V
V
I
I
V
V
IN
IH
IL
IH
IL
OH
OL
Pin capacitance - 2 - pF
High-level input voltage 0.75×VDD
1
- VDD1+0.3 V
Low-level input voltage –0.3 - 0.25×VDD1V
High-level input current - - 50 nA
Low-level input current - - 50 nA
High-level output voltage 0.8×VDD
1
- - V
Low-level output voltage - - 0.1×VDD1V
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6 Electrical Characteristics
Symbol Parameter Min Typ Max Unit
VDD3P3_CPU
power domain
1, 2
VDD3P3_RTC
power domain
1, 2
VDD_SDIO power
domain
1, 3
- 40 - mA
- 40 - mA
- 20 - mA
I
OH
High-level source current
(VDD1= 3.3 V,
VOH>= 2.64 V,
output drive strength set
to the maximum)
Low-level sink current
I
OL
(VDD1= 3.3 V, VOL= 0.495 V,
- 28 - mA
output drive strength set to the maximum)
R
P U
R
P D
V
IL_nRS T
Notes:
1. Please see Appendix IO_MUX in ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
Resistance of internal pull-up resistor - 45 - kΩ
Resistance of internal pull-down resistor - 45 - kΩ
Low-level input voltage of CHIP_PU
- - 0.6 V
to power off the chip
6.4 WiFi Radio
Parameter Condition Min Typical Max Unit
Operating frequency range
Output impedance
TX power
Sensitivity
Adjacent channel rejection
note3
note2
Table 8: WiFi Radio Characteristics
note1
- 2412 - 2484 MHz
- - * - Ω
11n, MCS7 12 13 14 dBm
11b mode 18.5 19.5 20.5 dBm
11b, 1 Mbps - –97 - dBm
11b, 11 Mbps - –88 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –75 - dBm
11n, HT20, MCS0 - –92 - dBm
11n, HT20, MCS7 - –72 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
11g, 6 Mbps - 27 - dB
11g, 54 Mbps - 13 - dB
11n, HT20, MCS0 - 27 - dB
11n, HT20, MCS7 - 12 - dB
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6 Electrical Characteristics
Notes:
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
6.5 BLE Radio
6.5.1 Receiver
Table 9: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - –94 –93 –92 dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation - –36 - - dBm
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm
6.5.2 Transmitter
Table 10: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –52 - dBm
Adjacent channel transmit power
∆ f 1
avg
∆ f 2
max
∆ f 2
avg
/∆ f 1
avg
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
- - - 265 kHz
- 247 - - kHz
- - +0.92 - -
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6 Electrical Characteristics
50
150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
6.6 Reflow Profile
Note:
Solder the module in a single reflow.
Figure 4: Reflow Profile
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4
3
2
1
Pin.1
GND
Pin.2
3V3
Pin.3
EN
Pin.4
SENSOR_ VP
Pin.5
SENSOR_ VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.23
IO15
Pin.37
IO23
Pin.36
IO22
Pin.28
NC
Pin.32
NC
Pin.27
NC
Pin.25
IO0
Pin.35
TXD0
Pin.30
IO18
Pin.26
IO4
Pin.34
RXD0
Pin.29
IO5
Pin.33
IO21
Pin.31
IO19
PCB ANTENNA
EPAD
Pin.14
IO12
Pin.20
NC
Pin.21
NC
Pin.22
NC
Pin.24
IO2
Pin.38
GND
Pin.15
GND
Pin.16
IO13
Pin.17
NC
Pin.18
NC
Pin.19
NC
Flash and PSRAM
The values of C1 and C2 vary with
the selection of the crystal.
The value of R2 varies with the actual
PCB board.
NC: No component.
The values of C15, L4 and C14
vary with the actual PCB board.
GPIO16
SRAM_CLK
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
FLASH_CLK
SCS/CMD
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SCK/CLK
GPIO17
SDO/SD0
SWP/SD3
SHD/SD2
SDI/SD1
EN
GPIO35
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
U0RXD
GPIO22
GPIO21
LNA_IN
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO5
GPIO18
GPIO23
GPIO19
RF_ANT
U0TXD
EN
SENSOR_VP
GPIO35
GPIO32
SENSOR_VN
GPIO34
GPIO12
GPIO12
GPIO13
GPIO23
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO4
GPIO0
GPIO2
GPIO15
ANT2
ANT1
SRAM_CLK
FLASH_CLK
GND
VDD_SDIO
GND
GND
VDD_SDIO
VDD33
VDD_SDIO
GND
VDD33
GND
GND
GND
GND
VDD33
GND
GND
GND
GND
GND
GND
GND
VDD33
GND
GND
GND
VDD33
GND
GND
VDD33
GND
GND
GND
VDD33
GND
VDD33
GND
GND
VDD_SDIO
GND
C14
TBD
R3 499
R15 0
C9
0.1uF
U4
PSRAM
CS#
1
SO/SIO1
2
SIO2
3
VSS4SI/SIO0
5
SCLK
6
SIO3
7
VDD
8
R13 0
R12 0
C10
0.1uF
C20
1uF
C11
1uF
C4
0.1uF
D1
LESD8D3.3CAT5G
C2
TBD
R1 20K(5%)
R10
10K
C1
TBD
C13
10uF
C15
TBD
C6
3.3nF/6.3V(10%)
R4
NC
R14
0(NC)
C19
0.1uF
C21
NC
L5 2.0nH
ANT1
PCB_ANT
1
2
C5
10nF/6.3V(10%)
R9
10K(NC)
C24
1uF
R11
0(NC)
J39
IPEX(NC)
1
2
3
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK
6
/HOLD
7
VCC
8
C3
100pF
U2
ESP32-D0WD-V3
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO2615GPIO2716MTMS17MTDI18VDD3P3_RTC19MTCK20MTDO21GPIO222GPIO023GPIO4
24
VDD_SDIO
26
GPIO16
25
GPIO17
27
SD_DATA_2
28
SD_DATA_3
29
SD_CMD
30
SD_CLK
31
SD_DATA_0
32
GND
49
SD_DATA_1
33
GPIO5
34
GPIO18
35
GPIO19
38
CAP2
47
VDDA
43
XTAL_N
44
XTAL_P
45
GPIO23
36
U0TXD
41
GPIO2239GPIO21
42
VDD3P3_CPU
37
CAP1
48
VDDA
46
U0RXD
40
R2
0U140MHz(±10ppm)
XIN1GND
2
XOUT
3
GND
4
L4 TBD
Espressif Systems 15
7 Schematics
7 Schematics
This is the reference design of the module.
Submit Documentation Feedback
ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
Figure 5: Schematics of ESP32WROVERE
4
3
2
1
Pin.1
GND
Pin.2
3V3
Pin.3
EN
Pin.4
SENSOR_ VP
Pin.5
SENSOR_ VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.23
IO15
Pin.37
IO23
Pin.36
IO22
Pin.28
NC
Pin.32
NC
Pin.27
NC
Pin.25
IO0
Pin.35
TXD0
Pin.30
IO18
Pin.26
IO4
Pin.34
RXD0
Pin.29
IO5
Pin.33
IO21
Pin.31
IO19
PCB ANTENNA
EPAD
Pin.14
IO12
Pin.20
NC
Pin.21
NC
Pin.22
NC
Pin.24
IO2
Pin.38
GND
Pin.15
GND
Pin.16
IO13
Pin.17
NC
Pin.18
NC
Pin.19
NC
Flash and PSRAM
The values of C1 and C2 vary with
the selection of the crystal.
The value of R2 varies with the actual
PCB board.
NC: No component.
The values of C15, L4 and C14
vary with the actual PCB board.
GPIO16
SRAM_CLK
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
FLASH_CLK
SCS/CMD
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SCK/CLK
GPIO17
SDO/SD0
SWP/SD3
SHD/SD2
SDI/SD1
EN
GPIO35
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
U0RXD
GPIO22
GPIO21
LNA_IN
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO5
GPIO18
GPIO23
GPIO19
RF_ANT
U0TXD
EN
SENSOR_VP
GPIO35
GPIO32
SENSOR_VN
GPIO34
GPIO12
GPIO12
GPIO13
GPIO23
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO4
GPIO0
GPIO2
GPIO15
ANT2
ANT1
SRAM_CLK
FLASH_CLK
GND
VDD_SDIO
GND
GND
VDD_SDIO
VDD33
VDD_SDIO
GND
VDD33
GND
GND
GND
GND
VDD33
GND
GND
GND
GND
GND
GND
GND
VDD33
GND
GND
GND
VDD33
GND
GND
VDD33
GND
GND
GND
VDD33
GND
VDD33
GND
GND
VDD_SDIO
GND
C14
TBD
R3 499
R15 0(NC)
C9
0.1uF
U4
PSRAM
CS#
1
SO/SIO1
2
SIO2
3
VSS4SI/SIO0
5
SCLK
6
SIO3
7
VDD
8
R13 0
R12 0
C10
0.1uF
C20
1uF
C11
1uF
C4
0.1uF
D1
LESD8D3.3CAT5G
C2
TBD
R1 20K(5%)
R10
10K
C1
TBD
C13
10uF
C15
TBD
C6
3.3nF/6.3V(10%)
R4
NC
R14 0
C19
0.1uF
C21
NC
L5 2.0nH
ANT1
PCB_ANT
1
2
C5
10nF/6.3V(10%)
R9
10K(NC)
C24
1uF
R11
0(NC)
J39
IPEX
1
2
3
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK
6
/HOLD
7
VCC
8
C3
100pF
U2
ESP32-D0WD-V3
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO2615GPIO2716MTMS17MTDI18VDD3P3_RTC19MTCK20MTDO21GPIO222GPIO023GPIO4
24
VDD_SDIO
26
GPIO16
25
GPIO17
27
SD_DATA_2
28
SD_DATA_3
29
SD_CMD
30
SD_CLK
31
SD_DATA_0
32
GND
49
SD_DATA_1
33
GPIO5
34
GPIO18
35
GPIO19
38
CAP2
47
VDDA
43
XTAL_N
44
XTAL_P
45
GPIO23
36
U0TXD
41
GPIO2239GPIO21
42
VDD3P3_CPU
37
CAP1
48
VDDA
46
U0RXD
40
R2
0U140MHz(±10ppm)
XIN1GND
2
XOUT
3
GND
4
L4 TBD
Espressif Systems 16
7 Schematics
Submit Documentation Feedback
ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
Figure 6: Schematics of ESP32WROVERIE
8 Peripheral Schematics
4
3
2
D
C
B
IO12 should be kept low when the module is powered on.
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO13
IO22
TXD0
RXD0
IO21
IO19
IO18
IO4
IO0
IO5
IO23
IO15
IO2
IO12
ENIO14 TMS
IO12 TDI
IO13 TCK
IO15 TDO
GND
VDD33
GND
VDD33
GND
GND
GND
GND
GND
SW1
R1
TBD
R2 0R
JP2
Boot Option
112
2
C2
0.1uF
JP1
UART
1
1
2
2
3
3
4
4
JP3
JTAG
1
1
2
2
3
3
4
4
C3
TBD
U1
ESP32-WROVER-E/ESP32-WROVER-IE
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND2
15
IO13
16
NC
17
NC
18
NC
19
NC
20
NC
21
NC
22
IO15
23
IO2
24
IO0
25
IO4
26
NC
27
NC
28
IO5
29
IO18
30
IO19
31
NC
32
IO21
33
RXD0
34
TXD0
35
IO22
36
IO23
37
GND3
38
P_GND
39
C4 0.1uF
C1
22uF
8 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
Figure 7: Peripheral Schematics
Note:
• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin.
The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters
should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP32 Datasheet.
Espressif Systems 17
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
0.1
10.50
18.00±0.15
31.40±0.15
6.22
23.05
15.84
24.09
0.57
1.10
1.27
0.45
0.90
3.70
3.70
0.85
10.45
3.72
0.80
3.30±0.15
16.16
Top View
Side View
Bottom View
Unit: mm
6.22
2.25
0.50
0.50
0.90
0.85
0.90
Espressif Systems 18
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9 Physical Dimensions
9 Physical Dimensions
ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
Figure 8: Physical Dimensions
10 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
Antenna Area
1
19
20
38
38x1.50
38x0.90
18.00
31.40
1.27
1.10
6.22
0.50
22.86
3.70
0.90
0.50
3.70
0.90
0.50
16.16
7.50
10 Recommended PCB Land Pattern
Figure 9: Recommended PCB Land Pattern
Espressif Systems 19
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
11 U.FL Connector Dimensions
Unit: mm
11 U.FL Connector Dimensions
Figure 10: U.FL Connector Dimensions
Espressif Systems 20
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
12 Learning Resources
12 Learning Resources
12.1 MustRead Documents
The following link provides documents related to ESP32.
• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.
• ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
• ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
• ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
• ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
• ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
• ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
• Espressif Products Ordering Information
12.2 MustHave Resources
Here are the ESP32-related must-have resources.
• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.
• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.
Espressif Systems 21
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
12 Learning Resources
• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.
Espressif Systems 22
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
Revision History
Revision History
Date Version Release notes
2021-02-09 V1.4
2021-02-02 V1.3
2020-11-02 V1.2
2020-06-11 V1.1
Updated Figure 8: Physical Dimensions
Updated Figure 9: Recommended PCB Land Pattern
Updated the trade mark from TWAI™ to TWAI
Modified the note below Figure 4: Reow Prole
Deleted Reset Circuit and Discharge Circuit for VDD33 Rail in Section 8: Periph-
eral Schematics
Updated Figure 3.1: Pin Layout
Added a note to EPAD in Section 10: Recommended PCB Land Pattern
Updated the note to RC delay circuit in Section 8: Peripheral Schematics
Updated the following figures:
• Figure 1: ESP32-WROER-E Block Diagram
• Figure 2: ESP32-WROVER-IE Block Diagram
®
2020-05-22 V1.0 Official release
Espressif Systems 23
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4
www.espressif.com
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Copyright © 2021 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
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