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ESP32WROOM32E16
Datasheet
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ESPRESSIF SYSTEMS ESP32WROOM32E16 Datasheet

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ESP32WROOM32E & ESP32WROOM32UE
Datasheet
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Version 1.2
Espressif Systems
Copyright © 2021
About This Document
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1 Module Overview

1 Module Overview

1.1 Features

MCU
• ESP32-D0WD-V3 embedded, Xtensa®dual-core
32-bit LX6 microprocessor, up to 240 MHz
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions
• 16 KB SRAM in RTC
WiFi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth
®
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
• AFH
• CVSD and SBC
Hardware
• Interfaces: SD card, UART, SPI, SDIO, I2C, LED
PWM, Motor PWM, I2S, IR, pulse counter, GPIO,
capacitive touch sensor, ADC, DAC, Two-Wire
Automotive Interface (TWAI®, compatible with
ISO11898-1)
• 40 MHz crystal oscillator
• 4 MB SPI flash
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating temperature range: –40 ~ 85 °C
• Dimensions: See Table 1
Certification
• Bluetooth certification: BQB
• RF certification: FCC/CE-RED/SRRC
• Class-1, class-2 and class-3 transmitter
• Green certification: REACH/RoHS

1.2 Description

ESP32-WROOM-32E and ESP32-WROOM-32UE are two powerful, generic Wi-Fi+BT+BLE MCU modules that
target a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks,
such as voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32E comes with a PCB antenna, and ESP32-WROOM-32UE with an IPEX antenna. They both
feature a 4 MB external SPI flash. The information in this datasheet is applicable to both modules.
The ordering information of the two modules is listed as follows:
Table 1: Ordering Information
Module Chip embedded Flash Module dimensions (mm)
ESP32-WROOM-32E (PCB)
ESP32-WROOM-32UE (IPEX) 18.0 × 19.2 × 3.2
Notes:
1. The module with 8 MB flash or 16 MB flash is available for custom order.
2. For detailed ordering information, please see Espressif Product Ordering Information.
3. For dimensions of the IPEX connector, please see Chapter 7.3.
ESP32-D0WD-V3 4 MB
18.0 × 25.5 × 3.1
1
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1 Module Overview
At the core of the module is the ESP32-D0WD-V3 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The chip also has a low-power co-processor that can be used instead of the CPU to
save power while performing tasks that do not require much computing power, such as monitoring of
peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth®, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.

1.3 Applications

• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications
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Contents
Contents
1 Module Overview 3
1.1 Features 3
1.2 Description 3
1.3 Applications 4
2 Block Diagram 9
3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 10
3.3 Strapping Pins 12
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics 15
4.4.1 Current Consumption Depending on RF Modes 15
4.5 Wi-Fi RF Characteristics 16
4.5.1 Wi-Fi RF Standards 16
4.5.2 Transmitter Characteristics 16
4.5.3 Receiver Characteristics 17
4.6 Bluetooth Radio 18
4.6.1 Receiver – Basic Data Rate 18
4.6.2 Transmitter – Basic Data Rate 18
4.6.3 Receiver – Enhanced Data Rate 19
4.6.4 Transmitter – Enhanced Data Rate 19
4.7 Bluetooth LE Radio 20
4.7.1 Receiver 20
4.7.2 Transmitter 20
5 Schematics 22
6 Peripheral Schematics 24
7 Physical Dimensions and PCB Layout 25
7.1 Physical Dimensions 25
7.2 Recommended PCB Land Pattern 27
7.3 U.FL Connector Dimensions 29
8 Product Handling 30
8.1 Storage Condition 30
8.2 ESD 30
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Contents
8.3 Reflow Profile 30
9 MAC Addresses and eFuse 31
10 Learning Resources 32
10.1 Must-Read Documents 32
10.2 Must-Have Resources 32
Revision History 34
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List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 11
3 Strapping Pins 12
4 Absolute Maximum Ratings 14
5 Recommended Operating Conditions 14
6 DC Characteristics (3.3 V, 25 °C) 14
7 Current Consumption Depending on RF Modes 15
8 Wi-Fi RF Standards 16
9 Transmitter Characteristics 16
10 Receiver Characteristics 17
11 Receiver Characteristics – Basic Data Rate 18
12 Transmitter Characteristics – Basic Data Rate 18
13 Receiver Characteristics – Enhanced Data Rate 19
14 Transmitter Characteristics – Enhanced Data Rate 19
15 Receiver Characteristics – BLE 20
16 Transmitter Characteristics – BLE 20
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
List of Figures
List of Figures
1 ESP32-WROOM-32E Block Diagram 9
2 ESP32-WROOM-32UE Block Diagram 9
3 Pin Layout of ESP32-WROOM-32E (Top View) 10
4 ESP32-WROOM-32E Schematics 22
5 ESP32-WROOM-32UE Schematics 23
6 ESP32-WROOM-32E & ESP32-WROOM-32UE Peripheral Schematics 24
7 ESP32-WROOM-32E Physical Dimensions 25
8 ESP32-WROOM-32UE Physical Dimensions 26
9 ESP32-WROOM-32E Recommended PCB Land Pattern 27
10 ESP32-WROOM-32UE Recommended PCB Land Pattern 28
11 U.FL Connector Dimensions 29
12 Reflow Profile 30
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2 Block Diagram

SPI Flash
ESP32-D0WD-V3
RF Matching
40 MHz
Crystal
SPICS
SPICLK
SPIDI
SPIDO
SPIHD
SPIWP
3V3
VDD_SDIO
ESP32-WROOM-32E
EN GPIOs
Antenna
SPI Flash
ESP32-D0WD-V3
RF Matching
40 MHz
Crystal
SPICS
SPICLK
SPIDI
SPIDO
SPIHD
SPIWP
3V3
VDD_SDIO
ESP32-WROOM-32UE
EN GPIOs
Antenna
IPEX
2 Block Diagram
Figure 1: ESP32WROOM32E Block Diagram
Figure 2: ESP32WROOM32UE Block Diagram
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3 Pin Definitions

1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
15
16
17
18
19
20
21
22
23
24
GND
IO13
NC
NC
NC
NC
NC
NC
IO15
IO2
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
IO17
IO16
IO4
IO0
Pin 39
GND
Keepout Zone
GND
GND GND GND
GND
GNDGNDGND
3 Pin Definitions

3.1 Pin Layout

Figure 3: Pin Layout of ESP32WROOM32E (Top View)
Note:
• The pin layout of ESP32-WROOM-32UE is the same as that of ESP32-WROOM-32E, except that ESP32-WROOM-
32UE has no keepout zone.
• The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please
refer to Section 7.1 Physical Dimensions.

3.2 Pin Description

The module has 38 pins. See pin definitions in Table 2.
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3 Pin Definitions
Table 2: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
High: On; enables the chip
EN 3 I
Low: Off; the chip powers off
Note: Do not leave the pin floating.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
IO32 8 I/O
IO33 9 I/O
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O
IO12 14 I/O
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
NC 17 - See note 1 under the table.
NC 18 - See note 1 under the table.
NC 19 - See note 1 under the table.
NC 20 - See note 1 under the table.
NC 21 - See note 1 under the table.
NC 22 - See note 1 under the table.
IO15 23 I/O
IO2 24 I/O
IO0 25 I/O
IO4 26 I/O
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
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3 Pin Definitions
Name No. Type Function
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Note:
1. Pins GPIO6 to GPIO11 on the ESP32-D0WD-V3 chip are connected to the SPI flash integrated on the module and
are not led out.
2. For peripheral pin configurations, please refer to ESP32 Datasheet.

3.3 Strapping Pins

ESP32 has five strapping pins: MTDI, GPIO0, GPIO2, MTDO, GPIO5. The pin-pin mapping between ESP32 and
the module is as follows, which can be seen in Chapter 5 Schematics:
• MTDI = IO12
• GPIO0 = BOOT/IO0
• GPIO2 = IO2
• MTDO = IO15
• GPIO5 = IO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
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3 Pin Definitions
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Pin Default
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• FE: falling-edge, RE: rising-edge.
Timing of SDIO Slave
FE Sampling
FE Output
Booting Mode
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave”, after booting.
• The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up.
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4 Electrical Characteristics

4 Electrical Characteristics

4.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
T
ST ORE
Note:
Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
Storage temperature –40 85 °C

4.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
I
V DD
Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85 °C
Humidity Humidity condition — 85 — %RH

4.3 DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
C
V
V
I
I
V
V
IN
IH
IL
IH
IL
OH
OL
Pin capacitance - 2 - pF
High-level input voltage 0.75×VDD
1
- VDD1+0.3 V
Low-level input voltage –0.3 - 0.25×VDD1V
High-level input current - - 50 nA
Low-level input current - - 50 nA
High-level output voltage 0.8×VDD
1
- - V
Low-level output voltage - - 0.1×VDD1V
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4 Electrical Characteristics
Symbol Parameter Min Typ Max Unit
VDD3P3_CPU
power domain
1, 2
VDD3P3_RTC
power domain
1, 2
VDD_SDIO power
domain
1, 3
- 40 - mA
- 40 - mA
- 20 - mA
I
OH
High-level source current
(VDD1= 3.3 V,
VOH>= 2.64 V,
output drive strength set
to the maximum)
Low-level sink current
I
OL
(VDD1= 3.3 V, VOL= 0.495 V,
- 28 - mA
output drive strength set to the maximum)
R
R
V
Note:
P U
P D
IL_nRS T
Resistance of internal pull-up resistor - 45 - kΩ
Resistance of internal pull-down resistor - 45 - kΩ
Low-level input voltage of CHIP_PU
- - 0.6 V
to power off the chip
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular
power domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually
reduced from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.

4.4.1 Current Consumption Depending on RF Modes

Table 7: Current Consumption Depending on RF Modes
Work mode Description Average (mA) Peak (mA)
802.11b, 20 MHz, 1 Mbps, @19.5 dBm 239 379
TX
Active (RF working)
RX
802.11g, 20 MHz, 54 Mbps, @15 dBm 190 276
802.11n, 20 MHz, MCS7, @13 dBm 183 258
802.11n, 40 MHz, MCS7, @13 dBm 165 211
802.11b/g/n 112 112
802.11n, 40 MHz 118 118
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4 Electrical Characteristics
Note:
• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.
• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
Table 8: WiFi RF Standards
Name Description
Center frequency range of operating channel
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate
20 MHz
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, IPEX antenna
note1
2412 ~ 2484 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
Note:
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center
frequency range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.

4.5.2 Transmitter Characteristics

Table 9: Transmitter Characteristics
Parameter Rate Typ Unit
11b, 1 Mbps 19.5
11b, 11 Mbps 19.5
11g, 6 Mbps 18
TX Power
note
11g, 54 Mbps 14
11n, HT20, MCS0 18
11n, HT20, MCS7 13
11n, HT40, MCS0 18
11n, HT40, MCS7 13
dBm
Note:
Target TX power is configurable based on device or certification requirements.
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4 Electrical Characteristics
4.5.3 Receiver Characteristics
Table 10: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity
RX Maximum Input Level
Adjacent Channel Rejection
1 Mbps –97
2 Mbps –94
5.5 Mbps –92
11 Mbps –88
6 Mbps –93
9 Mbps –91
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –77
54 Mbps –75
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –86
11n, HT20, MCS3 –83
11n, HT20, MCS4 –80
11n, HT20, MCS5 –76
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –80
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
11n, HT40, MCS7 –69
11b, 1 Mbps 5
11b, 11 Mbps 5
11g, 6 Mbps 0
11g, 54 Mbps –8
11n, HT20, MCS0 0
11n, HT20, MCS7 –8
11n, HT40, MCS0 0
11n, HT40, MCS7 –8
11b, 11 Mbps 35
11g, 6 Mbps 27
11g, 54 Mbps 13
11n, HT20, MCS0 27
11n, HT20, MCS7 12
dBm
dBm
dB
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4 Electrical Characteristics
Parameter Rate Typ Unit
11n, HT40, MCS0 16
11n, HT40, MCS7 7

4.6 Bluetooth Radio

4.6.1 Receiver – Basic Data Rate

Table 11: Receiver Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit
Sensitivity @0.1% BER - –90 –89 –88 dBm
Maximum received signal @0.1% BER - 0 - - dBm
Co-channel C/I - - +7 - dB
F = F0 + 1 MHz - - –6 dB
F = F0 – 1 MHz - - –6 dB
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation - –36 - - dBm
F = F0 + 2 MHz - - –25 dB
F = F0 – 2 MHz - - –33 dB
F = F0 + 3 MHz - - –25 dB
F = F0 – 3 MHz - - –45 dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm

4.6.2 Transmitter – Basic Data Rate

Table 12: Transmitter Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 12) - - 0 - dBm
Gain control step - - 3 - dB
RF power control range - –12 - +9 dBm
+20 dB bandwidth - - 0.9 - MHz
F = F0 ± 2 MHz - –55 - dBm
Adjacent channel transmit power
∆ f1
avg
∆ f2
max
∆ f2
avg
/∆ f1
avg
ICFT - - –7 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift (DH1) - - 6 - kHz
Drift (DH5) - - 6 - kHz
F = F0 ± 3 MHz - –55 - dBm
F = F0 ± > 3 MHz - –59 - dBm
- - - 155 kHz
- 127 - - kHz
- - 0.92 - -
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4 Electrical Characteristics
Note:
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the
power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding
transmit power is 0 dBm.

4.6.3 Receiver – Enhanced Data Rate

Table 13: Receiver Characteristics – Enhanced Data Rate
Parameter Conditions Min Typ Max Unit
π/4 DQPSK
Sensitivity @0.01% BER - –90 –89 –88 dBm
Maximum received signal @0.01% BER - - 0 - dBm
Co-channel C/I - - 11 - dB
F = F0 + 1 MHz - –7 - dB
F = F0 – 1 MHz - –7 - dB
Adjacent channel selectivity C/I
Sensitivity @0.01% BER - –84 –83 –82 dBm
Maximum received signal @0.01% BER - - –5 - dBm
C/I c-channel - - 18 - dB
Adjacent channel selectivity C/I
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
8DPSK
F = F0 + 1 MHz - 2 - dB
F = F0 – 1 MHz - 2 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –25 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –38 - dB

4.6.4 Transmitter – Enhanced Data Rate

Table 14: Transmitter Characteristics – Enhanced Data Rate
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 12) - - 0 - dBm
Gain control step - - 3 - dB
RF power control range - –12 - +9 dBm
π/4 DQPSK max w0 - - –0.72 - kHz
π/4 DQPSK max wi - - –6 - kHz
π/4 DQPSK max |wi + w0| - - –7.42 - kHz
8DPSK max w0 - - 0.7 - kHz
8DPSK max wi - - –9.6 - kHz
8DPSK max |wi + w0| - - –10 - kHz
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
4 Electrical Characteristics
Parameter Conditions Min Typ Max Unit
RMS DEVM - 4.28 - %
π/4 DQPSK modulation accuracy
8 DPSK modulation accuracy
In-band spurious emissions
EDR differential phase coding - - 100 - %
99% DEVM - 100 - %
Peak DEVM - 13.3 - %
RMS DEVM - 5.8 - %
99% DEVM - 100 - %
Peak DEVM - 14 - %
F = F0 ± 1 MHz - –46 - dBm
F = F0 ± 2 MHz - –44 - dBm
F = F0 ± 3 MHz - –49 - dBm
F = F0 +/– > 3 MHz - - –53 dBm

4.7 Bluetooth LE Radio

4.7.1 Receiver

Table 15: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - –94 –93 –92 dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation - –36 - - dBm
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm

4.7.2 Transmitter

Table 16: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 12) - - 0 - dBm
Gain control step - - 3 - dB
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –55 - dBm
Adjacent channel transmit power
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F = F0 ± 3 MHz - –57 - dBm
ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
4 Electrical Characteristics
Parameter Conditions Min Typ Max Unit
F = F0 ± > 3 MHz - –59 - dBm
∆ f1
∆ f2
∆ f2
avg
max
avg
/∆ f1
avg
- - - 265 kHz
- 210 - - kHz
- - +0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
5
4
3
2
1
EPAD
PCB ANTENNA
Pin.14 IO12
Pin.1 GND
Pin.2 3V3
Pin.3 EN
Pin.6 IO34
Pin.5 SENSOR_ VN
Pin.4 SENSOR_ VP
Pin.7 IO35
Pin.8 IO32
Pin.9 IO33
Pin.10 IO25
Pin.11 IO26
Pin.12 IO27
Pin.13 IO14
Pin.15
GND
Pin.16
IO13
Pin.17NCPin.18NCPin.19
NC
Pin.23
IO15
Pin.20NCPin.21NCPin.22
NC
Pin.24
IO2
Pin.37 IO23
Pin.36 IO22
Pin.28 IO17
Pin.32 NC
Pin.27 IO16
Pin.25 IO0
Pin.35 TXD0
Pin.30 IO18
Pin.26 IO4
Pin.34 RXD0
Pin.29 IO5
Pin.33 IO21
Pin.31 IO19
Pin.38 GND
The values of C1 an d C2 vary with the selection of the crystal.
The value of R 2 varies with the actual PCB boar d.
NC: No component.
The values of C15, L4 and C14 vary with the actual PCB board.
SENSOR_VP
SENSOR_VN
GPIO32
GPIO33
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO2
CHIP_PU
GPIO34
GPIO35
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
GPIO32
U0TXD
GPIO33 GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18 GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
GPIO23
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
GND
GND
GND
VDD_SDIO
GND
GNDGND
GNDGND
GND
GND
GND
VDD33
GND
GNDGND
GND
GND
GND
GND GND
VDD33
GND
VDD33
GND
GND
GNDGND
VDD33
VDD33
VDD33
GND
VDD_SDIO
VDD33
C18
1uF
R1 20K(5%)
C5
10nF/6.3V(10%)
C12
NC
C10
0.1uF
C19
0.1uF
C20
1uF
C3
100pF
L5 2.0nH
C2
TBD
C14
TBD
R2 0
L4 TBD
C17
NC
C6
3.3nF/6.3V(10%)
C9
0.1uF
C16
NC
C4
0.1uF
ANT1
PCB_ANT
1 2
C21
NC
C15
TBD
D1 LESD8D3.3CAT5G
U1
40MHz(±10ppm）
XIN1GND
2
XOUT
3
GND
4
R3 499
C11
1uF
C13
10uF
U2
ESP32-D0WD-V3
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO2615GPIO2716MTMS17MTDI18VDD3P3_RTC19MTCK20MTDO21GPIO222GPIO023GPIO4
24
VDD_SDIO
26
GPIO16
25
GPIO17
27
SD_DATA_2
28
SD_DATA_3
29
SD_CMD
30
SD_CLK
31
SD_DATA_0
32
GND
49
SD_DATA_1
33
GPIO5
34
GPIO18
35
GPIO19
38
CAP2
47
VDDA
43
XTAL_N
44
XTAL_P
45
GPIO23
36
U0TXD
41
GPIO2239GPIO21
42
VDD3P3_CPU
37
CAP1
48
VDDA
46
U0RXD
40
C1
TBD
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK
6
/HOLD
7
VCC
8
Espressif Systems 22
5 Schematics
This is the reference design of the module.

5 Schematics

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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
Figure 4: ESP32WROOM32E Schematics
5
4
3
2
1
Pin.14 IO12
Pin.1 GND
Pin.2 3V3
Pin.3 EN
Pin.6 IO34
Pin.5 SENSOR_ VN
Pin.4 SENSOR_ VP
Pin.7 IO35
Pin.8 IO32
Pin.9 IO33
Pin.10 IO25
Pin.11 IO26
Pin.12 IO27
Pin.13 IO14
Pin.15
GND
Pin.16
IO13
Pin.17NCPin.18NCPin.19
NC
Pin.23
IO15
Pin.20NCPin.21NCPin.22
NC
Pin.24
IO2
Pin.37 IO23
Pin.36 IO22
Pin.28 IO17
Pin.32 NC
Pin.27 IO16
Pin.25 IO0
Pin.35 TXD0
Pin.30 IO18
Pin.26 IO4
Pin.34 RXD0
Pin.29 IO5
Pin.33 IO21
Pin.31 IO19
Pin.38 GND
The values of C1 and C2 vary with the selection of the crystal.
The value of R 2 varies with the actual PCB boar d.
NC: No component.
The values of C15, L4 and C14 vary with the actual PCB board.
EPAD
SENSOR_VP
SENSOR_VN
GPIO32
GPIO33
EN
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO2
EN
GPIO34
GPIO35
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
GPIO32
U0TXD
GPIO33 GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18 GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
GPIO23
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
LNA_IN
GND
GND
GND
VDD_SDIO
GND
GNDGND
GND
GND
GND
VDD33
GND
GNDGND
GND
GND
GND
GND GND
VDD33
GND
VDD33
GND
GND
GNDGND
VDD33
VDD33
VDD33
GND
VDD_SDIO
VDD33
GND
R1 20K(5%)
C18
1uF
C5
10nF/6.3V(10%)
C19
0.1uF
C10
0.1uF
L5 2.0nH
C3
100pF
C20
1uF
J39
IPEX
1
2
3
C14
TBD
C2
TBD
R2 0
L4 TBD
C9
0.1uF
C6
3.3nF/6.3V(10%)
C4
0.1uF
C21
NC
D1 LESD8D3.3CAT5G
C15
TBD
R3 499
U1
40MHz(±10ppm）
XIN1GND
2
XOUT
3
GND
4
C13
10uF
C11
1uF
U3
FLASH
/CS
1
DO
2
/WP
3
GND
4
DI
5
CLK
6
/HOLD
7
VCC
8
C1
TBD
U2
ESP32-D0WD-V3
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO2615GPIO2716MTMS17MTDI18VDD3P3_RTC19MTCK20MTDO21GPIO222GPIO023GPIO4
24
VDD_SDIO
26
GPIO16
25
GPIO17
27
SD_DATA_2
28
SD_DATA_3
29
SD_CMD
30
SD_CLK
31
SD_DATA_0
32
GND
49
SD_DATA_1
33
GPIO5
34
GPIO18
35
GPIO19
38
CAP2
47
VDDA
43
XTAL_N
44
XTAL_P
45
GPIO23
36
U0TXD
41
GPIO2239GPIO21
42
VDD3P3_CPU
37
CAP1
48
VDDA
46
U0RXD
40
Espressif Systems 23
5 Schematics
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
Figure 5: ESP32WROOM32UE Schematics

6 Peripheral Schematics

5
4
3
IO12 should be kept low when the module is powered on.
EN
TXD0 RXD0
IO0
IO13
IO15
IO14
IO23 IO22
IO21
IO19 IO18 IO5
IO4
IO2
SENSOR_VP SENSOR_VN
IO34 IO35 IO32 IO33 IO25 IO26 IO27
IO17 IO16
ENIO14 TMS IO12 TDI IO13 TCK IO15 TDO
IO12
GND
GND
GND
VDD33
GND
GND
VDD33
GND
GND
C1
22uF
C3
TBD
JP2 Boot Option
112
2
U1
ESP32-WROOM-32E/ESP32-WROOM-32UE
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND3
38
IO23
37
IO22
36
TXD0
35
RXD0
34
IO21
33
NC
32
IO19
31
IO18
30
IO5
29
IO17
28
IO16
27
IO4
26
IO0
25
GND215IO1316NC17NC18NC19NC20NC21NC22IO1523IO2
24
P_GND
39
C4 0.1uF
JP3
JTAG
1
1
2
2
3
3
4
4
SW1
R1
TBD
C2
0.1uF
R2 0R
JP1
UART
1
1
2
2
3
3
4
4
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
Figure 6: ESP32WROOM32E & ESP32WROOM32UE Peripheral Schematics
Note:
• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin.
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters
should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP32 Datasheet.
Espressif Systems 24
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
7 Physical Dimensions and PCB Layout
25.50±0.15
18.00±0.15
11.43
8.89
1.50
1.27
16.51
15.80
17.60
Ø0.50
0.90
0.45
0.85
0.90
10.50
10.29
3.70
3.70
0.50
0.50
6.19
3.10±0.15
0.80
1.05
Top View
Side View
Bottom View
0.90
0.85
0.1
Unit: mm
6.19
7 Physical Dimensions and PCB Layout

7.1 Physical Dimensions

Figure 7: ESP32WROOM32E Physical Dimensions
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
7 Physical Dimensions and PCB Layout
Unit: mm
18.00±0.15
11.43
8.89
1.50
1.27
16.51
15.65
17.50
0.90
0.45
0.85
0.90
3.70
3.70
0.50
0.50
0.80
Top View
Side View
Bottom View
0.90
0.85
0.1
19.20±0.15
10.50
3.27
3.07
3.20±0.15
10.75
13.05
1.15
1.18
10.67
Figure 8: ESP32WROOM32UE Physical Dimensions
Espressif Systems 26
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
7 Physical Dimensions and PCB Layout
Unit: mm
Copper
Via for thermal pad
Antenna Area
1
14
15
24
25
38
18.00
25.50
38x1.50
38x0.90
0.50
1.50
1.27
1.27
3.28
1.50
0.50
0.90
0.50
3.70
0.90
0.50
3.70
7.50
10.29
16.51
6.19
11.43

7.2 Recommended PCB Land Pattern

Figure 9: ESP32WROOM32E Recommended PCB Land Pattern
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
7 Physical Dimensions and PCB Layout
Unit: mm
Copper
Via for thermal pad
1
14
15
24
25
38
18.00
19.20
38x1.50
38x0.90
0.50
1.50
1.27
1.27
3.28
1.50
0.50
0.90
0.50
3.70
0.90
0.50
3.70
7.50
10.67
16.51
11.43
Figure 10: ESP32WROOM32UE Recommended PCB Land Pattern
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
7 Physical Dimensions and PCB Layout
Unit: mm
7.3 U.FL Connector Dimensions
Figure 11: U.FL Connector Dimensions
Espressif Systems 29
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2

8 Product Handling

50
150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
8 Product Handling

8.1 Storage Condition

The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric
environment of < 40 °C/90% RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and 60% RH.
The module needs to be baked if the above conditions are not met.

8.2 ESD

• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V

8.3 Reflow Profile

Note:
Figure 12: Reflow Profile
Solder the module in a single reflow.
Espressif Systems 30
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
9 MAC Addresses and eFuse
9 MAC Addresses and eFuse
The eFuse in ESP32 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station, AP,
BLE, and Ethernet modes correspond to mac_address in the following way:
• Station mode: mac_address
• AP mode: mac_address + 1
• BLE mode: mac_address + 2
• Ethernet mode: mac_address + 3
In the 1 Kbit eFuse, 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
Espressif Systems 31
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
10 Learning Resources
10 Learning Resources
10.1 MustRead Documents
The following link provides documents related to ESP32.
• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.
• ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
• ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
• ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
• ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
• ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
• ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
• Espressif Products Ordering Information
10.2 MustHave Resources
Here are the ESP32-related must-have resources.
• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.
• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.
Espressif Systems 32
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
10 Learning Resources
• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.
Espressif Systems 33
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
Revision History
Revision History
Date Version Release notes
Updated Figure 9: ESP32-WROOM-32E Recommended PCB Land Pattern, Fig-
ure 10: ESP32-WROOM-32UE Recommended PCB Land Pattern, Figure 7:
2021-02-09 V1.2
2020-11-02 V1.1
2020-05-29 V1.0 Official release.
2020-05-18 V0.5 Preliminary release.
ESP32-WROOM-32E Physical Dimensions, and Figure 8: ESP32-WROOM-32UE
Physical Dimensions.
Modified the note below Figure 12: Reow Prole.
Updated the trade mark from TWAI™ to TWAI®.
Updated the table 7.
Added a note to EPAD in Section 7.2 Recommended PCB Land Pattern.
Updated the note to RC circuit in Section 6 Peripheral Schematics.
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ESP32-WROOM-32E & ESP32-WROOM-32UE Datasheet v1.2
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