ESPRESSIF SYSTEMS ESP32S2WROVER User Manual

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ESP32-S2-WROVER

User Manual

Prelease version 0.1

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About This Document

This document provides the specifications for the ESP32-S2-WROVER module.

Revision History

For revision history of this document, please refer to the last page.

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subscribe at www.espressif.com/en/subscribe.

Certification

Download certificates for Espressif products from www.espressif.com/en/certificates.

Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS

PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-

ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE

ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.

All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-

ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights

are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a

registered trademark of Bluetooth SIG.

All trade names, trademarks and registered trademarks mentioned in this document are property of their respective

owners, and are hereby acknowledged.

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1. Module Overview

1.1 Features

MCU

• ESP32-S2 embedded, Xtensa®single-core 32-bit

LX7 microprocessor, up to 240 MHz

• 128 KB ROM

• 320 KB SRAM

• 16 KB SRAM in RTC

Wi-Fi

• 802.11 b/g/n

• Bit rate: 802.11n up to 150 Mbps

• A-MPDU and A-MSDU aggregation

• 0.4 µs guard interval support

Hardware

• Interfaces: GPIO, SPI, LCD, UART, I2C, I2S, Cam-

era interface, IR, pulse counter, LED PWM, USB

OTG 1.1, ADC, DAC, touch sensor, temperature

sensor

• 40 MHz crystal oscillator

• 4 MB SPI flash

• 2 MB PSRAM

• Operating voltage/Power supply: 3.0 ~ 3.6 V

•

Operating temperature range: –40 ~ 85 °C

• Dimensions: (18 × 31 × 3.3) mm

Certification

• Green certification: RoHS/REACH

Test

•

Operating frequency range: 2412 ~ 2462 MHz

• HTOL/HTSL/uHAST/TCT/ESD

1.2 Description

ESP32-S2-WROVER is a powerful, generic Wi-Fi MCU module that has a rich set of peripherals. This module is

an ideal choice for a wide variety of application scenarios relating to Internet of Things (IoT), wearable electronics

and smart home.

This module is provided in two versions: one with a PCB antenna, the other with an Dipole antenna.

ESP32-S2-WROVER features a 4 MB external SPI flash and an additional 2 MB SPI Pseudo static RAM (PSRAM).

The information in this datasheet is applicable to both modules.

The ordering information on the two variants of ESP32-S2-WROVER is listed as follows:

Table 1: ESP32-S2-WROVER Ordering Information

Module Chip embedded Flash PSRAM Module dimensions (mm)

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ESP32-S2-WROVER (PCB)

ESP32-S2-WROVER-I (Dipole)

Notes:

The module with various capacities of flash or flash is available for custom order.

ESP32-S2 4 MB 2 MB (18.00±0.10)×(31.00±0.10)×(3.30±0.10)

At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The user

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1. Module Overview

can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for

changes or crossing of thresholds. ESP32-S2 integrates a rich set of peripherals, ranging from SPI, I²S, UART, I²C,

LED PWM, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed

USB On-The-Go (OTG) interface to enable USB communication.

Note:

* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.

1.3 Applications

• Generic Low-power IoT Sensor Hub

• Generic Low-power IoT Data Loggers

• Cameras for Video Streaming

• Over-the-top (OTT) Devices

• USB Devices

• Speech Recognition

• Image Recognition

• Mesh Network

• Home Automation

• Smart Home Control Panel

• Smart Building

• Industrial Automation

• Smart Agriculture

• Audio Applications

• Health Care Applications

• Wi-Fi-enabled Toys

• Wearable Electronics

• Retail & Catering Applications

• Smart POS Machines

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LIST OF TABLES

List of Tables

1 ESP32-S2-WROVER Ordering Information 3

2 Pin Definitions 10

3 Strapping Pins 11

4 Absolute Maximum Ratings 13

5 Recommended Operating Conditions 13

6 DC Characteristics (3.3 V, 25 °C) 13

7 Current Consumption Depending on RF Modes 14

8 Current Consumption Depending on Work Modes 14

9 Wi-Fi RF Standards 15

10 Transmitter Characteristics 15

11 Receiver Characteristics 15

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LIST OF FIGURES

List of Figures

1 Block Diagram 8

2 Pin Layout of ESP32-S2-WROVER (Top View) 9

3 ESP32-S2-WROVER Schematics 17

4 ESP32-S2-WROVER Peripheral Schematics 18

5 ESP32-S2-WROVER Physical Dimensions 19

6 Recommended PCB Land Pattern 20

7 Reflow Profile 21

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3. Pin Definitions

PCB Antenna

GND

IO46

IO45

RXD0

TXD0

IO42

IO41

IO40

IO39

IO38

IO37

IO36

IO35

IO34

IO33

GND

3V3

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

IO8

IO9

IO10

IO11

IO12

IO13

43 GND

IO14

IO15

IO16

IO17

IO18

IO19

IO20

IO21

IO26

26 GND

3. Pin Definitions

3.1 Pin Layout

Note:

The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer

to Figure 7.1 Physical Dimensions.

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Figure 2: Pin Layout of ESP32-S2-WROVER (Top View)

3.2 Pin Description

ESP32-S2-WROVER has 42 pins. See pin definitions in Table 2.

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3. Pin Definitions

Table 2: Pin Definitions

Name No. Type Function

GND 1 P Ground

3V3 2 P Power supply

IO0 3 I/O/T RTC_GPIO0, GPIO0

IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0

IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1

IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2

IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3

IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4

IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5

IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6

IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7

IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD

IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4

IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5

IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6

IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7

IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS

IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P

IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N

IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1

IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3

IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-

IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+

IO21 24 I/O/T RTC_GPIO21, GPIO21

IO26 25 I/O/T SPICS1, GPIO26

GND 26 P Ground

IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD

IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0

IO35 29 I/O/T SPIIO6, GPIO35, FSPID

IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK

IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ

IO38 32 I/O/T GPIO38, FSPIWP

IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3

IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2

IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1

IO42 36 I/O/T MTMS, GPIO42

TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1

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RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2

IO45 39 I/O/T GPIO45

IO46 40 I GPIO46

High: on, enables the chip.

EN 41 I

Low: off, the chip powers off.

Note: Do not leave the EN pin floating.

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3. Pin Definitions

Name No. Type Function

GND 42 P Ground

Notice:

• By default, IO26 is connected to the CS side of the PSRAM. If PSRAM is not a must, IO26 can be used as a regular

GPIO.

• For peripheral pin configurations, please refer to ESP32-S2 Datasheet.

3.3 Strapping Pins

ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and the

module is as follows, which can be seen in Chapter 5 Schematics:

• GPIO0 = IO0

• GPIO45 = IO45

• GPIO46 = IO46

Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.

During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog

reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping

bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.

IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected

external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these

strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host

MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.

After reset, the strapping pins work as normal-function pins.

Refer to Table 3 for a detailed boot-mode configuration of the strapping pins.

Table 3: Strapping Pins

VDD_SPI Voltage

Pin Default 3.3 V 1.8 V

IO45

Pin Default SPI Boot Download Boot

IO0 Pull-up 1 0

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IO46 Pull-down Don’t-care 0

Pin Default Enabled Disabled

IO46 Pull-down See the fourth note See the fourth note

Pull-down 0 1

Booting Mode

Enabling/Disabling ROM Code Print During Booting

3 4

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3. Pin Definitions

Note:

1. Firmware can configure register bits to change the settings of ”VDD_SDIO Voltage”.

2. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash and SRAM in ESP32-S2-WROVER

work at 3.3 V by default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is

powered up by external circuit.

3. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.

4. When eFuse UART_PRINT_CONTROL value is:

0, print is normal during boot and not controlled by IO46.

1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.

2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.

3, print is disabled and not controlled by IO46.

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4. Electrical Characteristics

4.1 Absolute Maximum Ratings

Table 4: Absolute Maximum Ratings

Symbol Parameter

VDD33 Power supply voltage

ST O RE

Storage temperature

Min Max

–0.3 3.6

–40 150

Unit

°C

4.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions

Symbol Parameter

VDD33 Power supply voltage

V DD

T Operating temperature

Humidity Humidity condition

Current delivered by external power supply

Min Typ Max

3.0 3.3 3.6

0.5 — —

–40 —

— 85 —

Unit

°C

%RH

4.3 DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter

P U

P D

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IH _nRST

IL_nRS T

Pin capacitance

High-level input voltage

Low-level input voltage

High-level input current

Low-level input current

High-level output voltage

Low-level output voltage

High-level source current (VDD = 3.3 V, VOH>=

2.64 V, PAD_DRIVER = 3)

Low-level sink current (VDD = 3.3 V, VOL=

0.495 V, PAD_DRIVER = 3)

Pull-up resistor

Pull-down resistor

Chip reset release voltage

Chip reset voltage

Min Typ Max

— 2 —

0.75 × VDD — VDD + 0.3

–0.3 — 0.25 × VDD

— — 50

0.8 × VDD — —

— — 0.1 × VDD

— 40 —

— 28 —

— 45 —

0.75 × VDD — VDD + 0.3

–0.3 — 0.25 × VDD

Unit

kΩ

Note:

VDD is the I/O voltage for a particular power domain of pins.

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4. Electrical Characteristics

4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, ESP32-S2-WROVER can switch between different

power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in

ESP32-S2 Datasheet.

The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF

port. All transmitters’ measurements are based on a 50% duty cycle.

Table 7: Current Consumption Depending on RF Modes

Work mode Description Average Peak

190 mA 310 mA

145 mA 220 mA

135 mA 200 mA

120 mA 160 mA

Active (RF working)

802.11b, 20 MHz, 1 Mbps, @21.14 dBm

802.11g, 20 MHz, 54 Mbps, @22.75dBm

802.11n, 20 MHz, MCS7, @23.06dBm

802.11n, 40 MHz, MCS7, @22.53 dBm

802.11b/g/n, 20 MHz 63 mA 63 mA

802.11n, 40 MHz 68 mA 68 mA

Note:

The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.

Table 8: Current Consumption Depending on Work Modes

Work mode Description Power consumption (Typ)

Modem-sleep

Light-sleep — 550 µA

Deep-sleep

Power off CHIP_PU is set to low level, the chip is powered off. 0.5 µA

Note:

• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache

idle.

The CPU is

powered on

The ULP co-processor is powered on. 220 µA

240 MHz 21 mA

160 MHz 17 mA

Normal speed: 80 MHz 14 mA

ULP sensor-monitored pattern 7 µA @1% duty

RTC timer + RTC memory 10 µA

RTC timer only 5 µA

• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-

tion changes accordingly.

• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and

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the peripherals used.

• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to

operate.

• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-

cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 7 µA.

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4. Electrical Characteristics

4.5 Wi-Fi RF Characteristics

4.5.1 Wi-Fi RF Standards

Table 9: Wi-Fi RF Standards

Name Description

Operating frequency range

Wi-Fi wireless standard IEEE 802.11b/g/n

Data rate

Antenna type PCB antenna, Dipole antenna

1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency range is configurable by software.

For the modules that use Dipole antennas, the output impedance is 50 Ω. For other modules without Dipole antennas,

2. users do not need to concern about the output impedance.

note1

2412 ~ 2462 MHz

11b: 1, 2, 5.5 and 11 Mbps

20 MHz

11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

11n: MCS0-7, 72.2 Mbps (Max)

40 MHz 11n: MCS0-7, 150 Mbps (Max)

4.5.2 Transmitter Characteristics

Table 10: Transmitter Characteristics

Parameter Rate Typ Unit

TX Power

note1

11b, 1 Mbps

11g, 6 Mbps

11n, HT20, MCS0

11n, HT40, MCS0

1. Target TX power is configurable based on device or certification requirements.

4.5.3 Receiver Characteristics

Table 11: Receiver Characteristics

21.14

22.75

23.06

22.53

dBm

Espressif Systems

Parameter Rate Typ Unit

RX Sensitivity 1 Mbps –97 dBm

2 Mbps –95

5.5 Mbps –93

11 Mbps –88

6 Mbps –92

9 Mbps –91

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4. Electrical Characteristics

Parameter Rate Typ Unit

RX Maximum Input Level 11b, 1 Mbps 5 dBm

Adjacent Channel Rejection 11b, 11 Mbps 35 dB

12 Mbps –89

18 Mbps –87

24 Mbps –84

36 Mbps –80

48 Mbps –76

54 Mbps –75

11n, HT20, MCS0 –92

11n, HT20, MCS1 –88

11n, HT20, MCS2 –85

11n, HT20, MCS3 –83

11n, HT20, MCS4 –79

11n, HT20, MCS5 –75

11n, HT20, MCS6 –74

11n, HT20, MCS7 –72

11n, HT40, MCS0 –89

11n, HT40, MCS1 –86

11n, HT40, MCS2 –83

11n, HT40, MCS3 –80

11n, HT40, MCS4 –76

11n, HT40, MCS5 –72

11n, HT40, MCS6 –71

11n, HT40, MCS7 –69

11b, 11 Mbps 5

11g, 6 Mbps 5

11g, 54 Mbps 0

11n, HT20, MCS0 5

11n, HT20, MCS7 0

11n, HT40, MCS0 5

11n, HT40, MCS7 0

11g, 6 Mbps 31

11g, 54 Mbps 14

11n, HT20, MCS0 31

11n, HT20, MCS7 13

11n, HT40, MCS0 19

11n, HT40, MCS7 8

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7. Physical Dimensions and PCB Land Pattern

31.00

18.00

0.80

3.30

1.50

0.45

0.90

0.85

15.45

10.19

4.00

2.25

0.45

ESP32-S2-WROVER Dimensions

Unit: mm Tolerance: +/-0.10mm

Top View

Side View

Bottom View

6.30

8.35

23.10

15.84

19.30

10.44

1.50

1.00

0.50

1.00

0.50

0.85

0.90

1.00

2.25

7. Physical Dimensions and PCB Land Pattern

7.1 Physical Dimensions

Figure 5: ESP32-S2-WROVER Physical Dimensions

Note:

• Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermal

performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.

• To ensure the power supply to the ESP32-S2 chip during power-up, it is advised to add an RC delay circuit at the

EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 0.1 µF. However, specific

parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence

timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to Section Power

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Scheme in ESP32-S2 Datasheet.

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7. Physical Dimensions and PCB Land Pattern

42x0.90

42x1.50

0.50

1.00

2.25

1.50

15.45

Antenna Area

18.00

31.00

Unit: mm

6.30

Copper

4.10

1.10

0.40

1.10

0.40

Via for thermal pad

7.81

7.2 Recommended PCB Land Pattern

Figure 6: Recommended PCB Land Pattern

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8. Product Handling

150

1 ~ 3℃/s

200

250

200

-1 ~ -5℃/s

Cooling zone

100

217

100 250

Reﬂow zone

!217℃ 60 ~ 90s

Temperature (℃)

Preheating zone

150 ~ 200℃ 60 ~ 120s

Ramp-up zone

Peak Temp.

235 ~ 250℃

Soldering time

> 30s

Time (sec.)

Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s Reﬂow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s

Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s Solder — Sn&Ag&Cu Lead-free solder (SAC305)

8. Product Handling

8.1 Storage Condition

The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment

of < 40 °C/90%RH.

MSL 3 and floorlife: 168 hrs �30 °C/60%RH

8.2 ESD

• Human body model (HBM): 2000 V

• Charged-device model (CDM): 500 V

• Air discharge: 8000 V

• Contact discharge: 6000 V

8.3 Reflow Profile

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Espressif Systems

Figure 7: Reflow Profile

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9. MAC Addresses and eFuse

The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station

and AP modes correspond to mac_address in the following way:

• Station mode: mac_address

• AP mode: mac_address + 1

There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read

disable controller. Six of them can be used to store encrypted key or user data, and one is only used to store user

data.

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Revision History

Date Version Release notes

2019.09 V0.1 Preliminary release

FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.

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Regulatory Module Integration Instructions

2.2 List of applicable FCC rules

This device complies with part 15.247 of the FCC Rules.

2.3 Summarize the specific operational use conditions

This module can be used in household electrical appliances as well as lighting

equipments. The input voltage to the module should be nominally 3.0~3.6 VDC ,typical

value 3.3VDC and the ambient temperature of the module should not exceed 85℃.

This module us

Dipole antenan with maximum gain is 2.33dBi .Other antenna arrangement is not covered

by this certification.The antenna is not field replaceable. If the antenna needs to be changed,

the certification

2.4 Limited module procedures

Not applicable

2.5 Trace antenna designs

Not applicable

2.6 RF exposure considerations

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

ing two kinds of antennas ,PCB antenan with maximum gain is 3.40dBi .

should be re-applied.

environment .

20cm between the radiator& your body. If the device built into a host as a portable usage,

the additional RF exposure evaluation may be required as specified by§ 2.1093.

This equipment should be installed and operated with minimum distance

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2.7 Antennas

Module contains one PCB antenna and Dipole antenna.

2.8 Label and compliance information

The outside of final products that contains this module device must display a label

referring to the enclosed module. This exterior label can use wording such as: “Contains

Transmitter Module FCC ID: 2AC7Z-ESP32S2WROVER ”,or “Contains

FCC ID: 2AC7Z-ESP32S2WROVER ”, Any similar wording that expresses the same meaning may

be used.

2.9 Information on test modes and additional testing requirements

a) The modular transmitter has been fully tested by the module grantee on the required

number of channels, modulation types, and modes, it should not be necessary for the

host installer to re-test all the available transmitter modes or settings. It is

recommended that the host product manufacturer, installing the modular transmitter,

perform some investigative measurements to confirm that the resulting composite

system does not exceed the spurious emissions limits or band edge limits (e.g., where a

different antenna may be causing additional emissions).

b) The testing should check for emissions that may occur due to the intermixing of

emissions with the other transmitters, digital circuitry, or due to physical properties of

the host product (enclosure). This investigation is especially important when integrating

multiple modular transmitters where the certification is based on testing each of them in

a stand-alone configuration. It is important to note that host product manufacturers

should not assume that because the modular transmitter is certified that they do not

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WRG1 User Manual

have any responsibility for final product compliance.

c) If the investigation indicates a compliance concern the host product manufacturer is

obligated to mitigate the issue. Host products using a modular transmitter are subject to

all the applicable individual technical rules as well as to the general conditions of

operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of

the host product will be obligated to stop operating the device until the interference has

been corrected

Below are steps for TX verification：

wpriv mp_start //enter MP mode

iwpriv mp_channel 1 //set channel to 1 . 2, 3, 4~11 etc.

iwpriv mp_bandwidth 40M=0,shortGI=0 //40M=0 set 20M mode and long GI，

40M=1 set 40M mode

iwpriv mp_ant_tx a //select antenna A for operation

iwpriv mp_txpower patha=44,pathb=44 //set path A and path B Tx power level

iwpriv mp_rate 108 //set OFDM data rate to 54Mbps,ex:

CCK 1M = 2, CCK 5.5M = 11, KK, OFDM54M = 108 N Mode: MCS0 = 128, MCS1

= 129…..etc.

iwpriv mp_ctx background,pkt //start packet continuous Tx

iwpriv mp_ctx stop //stop continuous Tx

2.10 Additional testing, Part 15 subpart B disclaimer

The final host / module combination need to be evaluated against the FCC Part 15B

criteria for unintentional radiators in order to be properly authorized for operation as a Part

15 digital device.

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The host integrator installing

composite product complies with the FCC requirements by a technical assessment or

evaluation to the FCC rules, including the transmitter operation and should refer to

guidance in KDB 996369.

Frequency spectrum to be investigated

For host products with certified modular transmitter, the frequency range of investigation

of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3), or the

range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the

higher frequency range of investigation.

Operating the host product

this module into their product must ensure that the final

When testing the host product, all the transmitters must be operating.The transmitters can

be enabled by using publicly-available drivers and turned on, so the transmitters are

active. In certain conditions it might be appropriate to use a technology-specific call box

(test set) where accessory devices or drivers are not available.

When testing for emissions from the unintentional radiator, the transmitter shall be placed

in the receive mode or idle mode, if possible. If receive mode only is not possible then, the

radio shall be passive (preferred) and/or active scanning. In these cases, this would need

to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the

unintentional radiator circuitry is enabled. Testing laboratories may need to add

attenuation or filters depending on the signal strength of any active beacons (if applicable)

from the enabled radio(s). See ANSI C63.4, ANSI C63.10 and ANSI C63.26 for further

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general testing details.