EPoX Computer KP6-LA User Manual
KP6-LA
A Pentium® II Processor based
AGP mainboard
TRADEMARK
All products and company names are trademarks or
registered trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.5
September 9, 1997
KP6-LA
KP6-LA
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. If your retailer can not help, you may E-Mail
us with any questions at the following address tech@epox.com.
Record your serial number before installing your KP6-LA mainboard. (the serial
number is located near the ISA slots at the edge of the board)
EPoX KP6-LA serial number:
__________________________
BIOS Upgrades
Please use either our Web Site or BBS for current BIOS Upgrades.
Internet Access
http://www.epox.com
sales@epox.com
tech@epox.com
Modem Access
886-2-218-0997 (Taiwan)
31-182-618451 (The Netherlands)
You can access this number via a Hayes-compatible modem with a 2,400 to
28,800 baud rate. The following setup format is required:
8 Data Bits, No Parity, 1 Stop Bit.
If your modem is unable to connect at higher baud rates, try connecting at
2,400 baud before contacting Technical Support.
© Copyright 1997 EPoX Computer Company. All rights reserved.
Thank you for using EPoX mainboards!
KP6-LA
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language
in any form by any means without the express written permission of EPoX Computer
Company (hereinafter referred to as EPoX) except documentation kept by the
purchaser for backup purposes.
EPoX provides this manual “as is” without warranty of any kind, either express or
implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall EPoX be liable for
any loss or profits, loss of business, loss of use or data, interruption of business or
for indirect, special incidental, or consequential damages of any kind, even if EPoX
has been advised of the possibility of such damages arising from any defect or error
in the manual or product. EPoX may review this manual from time to time without
notice. For updated BIOS, drivers, or product release information you may visit
EPoX’s home page at: http://www.epox.com
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks or
copyrights of their respective companies.
The product name and revision number are both printed on the mainboard
itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the KP6-LA and
any other device in your system with care and avoid unneccessary contact with
system components on the mainboard.
Always work on an antistatic surface to avoid possible damage to the motherboard
from static discharge.
We assume no responsibility for any damage to the KP6-LA mainboard that results
from failure to follow installation instructions or failure to observe safety precautions.
CAUTION
The KP6-LA mainboard is subject to
damage by static electricity. Always
observe the handling procedures.
KP6-LA
KP6-LA
KP6-LA
Section 1 Introduction
Components Checklist .................................1-1
Overview
Pentium II ...................................................1-2
S.E.C. Cartridge Terminology .....................1-3
Accelerated Graphics Port ...........................1-4
Hardware Monitoring ..................................1-4
Desktop Management Interface ...................1-4
LANDesk Client Manager ........................... 1-4
KP6-LA Form-Factor ..................................1-6
I/O Shield Connector...................................1-7
Power-On/Off (Remote) ..............................1-7
System Block Diagram................................1-8
Table of Contents
Section 2 Features
KP6-LA Features.........................................2-1
Section 3 Installation
KP6-LA Detailed Layout.............................3-2
Easy Installation Procedure
Configure Jumpers ......................................3-3
System Memory Configuration .................... 3-5
Installing a Pentium® II Processor................3-9
Device Connectors ......................................3-11
Section 4 Award BIOS Setup
BIOS Instructions........................................4-1
Standard CMOS Setup ................................4-2
BIOS Features Setup ................................... 4-3
Chipset Features Setup ................................ 4-8
Power Management Setup ...........................4-13
PNP/PCI Configuration ...............................4-16
Load Setup Defaults ....................................4-18
Integrated Peripherals .................................. 4-19
Change Supervisor or User Password ..........4-23
IDE HDD Auto Detection............................4-24
HDD Low Level Format..............................4-26
Save & Exit Setup .......................................4-26
Exit Without Saving ....................................4-27
Section 5 DMI
DMI Access ................................................5-1
Section 7 Appendix
KP6-LA
Appendix A
Memory Map ............................................... A-1
I/O Map.......................................................A-1
Timer & DMA Channels Map .....................A-2
Interrupt Map .............................................. A-2
RTC & CMOS RAM Map...........................A-3
Appendix B
POST Codes................................................ A-5
Unexpected Errors .......................................A-8
Appendix C
Load Setup Defaults ....................................A-9
Components Checklist
E
P
o
X
C
D
-
o
m
ü A. (1) KP6-LA mainboard
ü B. (1) KP6-LA user’s manual
ü C. (1) Floppy ribbon cable
ü D. (2) Hard drive ribbon cables
ü E. (1) Retention Module
ü F. (1) Heatsink Support Unit
ü G. (1) PS/2 to AT keyboard connector adapter (option)
ü H. (1) Bus master drivers
(1) DMI (option)
IntroductionKP6-LA
Section 1
INTRODUCTION
USERS
MANUAL
KP6-LA
B
A
Top Half
Bottom Half
E
F
C
G
D
R
or
H
Page 1-1
Introduction KP6-LA
Overview
Pentium II
The Pentium® II Processor is the follow-on to the Pentium® Processor. The
Pentium® II Processor, like the Pentium® Pro processor, implements a Dynamic
Execution micro-architecture -- a unique combination of multiple branch prediction,
data flow analysis, and speculative execution. This enables the Pentium® II Processor to deliver higher performance than the Pentium® processor, while maintaining
binary compatibility with all previous Intel architecture processors.
A significant feature of the Pentium® II Processor, from a system perspective, is the
built-in direct multiprocessing support. In order to achieve multiprocessing, and
maintain the memory and I/O bandwidth to support it, new system designs are
needed. For systems with dual processors, it is important to consider the additional
power burdens and signal integrity issues of supporting multiple loads on a high
speed bus. The Pentium® II Processor card supports both uni-processor and dual
processor implementations.
The Pentium® II Processor utilizes Single Edge Contact (S.E.C.) (Figure 1) cartridge
packaging technology. The S.E.C. cartridge allows the L2 cache to remain tightly
coupled to the processor, while maintaining flexibility when implementing high
performance processors into OEM systems. The second level cache is performance
optimized and tested at the cartridge level. The S.E.C. cartridge utilizes surface
mounted core components and a printed circuit board with an edge finger connection. The S.E.C. cartridge package introduced on the Pentium® II Processor will also
be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement.
The full enclosure also protects the surface mount components. The edge finger
connection maintains socketabilty for system configuration. The edge finger connector is denoted as ‘Slot 1 connector’ in this and other documentation.
The entire enclosed product is called the Pentium® II Processor. The packaging
technology and each of the physical elements of the product are referred to using
accurate technical descriptions. This allows clear reference to the products as just a
Page 1-2
IntroductionKP6-LA
processor. This is the model used in past packaging technologies like PGA, TCP,
PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium® II Processor
The new enclosed card packaging technology is called a “Single
Edge Contact cartridge.” This is similar to previous names for
packaging technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
Pro processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the
cartridge in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide
added support for heatsinks.
®
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
The Pentium® II Processor is the first
product to utilize the S.E.C. cartridge
technology and Slot 1 connector. Unless
otherwise noted, any references to
“Pentium® II Processor,” “Pentium® II
Processor/Slot 1 processor” or Processor” will apply to both the Pentium® II
Processor desktop processors.
Thermal Plate
Cover
Processor
Printed Circuit Board
Figure 1: Pentium® II Processor CPU
with S.E.C. Cartridge
Page 1-3
Introduction KP6-LA
Accelerated Graphics Port
(AGP or A.G.P.)
Typically, 3D graphics rendering requires a tremendous amount of memory, and
demands ever increasing throughput speed as well. As 3D products for the personal
computer become more and more popular, these demands will only increase. This
will cause a rise in costs for both end users and manufacturers. Lowering these costs
as well as improving performance is the primary motivation behind AGP. By
providing a massive increase in the bandwidth available between the video card and
the processor, it will assist in relieving some of these pressures for quite sometime.
Hardware Monitoring
Hardware monitoring allows you to monitor various aspects of your systems operations and status. These include features such as CPU temperature, voltage and fan
RPM’s.
Desktop Management Interface
(DMI)
DMI, or Desktop Management Interface, is a BIOS level method for monitoring
specific BIOS related hardware features. It allows the BIOS to collect and store
information specific to the system, so that vendors and system integrators will have
greater access to information regarding system configuration and design. This
allows for better troubleshooting, migration planning, and upgradeability decision
making.
Page 1-4
IntroductionKP6-LA
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