EPoX Computer KP6-LA User Manual

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KP6-LA

A Pentium® II Processor based AGP mainboard

TRADEMARK

All products and company names are trademarks or registered trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.5

September 9, 1997

KP6-LA

Technical Support Services

If you need additional information, help during installation or normal use of this product, please contact your retailer. If your retailer can not help, you may E-Mail us with any questions at the following address tech@epox.com.

Record your serial number before installing your KP6-LA mainboard. (the serial number is located near the ISA slots at the edge of the board)

EPoX KP6-LA serial number:

__________________________

BIOS Upgrades

Please use either our Web Site or BBS for current BIOS Upgrades.

Internet Access

http://www.epox.com sales@epox.com tech@epox.com

Modem Access

886-2-218-0997 (Taiwan) 31-182-618451 (The Netherlands)

You can access this number via a Hayes-compatible modem with a 2,400 to 28,800 baud rate. The following setup format is required:

8 Data Bits, No Parity, 1 Stop Bit. If your modem is unable to connect at higher baud rates, try connecting at

2,400 baud before contacting Technical Support.

Thank you for using EPoX mainboards!

KP6-LA

User Notice

No part of this product, including the product and software may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form by any means without the express written permission of EPoX Computer Company (hereinafter referred to as EPoX) except documentation kept by the purchaser for backup purposes.

EPoX provides this manual “as is” without warranty of any kind, either express or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall EPoX be liable for any loss or profits, loss of business, loss of use or data, interruption of business or for indirect, special incidental, or consequential damages of any kind, even if EPoX has been advised of the possibility of such damages arising from any defect or error in the manual or product. EPoX may review this manual from time to time without notice. For updated BIOS, drivers, or product release information you may visit EPoX’s home page at: http://www.epox.com

Products mentioned in this manual are mentioned for identification purposes only. Product names appearing in this manual may or may not be registered trademarks or copyrights of their respective companies.

The product name and revision number are both printed on the mainboard itself.

Handling Procedures Static electricity can severely damage your equipment. Handle the KP6-LA and

any other device in your system with care and avoid unneccessary contact with system components on the mainboard.

Always work on an antistatic surface to avoid possible damage to the motherboard from static discharge.

We assume no responsibility for any damage to the KP6-LA mainboard that results from failure to follow installation instructions or failure to observe safety precautions.

CAUTION

The KP6-LA mainboard is subject to

damage by static electricity. Always

observe the handling procedures.

KP6-LA

Section 1 Introduction

Components Checklist .................................1-1

Overview

Pentium II ...................................................1-2

S.E.C. Cartridge Terminology .....................1-3

Accelerated Graphics Port ...........................1-4

Hardware Monitoring ..................................1-4

Desktop Management Interface ...................1-4

LANDesk Client Manager ........................... 1-4

KP6-LA Form-Factor ..................................1-6

I/O Shield Connector...................................1-7

Power-On/Off (Remote) ..............................1-7

System Block Diagram................................1-8

Table of Contents

Section 2 Features

KP6-LA Features.........................................2-1

Section 3 Installation

KP6-LA Detailed Layout.............................3-2

Easy Installation Procedure

Configure Jumpers ......................................3-3

System Memory Configuration .................... 3-5

Installing a Pentium® II Processor................3-9

Device Connectors ......................................3-11

Section 4 Award BIOS Setup

BIOS Instructions........................................4-1

Standard CMOS Setup ................................4-2

BIOS Features Setup ................................... 4-3

Chipset Features Setup ................................ 4-8

Power Management Setup ...........................4-13

PNP/PCI Configuration ...............................4-16

Load Setup Defaults ....................................4-18

Integrated Peripherals .................................. 4-19

Change Supervisor or User Password ..........4-23

IDE HDD Auto Detection............................4-24

HDD Low Level Format..............................4-26

Save & Exit Setup .......................................4-26

Exit Without Saving ....................................4-27

Section 5 DMI

DMI Access ................................................5-1

Section 7 Appendix

KP6-LA

Appendix A

Memory Map ............................................... A-1

I/O Map.......................................................A-1

Timer & DMA Channels Map .....................A-2

Interrupt Map .............................................. A-2

RTC & CMOS RAM Map...........................A-3

Appendix B

POST Codes................................................ A-5

Unexpected Errors .......................................A-8

Appendix C

Load Setup Defaults ....................................A-9

Components Checklist

ü A. (1) KP6-LA mainboard ü B. (1) KP6-LA user’s manual ü C. (1) Floppy ribbon cable ü D. (2) Hard drive ribbon cables ü E. (1) Retention Module ü F. (1) Heatsink Support Unit ü G. (1) PS/2 to AT keyboard connector adapter (option) ü H. (1) Bus master drivers

(1) DMI (option)

IntroductionKP6-LA

Section 1

INTRODUCTION

USERS

MANUAL

KP6-LA

Top Half

Bottom Half

Page 1-1

Introduction KP6-LA

Overview

Pentium II

The Pentium® II Processor is the follow-on to the Pentium® Processor. The Pentium® II Processor, like the Pentium® Pro processor, implements a Dynamic Execution micro-architecture -- a unique combination of multiple branch prediction, data flow analysis, and speculative execution. This enables the Pentium® II Processor to deliver higher performance than the Pentium® processor, while maintaining binary compatibility with all previous Intel architecture processors.

A significant feature of the Pentium® II Processor, from a system perspective, is the built-in direct multiprocessing support. In order to achieve multiprocessing, and maintain the memory and I/O bandwidth to support it, new system designs are needed. For systems with dual processors, it is important to consider the additional power burdens and signal integrity issues of supporting multiple loads on a high speed bus. The Pentium® II Processor card supports both uni-processor and dual processor implementations.

The Pentium® II Processor utilizes Single Edge Contact (S.E.C.) (Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache to remain tightly coupled to the processor, while maintaining flexibility when implementing high performance processors into OEM systems. The second level cache is performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes surface mounted core components and a printed circuit board with an edge finger connection. The S.E.C. cartridge package introduced on the Pentium® II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB with an edge finger connection. The thermal plate allows standardized heatsink attachment or customized thermal solutions. The thermal plate enables a reusable heatsink to minimize fit issues for serviceability, upgradeability and replacement. The full enclosure also protects the surface mount components. The edge finger connection maintains socketabilty for system configuration. The edge finger connector is denoted as ‘Slot 1 connector’ in this and other documentation.

The entire enclosed product is called the Pentium® II Processor. The packaging technology and each of the physical elements of the product are referred to using accurate technical descriptions. This allows clear reference to the products as just a

Page 1-2

IntroductionKP6-LA

processor. This is the model used in past packaging technologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium® II Processor

The new enclosed card packaging technology is called a “Single Edge Contact cartridge.” This is similar to previous names for packaging technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium Pro processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in place.

• Thermal plate

The heatsink attachment plate.

• Heat sink supports

The support pieces that are mounted on the mainboard to provide added support for heatsinks.

The L2 cache (TagRAM, PBSRAM) components keep standard industry names.

The Pentium® II Processor is the first product to utilize the S.E.C. cartridge technology and Slot 1 connector. Unless otherwise noted, any references to “Pentium® II Processor,” “Pentium® II Processor/Slot 1 processor” or Processor” will apply to both the Pentium® II Processor desktop processors.

Thermal Plate

Cover

Processor

Printed Circuit Board

Figure 1: Pentium® II Processor CPU

with S.E.C. Cartridge

Page 1-3

Introduction KP6-LA

Accelerated Graphics Port (AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and demands ever increasing throughput speed as well. As 3D products for the personal computer become more and more popular, these demands will only increase. This will cause a rise in costs for both end users and manufacturers. Lowering these costs as well as improving performance is the primary motivation behind AGP. By providing a massive increase in the bandwidth available between the video card and the processor, it will assist in relieving some of these pressures for quite sometime.

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems operations and status. These include features such as CPU temperature, voltage and fan RPM’s.

Desktop Management Interface (DMI)

DMI, or Desktop Management Interface, is a BIOS level method for monitoring specific BIOS related hardware features. It allows the BIOS to collect and store information specific to the system, so that vendors and system integrators will have greater access to information regarding system configuration and design. This allows for better troubleshooting, migration planning, and upgradeability decision making.

Page 1-4

IntroductionKP6-LA

Page Left Blank

Page 1-5

Introduction KP6-LA

KP6-LA Form-Factor

The EPoX KP6-LA is designed with ATX form factor - the latest industry standard of chassis. The ATX form factor is essentially a Baby-AT baseboard rotated 90 degrees within the chassis enclosure and a new mounting configuration for the power supply. With these changes the processor is relocated away from the expansion slots, allowing them all to hold full length add-in cards. ATX defines a double height aperture to the rear of the chassis which can be used to host a wide range of onboard I/O. Only the size and position of this aperture is defined, allowing PC manufacturers to add new I/O features (e.g.; TV input, TV output, joystick, modem, LAN, audio, etc.) to systems. This will help systems integrators differentiate their products in the marketplace, and better meet your needs.

• By integrating more I/O down onto the board and better positioning the hard

drive and floppy connectors material cost of cables and add-in cards is reduced.

• By reducing the number of cables and components in the system, manufacturing

time and inventory holding costs are reduced and reliability will increase.

• By using an optimized power supply, it's possible to reduce cooling costs and

lower acoustical noise. An ATX power supply, which has a side-mounted fan, allows direct cooling of the processor and add-in cards making a secondary fan or active heatsink unnecessary in most system applications.

Floppy / IDE connectors close to peripheral bays

Page 1-6

Expandable I/O

Full length slots

ATX Power Supply

3 1/2"

Bay

Figure 2: Summary of ATX chassis features

5 1/4"

Bay

Single chassis fan for system

ATX power connector

CPU located near Power Supply

Easy to access memory modules

IntroductionKP6-LA

I/O Shield Connector

The KP6-LA is equipped with an I/O back panel. Please use the appropriate I/O shield (figure 3).

Parallel Port

Figure 3:

KP6-LA

I/O back

panel layout

PS/2 Mouse

PS/2 Keyboard

USB

COM1

COM2

Power-On/Off (Remote)

The KP6-LA has a single 20-pin connector for ATX power supplies. For ATX power supplies that support the Remote On/Off feature, this should be connected to the systems front panel for system Power On/Off button. The systems power On/Off button should be a momentary button that is normally open.

The KP6-LA has been designed with “Soft Off" functions. You can turn Off the system from one of two sources: The first is the front panel Power On/Off button, and the other is the "Soft Off" function (coming from the KP6-LA’s onboard circuit controller) that can be controlled by the operating system. Windows 95 will control this when the user clicks that they are ready to Shutdown the system.

JP 7

KP6-LA Board

Case (chassis) Power

ON/OFF button (JP7)

ATX POWER SUPPLY

Figure 4: Simple ATX Power

ON/OFF Controller

Page 1-7

Introduction KP6-LA

System Block Diagram

Page 1-8

Figure 5: System Block Diagram

KP6-LA Features:

FeaturesKP6-LA

Section 2

FEATURES

• KP6-LA is based on the Pentium

on Slot 1. The board is configured by an Easy-Setting-Single-Jumper (E.S.S.J.) to match your CPU clock speed.

II Processor operating at 233 ~ 330 MHz

• Designed with Intel’s 82443 LX AGPset.

• Supports up to 1 Gigabyte of DRAM (minimum of 8 MB) on board, You

can use either 72-pin SIMM x 4 or 168-pin DIMM x 3 or both. (1 Bank is shared between the SIMM & DIMM) It will automatically detect Extended Data Output (EDO) DRAM or Synchronous DRAM memory (SDRAM) (please see Section 3-2).

• KP6-LA will support Error Checking and Correcting (ECC) when using

parity DRAM memory modules. This will detect multiple bit errors and correct 1-bit memory errors.

• Supports (3) 16 bit ISA slots, (4) 32 bit PCI slots, (1) AGP slot and provides

(2) independent high performance PCI IDE interfaces capable of supporting PIO Mode 3/4 and Ultra DMA 33 devices. The KP6-LA supports (4) PCI Bus Master slots and a jumperless PCI INT# control scheme which reduces configuration confusion when plugging in PCI card(s).

• Supports ATAPI (e.g. CD-ROM) devices on both Primary and Secondary

IDE interfaces.

• Designed with Winbond W83977 Multi I/O: (1) floppy port, (1) parallel

port (EPP, ECP), and (2) serial ports (16550 Fast UART). Note: Japanese “Floppy 3 mode” is also supported

• Includes a PS/2 mouse connector.

• Allows use of a PS/2 or AT keyboard.

• Features Award Plug & Play BIOS. With Flash Memory you can always

upgrade to the current BIOS as they are released. (http://www.epox.com/ please visit our Technical Support section for the latest updates)

Page 2-1

Features KP6-LA

• KP6-LA utilizes a Lithium battery which provides environmental protection

and longer battery life.

• Supports the Universal Serial Bus (USB) connector. The onboard PIIX4 chip

provides the means for connecting PC peripherals such as; keyboards, joysticks, telephones, and modems.

• Built-in ATX 20-pin power supply connector.

• Software power-down when using Windows

95.

• Supports ring-in feature (remote power-on through external modem,

allows system to be turned on remotely.

• Resume by Alarm - Allows your system to turn on at a preselected time.

• Power Loss Recovery - In the event of a power outtage your system will automatically turn itself back on without user intervention.

• Supports CPU Hardware sleep and SMM (System Management Mode).

• Supports Desktop Management Interface (DMI) facilitating the management

of desktop computers, hardware and software components and peripherals, whether they are stand-alone systems or linked into networks. (option)

• Supports LanDesk Client Manager (LDCM). (option)

Page 2-2

Real Picture

InstallationKP6-LA

Section 3

INSTALLATION

Motherboard

Page 3-1

Installation KP6-LA

CPU Cartridge SLOT 1

RST

SLEEP

SPEAK

TBLED

H/D LED

KEYLOCK

Winbond

Flash Memory

JP2

JP3

J14

JP5

JP8

JP12

JP10

JP11

Bank 2

Bank 1

Bank 0

Reserve

KP6-LA Detailed Layout

Mouse

(Top)

PS/2

Keyboard

(Bottom)

USB 1

(Top)

USB

USB 0

(Bottom)

COM 1

Parallel Port

COM 2

I/Oset

83977

1 Infrared

CPU Heat Sensoring Chip

PCI Slot #1

PCI Slot #2

PCI Slot #3

PCI Slot #4

ISA Slot #1

ISA Slot #2

J8 J7

Intel

443LX

PCIset

AGP SLOT

ATX Power Input

Power Supply Fan Monitoring

CPU Fan Power

PCIset

Bank 2

SIMM 1

SIMM 2

Intel

PIIX4

Bank 3

SIMM 3

SIMM 4

J15

Hardware

Chassis Power

DIMM 1

Clear CMOS

LM79

Monitor

DIMM 2

DIMM 3

330MHz 300MHz 266MHz 233MHz 200MHz

FDD Connector

J13

Primary IDE

Secondary IDE

J11

J12

JP9

Default

PWR/ON

JP7

G/LED

J10

Battery

KP6-LA

Rev. #

Page 3-2

ISA Slot #3

for BIOS

Figure 1

InstallationKP6-LA

Easy Installation Procedure

The following must be completed before powering on your new system:

3-1. Configure Jumpers to match your hardware 3-2. Install memory chips 3-3. Install Pentium II Processor 3-4. Device Connectors

Section 3-1 Configure Jumpers

EPoX designs all motherboards with the fewest jumpers to make your install fast and easy.

The following will describe all of the jumpers that you are required to set before moving on to step 3-2.

Note: The jumpers as depicted as shown (Figure 1) in their correct physical orientation.

JP2:

JP3:

BIOS Voltage Setting JP2, JP3: = 1-2 - +5V Flash (Default)

= 2-3 - +12V Flash

CMOS Clear

JP5:

JP5: = 1-2 - Run Mode (Default)

= 2-3 - Clear CMOS

Page 3-3

Installation KP6-LA

CPU Processor Selection

1516

JP8: =1-2 - 200MHz

=3-4 - 233MHz (Default)

JP8:

=5-6 - 266MHz =7-8 - 300MHz =9-10 - 330MHz

=11-12 - Reserved = 13-14 - Reserved = 15-16 - Disable E.S.S.J.

JP9: JP10: JP11: JP12:

Reserved CPU Processor Selections

JP9: =Reserved JP10: =Reserved JP11: =Reserved JP12: =Reserved

Page 3-4

InstallationKP6-LA

- Synchronous

Section 3-2 System Memory Configuration

Memory Layout

The KP6-LA supports (3) 168-pin DIMMs (Dual In-line Memory Module) and (4) 72-pin SIMMs (Single In-line Memory Module). The DIMMs can be either EDO (Enhanced Data Out) or SDRAM (Synchronized DRAM). The 72-pin SIMMs must be installed in pairs, and DIMMs may be installed using just one chip.

• We only recommend using SDRAM and not mixing SIMM

with DIMM modules.

• Same size and type EDO memory must be installed in pairs so that memory modules are not mixed in each bank.

• DIMM SDRAM may be 83MHz (12ns), 100MHz (10ns) or 120MHz (8ns) bus speed.

• If you use both 50ns and 60ns memory you must configure your BIOS to read 60ns.

• When using Synchronous DRAM we recommend using the 4 clock variety over the 2 clock.

• Fast Page Mode DRAM (FPM) is not supported by the LX AGPset. Only EDO and SDRAM are supported.

Figure 2 and Table 1 show several possible memory configurations using both SIMM and DIMM.

SIMM 1 SIMM 2 SIMM 3 SIMM 4

DIMM 1 DIMM 2 DIMM 3

Figure 2

Caution: DIMM BANK 2 & SIMM BANK 2 ARE SHARED

This means that if you use SIMM 1&2 you can not use DIMM 1

or if you use DIMM 1 you can not use SIMM 1&2.

Bank 2

Bank 3

Bank 2 Bank 1 Bank 0

- EDO

Page 3-5

Installation KP6-LA

Total Memory

= 1GB

Maximum

= 1GB

Maximum

= 768MB Maximum

= 512MB Maximum

= 256MB Maximum

DIMM 3

(Bank 0)

EDO/SDRAM* 8MB, 16MB, 32MB 64MB, 128MB, 256M X 1

EDO/SDRAM* 8MB, 16MB, 32MB 64MB, 128MB, 256M