EPOX EP-3WEF2, EP-3WDF2 User Manual
EP-3WEF2EP-3WEF2
EP-3WEF2
EP-3WEF2EP-3WEF2
EP-3WDF2EP-3WDF2
EP-3WDF2
EP-3WDF2EP-3WDF2
A SocA Soc
A Soc
A SocA Soc
Intel 810 Series ChipsetIntel 810 Series Chipset
Intel 810 Series Chipset
Intel 810 Series ChipsetIntel 810 Series Chipset
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mainboar
mainboarmainboar
TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
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et 370 Pret 370 Pr
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et 370 Pret 370 Pr
d (133/100/66MHz)d (133/100/66MHz)
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Manual Revision 1.0
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March 28, 2000
EP-3WEF2/3WDF2
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any
language in any form without the express written permission of EPoX Computer
Company (hereinafter referred to as EPoX) except for documentation kept by the
purchaser for backup purposes.
We provide this manual as is without warranty of any kind, either expressed or
implied, including but not limited to the implied warranties or conditions of
merchantability or fitness for a particular purpose. In no event shall EPoX be
liable for any loss of profits, loss of business, loss of use or data, interruption of
business or for indirect, special incidental, or consequential damages of any kind,
even if EPoX has been advised of the possibility of such damages arising from any
defect or error in the manual or product. EPoX may revise this manual from time
to time without notice. For updated BIOS, drivers, or product release information
you may visit our websites at http://www.epox.com or http://www.epox.com.tw.
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks
or copyrights of their respective companies. The product name and revision
number are both printed on the mainboard itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-3WEF2/
3WDF2 and any other device in your system with extreme care and avoid unnecessary contact with system components on the mainboard. Always work on an
antistatic surface to avoid possible damage to the mainboard from static discharge.
Always have the power supply unplugged and powered off when inserting and
removing devices within the computer chassis. EPoX assumes no responsibility
for any damage to the EP-3WEF2/3WDF2 mainboard that results from failure to
follow instruction or failure to observe safety precautions.
CAUTION
The EP-3WEF2/3WDF2 mainboard is subject to
damage by static electricity.Always observe the
handling procedures.
EP-3WEF2/3WDF2
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. Your retailer will have the most current
information about your configuration. If your retailer cannot help, you may visit
our online technical support website and/or contact our support technicians at the
locations listed below.
Record your serial number before installing your EP-3WEF2/3WDF2 mainboard.
(The serial number is located near the PCI slots at the edge of the board.)
EP-3WEF2/3WDF2 serial number: _____________________
Contacting Technical Support
EPoX technical support is working hard to answer all of your questions online.
From our website you can find answers to many common questions, drivers, BIOS
updates, tech notes, and important technical bulletins. If you are still unable to
locate the solution you are seeking, you always have the option to contact our
support technicians directly.
North American website (English language)
http://www.epox.com
sales@epox.com
support@epox.com
European website (Multi-language)
http://www.epox.nl
sales@epox.nl
support@epox.nl
Taiwan website (Chinese language)
http://www.epox.com.tw
sales@epox.com.tw
support@epox.com.tw
Thank you for using EPoX mainboards!
Copyright 2000 EPoX Computer Company. All rights reserved.
Section 1 Introduction
Components Checklist ................................................... 1-1
Overview
Intel Celeron processors (P.P.G.A.) 370 ...................... 1-2
Intel Coppermine processors (FC-PGA) 370 ............... 1-3
Intel® 810 Series Chipset Feature .................................. 1-4
EP-3WEF2/3WDF2 Form-Factor ................................. 1-6
I/O Shield Connector ...................................................... 1-7
Power-On/Off (Remote) ................................................ 1-7
System Block Diagram ................................................... 1-8
Section 2 Features
EP-3WEF2/3WDF2 Features ........................................ 2-1
Section 3 Installation
EP-3WEF2/3WDF2 Detailed Layout ............................ 3-2
EP-3WEF2/3WDF2
T able of Contents
Page
Easy Installation Procedure
CPU Insertion ................................................................. 3-3
Jumper Settings ............................................................... 3-5
System Memory Configuration ...................................... 3-6
Device Connectors ......................................................... 3-8
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO) ........................ 3-10
STR (Suspend To RAM) Function .................................. 3-12
Section 4 Award BIOS Setup
Main Menu ...................................................................... 4-1
Standard CMOS Setup .................................................... 4-3
Advanced BIOS Features ................................................ 4-7
Advanced Chipset Features ............................................. 4-10
Integrated Peripherals..................................................... 4-13
EP-3WEF2/3WDF2
Power Management Setup .............................................. 4-18
PNP/PCI Configuration Setup........................................ 4-21
PC Health Status ............................................................. 4-22
Frequency Control .......................................................... 4-24
Defaults Menu................................................................. 4-25
Supervisor/User Password Setting ................................. 4-26
Exit Selecting .................................................................. 4-27
Section 5 810 Series VGA and Sound Driver Installation
Easy Driver Installation .................................................. 5-1
Appendix
Appendix A
Memory Map................................................................... A-1
I/O Map ........................................................................... A-1
Timer & DMA Channels Map .........................................A-2
Interrupt Map................................................................... A-2
RTC & CMOS RAM Map ............................................... A-3
Appendix B
POST Codes ....................................................................A-5
Appendix C
Load Optimized Defaults................................................ A-13
Appendix D
GHOST 5.1 Quick Users Guide ....................................A-15
EP-3WEF2/3WDF2
Page Left Blank
Components Checklist
99
9 A. (1) EP-3WEF2/3WDF2 mainboard
99
99
9 B. (1) EP-3WEF2/3WDF2 users manual
99
99
9 C. (1) Floppy ribbon cable
99
99
9 D. (1) ATA66 Hard drive ribbon cable
99
99
9 E. (1) RS-232 9-PIN ribbon cable
99
F. (1) PS/2 to AT keyboard connector adapter (optional)
99
9 G. (1) Onboard Graphic and Sound Driver
99
IntroductionEP-3WEF2/3WDF2
Section 1
INTRODUCTION
USERS
MANUAL
EP-3WEF2/
3WDF2
C
D
A
B
F
or
E
G
Page 1-1
Introduction EP-3WEF2/3WDF2
Overview
Intel Celeron processors (P.P.G.A.) 370
The Intel Celeron processors provide power to handle the internet, educational
programs, interactive 3D games, and productivity applications. The Intel Celeron
processors at 533, 500, 466, 433, 400, 366, 333 and 300A MHz include integrated L2
cache 128Kbyte. The core for the 533, 500, 466, 433, 400, 366, 333 and 300A MHz
processors have 19M transistors due to the addition of the integrated L2 cache
128Kbyte. All the Intel Celeron processors are available in the plastic pin grid array (P.
P.G.A.) form factor. The P.P.G.A. form factor is compatible with the 370 pin socket. All
the Intel Celeron processors are available in the plastic pin grid array (PPGA) package.
The PPGA package is compatible with the 370 pin socket and provides more flexibility
to design low cost systems by enabling lower profile and smaller systems and providing the potential for reducing costs of processor retention and cooling solutions. Like
the Intel Celeron processors that utilize S.E.P.P., the Intel Celeron processors that use
P.P.G.A., feature a P6-microarchitecture-based core processor on a single-sided substrate without BSRAM componentry.
The Intel Celeron processor at 533, 500, 466, 433, 400, 366, 333, and 300A MHz. Includes Intel MMX[tm] media enhancement technology. Offers Dynamic Execution
technology.
Includes a 32Kbyte (16Kbyte/16Kbyte) non-blocking, level-one cache that provides
fast access to heavily used data. Intel Celeron processors at 533, 500, 466, 433, 400,
366, 333 and 300A MHz include integrated L2 cache 128Kbyte. All the Intel Celeron
processor utilize the Intel P6 microarchitectures multi-transaction system bus at
66MHz. The 533, 500, 466, 433, 400, 366, 333 and 300A MHz processors utilize the Intel
P6 microarchitectures multi-transaction system bus with the addition of the L2 cache
interface. The combination of the L2 cache bus and the processor-to-main-memory
system bus increases bandwidth and performance over single-bus processors.
Intel MMX technology includes new instructions and data types that allow
applications to achieve a new level of performance. Intels MMX technology is
designed as a set of basic, general-purpose integer instructions that are easily
Page 1-2
IntroductionEP-3WEF2/3WDF2
applied to the needs of a wide diversity of multimedia and communications
applications. The highlights of the technology are:
* Single Instruction, Multiple Data (SIMD) technique
* 57 new instructions
* Eight 64-bit wide MMX technology registers
* Four new data types
Intel Coppermine pr ocessors (FC-PGA) 370
These Coppermine-128K and Coppermine-256K processor is the next addition to the
P6 micro architecture product family. The FC-PGA package is a new addition to the
Intel IA-32 processor line and hereafter will be referred to as the Coppermine FCPGA processor, or simply The processor. The package utilizes the same 370-pin
zero insertion force socket (PGA370) used by the Intel Celeron processor. Thermal
solutions are attached directly to the back of the processor core package without the
use of a thermal plate or heat spreader.
The Coppermine processor, like the Intel Celeron, Intel Pentium II and Pentium III in
the P6 family processor, implement a Dynamic Execution micro architecture --- a unique
combination of multiple branch prediction, data flow analysis, and speculative
execution. This enable these processors to deliver higher performance than the Intel
Pentium processor, while maintaining binary compatibility with all previous Intel Architecture processors. The processor also executes Intel MMX technology instructions for enhanced media and communication performance just as its predecessor the
Intel Pentium III processor. Additionally the Coppermine FC-PGA processor executes
streaming SIMD (Single-Instruction Multiple Data) Extensions for enhanced floating
point and 3-D application performance. The concept of processor identification, via
CPUID, is extended in the processor family with the addition of a processor serial
number. The processor utilizes multiple low-power states such as AutoHALT, StopGrant, Sleep and Deep Sleep to conserve power during idle times.
The processor includes an integrated on-die, 128KB or 256KB, 8-way set associative
level-two (L2) cache with a separated 16KB level one (L1) instruction cache and 16KB
level one (L1) data cache. These cache arrays run at the full speed of the processor
Page 1-3
Introduction EP-3WEF2/3WDF2
core. As with the Intel Pentium III processor, the Coppermine FC-PGA processor has
a dedicated L2 cache bus, thus maintaining the dual independent bus architecture to
deliver high bus bandwidth and performance. Memory is cacheable for 4GB/64GB of
addressable memory space, allowing significant headroom for desktop system.
Intel(R) 810 Series chipset features
The Intel(R) 810 series chipset that Built on the strong foundation of Intel(R)
440BX AGPset technology, the Intel(R) 810 series chipset has re-engineered the
Value PC, providing next generation features and great graphics performance.
The 82810 series Graphics Memory Controller Hub (GMCH) features : Intel(R)
graphics technology and software drivers, using Direct AGP (integrated AGP) to
create vivid 2D and 3D effects and images. The 82810 series chip feature
integrated Hardware Motion Compensation to improve soft DVD video quality.
The Inte(R) 82810 series chipset use Intel(R) Dynamic Video Memory Technology (D.V.M.T.) is an architecture that offers breakthrough performance for the
(motherboard) PC through efficient memory utilization and Direct AGP. The system
OS uses the Intel software drivers and intelligent memory arbiter to support richer
graphics applications.
The 82801 I/O Controller Hub (ICH) employs the Intel(R) Accelerated Hub
Architecture to make a direct connection from the graphics and memory to the
integrated AC97 controller, the IDE controllers (ATA/66 or ATA/33), dual USB
ports, and PCI add-in cards.
The Accelerated Hub Architecture provides twice the bandwidth of the PCI bus at
266 MB per second. This allows a wider flow of rich information from the I/O
controller to the memory controller, with optimized arbitration rules allowing more
functions to run concurrently, enabling more life-like audio and video.
The Integrated Audio-Codec 97 controller enables software audio and modem
(AMR Riser Optional) by using the processor to run sound and modem software.
By reusing existing system resources, this feature adds flexibility, improves sound
and modem quality.
Page 1-4
IntroductionEP-3WEF2/3WDF2
The 82802 Firmware Hub (FWH, 4MB) stores system BIOS and video BIOS,
eliminating a redundant nonvolatile memory component. In addition, the 82802
contains a hardware Random Number Generator (RNG). The Intel(R) RNG
provides truly random numbers to enable fundamental security building blocks
supporting stronger encryption, digital signing, and security protocols for the
future application program .
Page 1-5
Introduction EP-3WEF2/3WDF2
EP-3WEF2/3WDF2 Form-Factor
The EP-3WEF2/3WDF2 is designed with FlexATX form factor - the new industry
standard of chassis. The FlexATX form factor of Maximum board size is 9.0
inches (229mm)*7.5 inches (191mm) for FlexATX addendum version 1.0. This
FlexATX addendum allows enhanced flexibility where conforming motherboards
may be enclosed; that is all-in-one computing devices, or standard desktop
systems. In fact, it does focus on delivering one method to implement some of
the features of an Ease of Use personal computer. To mount a FlexATX
motherboard in an ATX 2.03 - compliant chassis, two new mounting holes are
required in the chassis. The ATX form factor is essentially a Baby-AT baseboard
rotated 90 degrees within the chassis enclosure and a new mounting configuration
for the power supply. With these changes the processor is relocated away from
the expansion slots, allowing them all to hold full length add-in cards. ATX
defines a double height aperture to the rear of the chassis which can be used to
host a wide range of onboard I/O. Only the size and position of this aperture is
defined, allowing PC manufacturers to add new I/O features (e.g.; TV input, TV
output, modem, LAN, etc.) to systems. This will help systems integrators
differentiate their products in the marketplace, and better meet your needs.
Smaller size promotes a smaller system size.
I/O shield does not need to be retooled in an ATX 2.03 or later. The
Mainboard should be used in an ATX 2.03 (or later) compliant case.
A smaller power supply cam be used. High integration on mainboard reduces
the system costs.
Expandable I/O
Full length
slots
Floppy / IDE
connectors
close to
peripheral
bays
Page 1-6
ATX
Power
Supply
3 1/2"
Bay
Figure 2: Summary of ATX chassis features
5 1/4"
Bay
Single chassis
fan for system
CPU located near
Power Supply
ATX power
connector
IntroductionEP-3WEF2/3WDF2
I/O Shield Connector
The EP-3WDF/3WEF is equipped with an I/O back panel.
PS/2 Mouse
PS/2
KEYBOARD
VGA1 LANPort
(RJ45)
Figure 3: I/O back panel layout
Power-On/Off (Remote)
The EP-3WDF/3WEF has a single 20-pin connector for ATX power supplies. For
ATX power supplies that support the Remote On/Off feature, this should be
connected to the systems front panel for system Power On/Off button. The
systems power On/Off button should be a momentary button that is normally open.
The EP-3WDF/3WEF has been designed with Soft Off" functions. You can turn
Off the system from one of two sources: The first is the front panel Power On/Off
the button, and the other is the "Soft Off" function controlled by the operating
system such as Windows 95/98. When a user clicks to Shutdown the system; the
power will be turn off automatically.
J3
Case (chassis) Power
ON/OFF button
Figure 4: Simple ATX Power ON/OFF Controller
ATX
POWER SUPPLY
Page 1-7
Introduction EP-3WEF2/3WDF2
System Block Diagram
Page 1-8
Figure 5: System Block Diagram
FeaturesEP-3WEF2/3WDF2
Section 2
FEATURES
EP-3WEF2/3WDF2 Fea tures:
EP-3WEF2/3WDF2 is based on the Socket 370 Processors including PPGA &
FC-PGA operating at 500 ~700MHz. The board is configured by a BIOS setting
to match your CPU clock speed.
The 3WDF2 designed with Intel 810DC100 chipset that supports P.P.G.A
Celeron of 66MHz and FC-PGA Coppermine of 100MHz Front Side Bus
CPU.
The 3WEF2 designed with Intel 810E chipset that provides optimized support for P.P.G.A Celeron of 66MHz and FC-PGA Coppermine of 100/
133MHz Front Side Bus CPU.
The 810E of GMCH direct AGP enhancement by utilizing 133MHz 4MB
Display Cache Memory. (Optional)
Supports up to 512 MB of DRAM (minimum of 16 MB) on board, You can
use 168-pin DIMM x 2. It will run Synchronous DRAM memory (SDRAM)
at 100MHz.
64-bit system memory interface with optimized support for SDRAM at
100MHz.
Integrated 2D & 3D Graphics Engine, H/W Motion Compensation Engine,
230MHz DAC and 4MB Display Cache.(Optional)
AC97 2.1 Audio CODEC onboard for enables the software Audio.
Supports (2) 32 bit PCI slots, provides (2) independent high performance PCI
IDE interfaces capable of supporting PIO Mode 3/4 and Ultra DMA 66
devices. The EP-3WEF2/3WDF2 supports (3) PCI Bus Master slots and a
jumperless PCI INT# control scheme which reduces configuration confusion
when plugging in PCI card(s).
Supports ATAPI (e.g. CD-ROM) devices on both Primary and Secondary
IDE interfaces.
Designed with Winbond W83627HF LPC (Low Pin Count) I/O: (1) floppy
port, (1) parallel port (EPP, ECP), (2) serial ports (16550 Fast UART),
IrDA version SIR protocol or SHARP ASK-IR protocol, (1) Game port and
MIDI port.
Page 2-1
Features EP-3WEF2/3WDF2
Includes a PS/2 mouse connector.
Allows use of a PS/2 keyboard.
Features Award Plug & Play BIOS. With 4MB(FWH) Flash Memory you can
always upgrade to the current BIOS.
EP-3WEF2/3WDF2 utilizes a Lithium battery which provides environmental
protection and longer battery life.
The onboard ICH(82801AA) chip provides the means for connecting PC
Interface and peripherals such as; PCI Bus I/F, LPC I/F, SM Bus, IDE and
USB.
Built-in ATX 20-pin power supply connector.
Software power-down when using Windows® 95/98.
Supports ring-in feature (remote power-on through external modem, allow
system to be turned on remotely.
Resume by Alarm - Allow your system to turn on according to setup
schedule in the BIOS.
Supports CPU Hardware sleep and SMM (System Management Mode).
Supports Hot key, Any key or password Keyboard power ON function
(KBPO).
Supports the CPU and Chassis fan Auto stop in the sleep mode.
Supports the System Power LED (PANEL) blinks in the sleep mode.
Built-in WOL (Wake On Lan) Connector.
Supports the AMR Connector for enables the software modem.
Y2K Compliant.
Advanced Configuration Power Interface (ACPI) ready.
Supports USDM software to offer motherboard various status on Windows
95/98.
Supports the STR (Suspend To RAM) power management by ACPIs S3.
(Optional)
Supports the STR indicator red LED (D8) to avoid pluging or un-pluging
DIMM modules when in a STR mode or power on mode.(Optional)
Supports TV-Out and Flat Panel Connector (optional), provides EP-TV2, EP-
PL2 Card. You can use TV or LCD Monitor or CRT Monitor for best choice.
®
Page 2-2
InstallationEP-3WEF2/3WDF2
Section 3
INSTALLATION
Page 3-1
Installation EP-3WEF2/3WDF2
EP-3WEF2/3WDF2 Detailed Layout
Page 3-2
Figure 1
InstallationEP-3WEF2/3WDF2
Easy Installation Procedure
The following must be completed before powering on your new system:
3-1. CPU Insertion
3-2. Jumper Settings
3-3. System memory Configuration
3-4. Device Connectors
3-5 External Modem Ring-in Power ON and Keyboard Power ON
Functions (KBPO)
3-6. STR (Suspend To RAM) Function(Optional)
Section 3-1
CPU Insertion
CPU Insertion: (use CuMineTM for reference)
Step 1
Open the socket by raising the actuation
lever.
Figure 2
Figure 3
Step 2
Insert the processor.
Ensure proper pin 1 orientation by aligning
the FC-PGA corner marking with the
socket corner closest to the actuation arm
tip. The pin field is keyed to prevent misoriented insertion.
Dont force processor into socket. If it does
not go in easily, check for mis-orientation
and debris.
Make sure the processor is fully inserted
into the socket on all sides.
Page 3-3
Installation EP-3WEF2/3WDF2
Step 3
Close the socket by lowering and locking
the actuation lever.
Figure 4
Note: Intels reference design thermal solution is an active heatsink; an extruded alumi-
num heatsink based and a fan attached to the top on the fin array. (See Figure 5)
Page 3-4
Figure 5
Section 3-2
Jumper Settings
InstallationEP-3WEF2/3WDF2
JP1 CMOS Clear
1
JP1 = 1-2 Normal (Default)
= 2-3 Clear CMOS
JP10 CPU Type Select
1
JP10= 1-2 For Intel CPU
= 2-3 For Other CPU
JP11 Reserved
JP12 ReservedFor Cyrix CPU
JP13
1
1
Keyboard Power-ON Function
JP13= 1-2 Enabled
= 2-3 Disabled (Default)
Page 3-5
Installation EP-3WEF2/3WDF2
Section 3-3
System Memory Configuration
Memory Layout
The EP-3WEF2/3WDF2 supports (2) 168-pin DIMMs (Dual In-line Memory
Module). The DIMMs is for SDRAM (Synchronized DRAM).
100MHz system memory bus frequency. Even if the system host bus is
66MHz.
8MB to 256MB using 16MB/64MB technology (512MB using 128MB
technology).
Support 256MB Registered SDRAM Memory Modules.
We recommend using at least 125MHz (-8ns) SDRAM at the 100MHz
(or higher) FSB as timing becomes more critical at these higher
speeds.
DIMM SDRAM may be 100MHz (-10ns) or 125MHz (-8ns) bus speed.
Figure 6 and Table 1 show several possible memory configurations using
Page 3-6
DIMM 2
DIMM 1
Bank 2/3
Bank 0/1
-Synchronous
Figurre 6
yromeMlatoT
BM652=
mumixaM
BM215=
mumixaM
1MMID
)1/0knaB(
*MARDS
*MARDS
,BM46,BM23,BM61
1XBM652,BM821
1XBM652,BM821
enoN
,BM46,BM23,BM61
2MMID
)3/2knaB(
*MARDS
,BM46,BM23,BM61
1XBM652,BM821
Table 1
* SDRAM only supports 16, 32, 64, 128, 256MB DIMM modules.
* We recommend to use PC100 Memory Module for bus speed between
66MHz and 100MHz and PC133 Memory for bus speed over 100MHz.
* Using non-compliant memory with higher bus speed (over clocking) may
severely compromise the integrity of the system.
InstallationEP-3WEF2/3WDF2
DIMM Module Installation
Figure 7 displays the notch marks and what they should look like on your DIMM
memory module.
DIMMs have 168-pins and two notches that will match with the onboard DIMM
socket. DIMM modules are installed by placing the chip firmly into the socket at
a 90 degree angle and pressing straight down (figure 8) until it fits tightly into the
DIMM socket (figure 9).
LEFT KEY ZONE
(UNBUFFERED)
DIMM Module clip before installation
DIMM Module clip after installation
To remove the DIMM module simply press down both of the white clips on
either side and the module will be released from the socket.
CENTER KEY ZONE
(3.3 V DRAM)
Figure 7
Figure 8
Figure 9
Page 3-7
Installation EP-3WEF2/3WDF2
Section 3-4
Device Connectors
Please install the motherboard into the chassis.
Now that your motherboard is installed you are ready to connect all your connections (figure 10).
parallel port
Joystick/Midi port
PS/2 Mouse
PS/2
KEYBOARD
J2,J3: Chassis Panel Connector
Keylock, Speaker, Reset, Sleep, Turbo LED and HDD LED
J4: CPU Fan Power -- A plug-in for the CPU Fan Power
J6: Chassis Fan Power -- A plug-in for the chassis Fan Power
J7: WOL (Wake On Lan) Connector
COM2: RS232 COM2 Connector
PW2: ATX Power Connector -- 20-pin power connector
IDE1: Primary IDE Connector
IDE2: Secondary IDE Connector
FDD1: Floppy Controller Connector
CD-IN: CD Audio_IN Connector
Pin1(CD_IN_Left), Pin2/Pin3(CD_Reference), Pin4(CD_IN_Right)
AUX_IN: Auxiliary Line_IN Connector
Pin1(Left Line_IN), Pin2/Pin3(GND), Pin4(Right Line-IN)
MODEM_IN: Telephony Connector
Pin1(Audio_in), Pin2/Pin3(GND), Pin4(Mic-out to Modem)
USB port
COM1
Figure 10
VGA1
Speaker
Line_in
MIC
Page 3-8
Device Connectors (continued)
Power On/Off
(This is connected to the power button on the case. Using the SoftOff by Pwr-BTTN feature, you can choose either Instant Off (turns
system off immediatly), or 4 sec delay (you need to hold the button
down for 4 seconds before the system turns off). When the system is
J3
+
+
in 4 sec delay mode, there is a special feature to make the system to
go into suspend mode when the button is pressed momentarily.)
1
Turbo LED indicator - LED ON when higher speed is selected
IDE LED indicator - LED ON when Onboard PCI IDE Hard disks
is activate
IR Connector
1. VCC 4. GND
2. NC 5. IRTX
3. IRRX
1
InstallationEP-3WEF2/3WDF2
J2
KeyLock - Keyboard lock switch & Power LED connector
1. Power LED(+) 4. KeyLock
1
Speaker -
2. N/C 5. GND
3. GND
Connect to the system's speaker for beeping
1. Speaker 3. GND
2. N/C 4. GND
* The power LED lights when the
system is powered on and blinks in
SLEEP MODE (Suspend mode).
1
Reset - Closed to restart system.
1
Page 3-9
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