EPOX EP-3C1A User Manual
TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 1.0
March 15, 2000
EP-3C1AEP-3C1A
EP-3C1AEP-3C1A
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EP-3C1A
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any
language in any form without the express written permission of EPoX Computer
Company (hereinafter referred to as EPoX) except for documentation kept by the
purchaser for backup purposes.
We provide this manual as is without warranty of any kind, either expressed or
implied, including but not limited to the implied warranties or conditions of
merchantability or fitness for a particular purpose. In no event shall EPoX be
liable for any loss of profits, loss of business, loss of use or data, interruption of
business or for indirect, special incidental, or consequential damages of any kind,
even if EPoX has been advised of the possibility of such damages arising from any
defect or error in the manual or product. EPoX may revise this manual from time
to time without notice. For updated BIOS, drivers, or product release information
you may visit our websites at http://www.epox.com or http://www.epox.com.tw.
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks
or copyrights of their respective companies. The product name and revision
number are both printed on the mainboard itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-3C1A and
any other device in your system with extreme care and avoid unnecessary contact
with system components on the mainboard. Always work on an antistatic surface
to avoid possible damage to the mainboard from static discharge. Always have the
power supply unplugged and powered off when inserting and removing devices
within the computer chassis. EPoX assumes no responsibility for any damage to
the EP-3C1A mainboard that results from failure to follow instruction or failure to
observe safety precautions.
CAUTION
The EP-3C1A mainboard is subject to
damage by static electricity. Always
observe the handling procedures.
EP-3C1A
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. Your retailer will have the most current
information about your configuration. If your retailer cannot help, you may visit
our online technical support website and/or contact our support technicians at the
locations listed below.
Record your serial number before installing your EP-3C1A mainboard. (The serial
number is located near the PCI slots at the edge of the board.)
EP-3C1A serial number: _________________________________
Contacting Technical Support
EPoX technical support is working hard to answer all of your questions online.
From our website you can find answers to many common questions, drivers, BIOS
updates, tech notes, and important technical bulletins. If you are still unable to
locate the solution you are seeking, you always have the option to contact our
support technicians directly.
North American website (English language)
http://www.epox.com
sales@epox.com
support@epox.com
European website (Multi-language)
http://www.epox.nl
sales@epox.nl
support@epox.nl
Taiwan website (Chinese language)
http://www.epox.com.tw
sales@epox.com.tw
support@epox.com.tw
Thank you for using EPoX mainboards!
Copyright 2000 EPoX Computer Company. All rights reserved.
EP-3C1A
Table of Contents
Section 1 Introduction
Components Checklist .............................................. 1-1
Overview
System Overview ....................................................... 1-2
Chipset Components ................................................. 1-3
Intel Coppermine processors of Flip-chip pin grid array
(FC-PGA) Package ..................................................... 1-5
Flip-chip pin grid array (FC-PGA) 370 processor
Installation and Removal............................................ 1-6
Bandiwdth Overview.................................................. 1-7
Accelerated Graphics Port ......................................... 1-8
Utlra ATA/66 ..............................................................1-8
Hardware Monitoring................................................. 1-8
EP-3C1A Form-Factor ................................................ 1-9
I/O Shield Connector.................................................. 1-10
Power-On/Off (Remote) .............................................. 1-10
System Block Diagram ............................................... 1-11
Section 2 Features
EP-3C1A Features .................................................... 2-1
Section 3 Installation
EP-3C1A Detailed Layout ........................................ 3-2
Easy Installation Procedure
CPU Insertion............................................................ 3-3
Jumper Settings ......................................................... 3-6
System Memory Configuration ................................ 3-7
Device Connectors .................................................... 3-9
External Modem Ring-in Power ON and
Keyboard Power ON Function (KBPO)................... 3-12
STR Function .............................................................3-13
Section 4 Award BIOS Setup
Main Menu ................................................................ 4-1
Standard CMOS Setup ............................................... 4-3
Advanced BIOS Features ..........................................4-7
Page
EP-3C1A
Advanced Chipset Features ...................................... 4-10
Integrated Peripherals ............................................... 4-13
Power Management Setup ........................................ 4-17
PNP/PCI Configuration Setup .................................. 4-20
PC Health Status........................................................ 4-21
Frequency/Voltage Control....................................... 4-23
Defaults Menu ........................................................... 4-24
Supervisor/User Password Setting ........................... 4-25
Exit Selecting ............................................................ 4-26
Section 5 Driver Installation
820 and Sound Driver Installation ............................ 5-1
Section 6 PCI Audio Sound
CMI8738 Features .................................................... 6-1
Section 7 Appendix
Appendix A
Memory Map ............................................................. A-1
I/O Map ...................................................................... A-1
Timer & DMA Channels Map ................................... A-2
Interrupt Map ............................................................. A-2
RTC & CMOS RAM Map .......................................... A-3
Appendix B
POST Codes .............................................................. A-5
Appendix C
Load Setup Defaults .................................................. A-13
Appendix D
GHOST 5.1 Quick Users Guide ..............................A-15
EP-3C1A
Page Left Blank
IntroductionEP-3C1A
Page 1-1
Section 1
INTRODUCTION
Components Checklist
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ü A. (1) EP-3C1A mainboard
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ü B. (1) EP-3C1A users manual
üü
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ü C. (1) Floppy ribbon cable
üü
üü
ü D. (1) ATA-66 Hard drive ribbon cable
E. (1) PS/2 to AT keyboard connector adapter (optional)
üü
üü
ü F. (1) Driver and Ultility
G. (1) Digital Audio (SPDIF IN/OUT) Module and an optical
fiber (TOSLINK-TOSLINK Cable and 3.5 plug) (optional)
USERS
MANUAL
EP-3C1A
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Introduction EP-3C1A
Page 1-2
System Overview
The EP-3C1A is designed with Intel® 820 chipset. The Intel® 820 chipset includes
MCH (FW82820), ICH (FW82801) and FWH (N82802AB) three chips. The
Intel® 820 chipset is the third generation desktop chipset designed for Intels FCPGA package architecture processor and the first chipset to support the 4X
capability of the AGP 2.0 Interface Specification. The MTH (82805AA) provides
the capability to support 100MHz SDRAMs on DIMMs socket. A new chipset
component interconnect, the hub interface, is designed into the Intel® 820 chipset
to provide more efficient communication between chipset components.
Support of AGP 4X, 100MHz SDRAM and the hub interface provides a balanced
system architecture for the Pentium® III or later socket 370 architecture processor minimizing bottlenecks and increasing system performance. By increasing
memory bandwidth to 1.6GB/s through the use of AGP 4X, the Intel® 820 chipset
will deliver the data throughput necessary to take advantage of the high performance provided by the powerful Pentium® III or later socket 370 architecture
processor.
The Intel® 820 chipset architecture removes the requirement for the ISA expansion bus that was traditionally integrated into the I/O subsystem of Intel chipsets.
This removes many of the conflicts experienced when installing hardware and
drivers into legacy ISA systems. The elimination of ISA will provide true plug-and
play for the Intel® 820 platform.
Intel® 820 chipset contains four core components: the Memory Controller Hub
(MCH), Memory Translator Hub (MTH), the I/O Controller Hub (ICH) and the
Firmware Hub (FWH). The MCH integrates the 133MHz, Pentium® II/III processor bus controller, AGP 2.0 controller, 100MHz SDRAM controller and a highspeed hub interface for communication with the ICH. The ICH integrates an
UltraATA/66 controller, USB host controller, LPC interface controller, FWH
interface controller, PCI interface controller, and a hub interface for communication with the MCH. The Intel® 820 chipset will provide the data buffering and
interface arbitration required to ensure that system interfaces operate efficiently
and provide the system bandwidth necessary to obtain peak performance the
Pentium® III or later socket 370 architecture.
IntroductionEP-3C1A
Page 1-3
Chipset Components
The Intel® 820 chipset consists of the Memory Controller Hub (MCH), Memory
Translator Hub (MTH), the I/O Controller Hub (ICH) and the Firmware Hub (FWH).
ww
ww
w Memory Controller Hub (MCH)
The MCH provides the interconnect between the Direct RambusTM Channel and
the system logic. It integrates:
- Support for single Socket 370 processor with 100MHz or 133MHz System
Bus.
- 100MHz SDRAM interface supporting 768MB of SDRAM.
- 4X, 1.5V AGP interface (3.3V 1X, 2X and 1.5V 1X, 2X devices also
supported).
- Downstream hub link for access to the ICH.
ww
ww
w Memory Translator Hub (MTH)
The MTH provides the capability to support SDRAM memory on a Direct
RambusTM Channel.
- Support 100MHz SDRAMs on DIMMs
- 64Mbit and 128Mbit SDRAM technologies
- X4, X8 and X16 SDRAM components
- X4 Registered DIMMs
ww
ww
w I/O Controller Hub (ICH)
The I/O controller Hub provides the I/O subsystem with access to the rest of
the system. Additionally, it integrates may I/O functions. The ICH integrates:
- Upstream hub link for access to the MCH
- 2 Channel Ultra ATA/66 Bus Master IDE controller
- USB controller
- SMBus controller
Introduction EP-3C1A
Page 1-4
- FWH interface
- LPC interface
- PCI 2.2 interface
- Integrated System Management Controller
ww
ww
w Firmware Hub (FWH)
The FWH component is a key element to enabling a new security and manageability infrastructure for the PC platform. The device operates under the FWH
interface and protocol. The hardware features of this device include a unique a
Random Number Generator (RNG), register-based locking, and hardwarebased locking.
IntroductionEP-3C1A
Page 1-5
Overview
Intel Coppermine processors of Flip-chip pin grid
array (FC-PGA) Package
These Coppermine-128K and Coppermine-256K processor is the next addition to
the P6 micro architecture product family. The FC-PGA package is a new addition to
the Intel IA-32 processor line and hereafter will be referred to as the Coppermine
FC-PGA processor, or simply The processor. The package utilizes the same 370pin zero insertion force socket (PGA370) used by the Intel Celeron processor.
Thermal solutions are attached directly to the back of the processor core package
without the use of a thermal plate or heat spreader.
The Coppermine processor, like the Intel Celeron, Intel Pentium II and Pentium III
in the P6 family processor, implement a Dynamic Execution micro architecture --a unique combination of multiple branch prediction, data flow analysis, and speculative execution. This enable these processors to deliver higher performance than the
Intel Pentium processor, while maintaining binary compatibility with all previous
Intel Architecture processors. The processor also executes Intel MMX technology
instructions for enhanced media and communication performance just as its predecessor the Intel Pentium III processor. Additionally the Coppermine FC-PGA processor executes streaming SIMD (Single-Instruction Multiple Data) Extensions for
enhanced floating point and 3-D application performance. The concept of processor identification, via CPUID, is extended in the processor family with the addition
of a processor serial number. The processor utilizes multiple low-power states
such as AutoHALT, Stop-Grant, Sleep and Deep Sleep to conserve power during idle
times.
The processor includes an integrated on-die, 128KB or 256KB, 8-way set associative level-two (L2) cache with a separated 16KB level one (L1) instruction cache
and 16KB level one (L1) data cache. These cache arrays run at the full speed of the
processor core. As with the Intel Pentium III processor, the Coppermine FC-PGA
processor has a dedicated L2 cache bus, thus maintaining the dual independent bus
architecture to deliver high bus bandwidth and performance. Memory is cacheable
for 4GB/64GB of addressable memory space, allowing significant headroom for
desktop system.
Introduction EP-3C1A
Page 1-6
Flip-chip pin grid array (FC-PGA) 370 processor
Installation and Removal
Installation:
Install the processor and the fan heatsink using the Installation Notes provided with
the boxed processor. The FC-PGA processor with package dimensions is provided
to aid in the design of heatsink and clip solutions as well as demonstrate where pin
side capacitors will be located on the processor. First, raise the handle of the 370pin socket. Carefully install the processor into the 370-pin socket making sure that
none of the pins are bent. Then close the handle of the socket. Next install the fan
heatsink. Make sure to install the heatsink onto the processor after the processor
has been inserted into the 370-pin socket. Place the fan heatsink onto the processor
such that the integrated clip lines up with the sockets attach tabs. This will align
the fan cable with the PGA370 mark on the 370-pin socket. Remember not to damage
the thermal interface pad. Attach
the clip onto the sockets attach
tabs. (A small tool, such as a pen,
may make this process easier.) Take
care to consider potential scraping
of the motherboard underneath the
370-pin socket attach tabs. Connect
the attached fan power cable to the
motherboard connector and quickly
power on the system to verify that
the processor fan is running.
Removal:
To simplify the following process, consider removing the motherboard from the chassis before removing the processor. First, unplug the fan power cable from the
motherboards connector. Then pull the integrated clip away from the sockets tab
nearest the fan cable. (A small tool, such as a pen or screwdriver, may make this
process easier.) Once the clip is free, slowly lift the fan heatsink straight up away
from the socket and the processor. (If the processor has been in operation for a long
IntroductionEP-3C1A
Page 1-7
period of time, then this step may require some extra force; this is because the heat
dissipated from the processor will have affected the thermal interface pad) Next, lift up
the handle of the 370-pin socket. Finally, carefully remove the processor from the
socket making sure not to bend any of the processor pins.
Bandwidth Overview
Table 1 provides a summary of the bandwidth requirements for the Intel® 820 chipset.
Table 1: Intel® 820 platform Bandwidth Summary
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Introduction EP-3C1A
Page 1-8
Accelerated Graphics Port
(AGP or A.G.P.)
Typically, 3D graphics rendering requires a tremendous amount of memory, and
demands ever increasing throughput speed as well. As 3D products for the
personal computer become more and more popular, these demands will only
increase. This will cause a rise in costs for both end users and manufacturers.
Lowering these costs as well as improving performance is the primary motivation
behind AGP. By providing a massive increase in the bandwidth available between
the video card and the processor, it will assist in relieving some of these pressures
for quite sometime.
The EP-3C1A provides the AGP 2.0 interface. The AGP Interface Specification
revision 2.0 enhances the functionality of the original AGP Interface Specification (revision 1.0) by allowing 4X data transfers (4 data samples per clock) and 1.
5 volt (power supply) operation. The AGP 2.0 interface, along with Direct
Rambus memory technology, allows graphics controllers to access main memory
at over 1GB/s. In order to match the 1X, 2X and 4X AGP Card. The EP-3C1A
used the Universal AGP connector. To maximize add-in flexibility. (such as 1.5
volt for 1X, 2X and 4X or 3.3 volt for 1X and 2X AGP Card).
Ultra ATA/66
The ICH provides two channel Ultra ATA/66 Bus Master IDE controller, that
support Ultra ATA/66 protocols, perfect for such demanding applications as realtime video, multimedia, and high performance operating system. A new IDE cable
is required for Ultra ATA/66. This cable is an 80 conductor cable; however the
connectors are, of course, backwards compatible with ATA/33.
Hardware Monitoring
Hardware monitoring allows you to monitor various aspects of your systems
operations and status. The features include CPU temperature, voltage and RPM of
fan.
IntroductionEP-3C1A
Page 1-9
EP-3C1A Form-Factor
The EP-3C1A is designed with ATX form factor - the latest industry standard of
chassis. The ATX form factor is essentially a Baby-AT baseboard rotated 90
degrees within the chassis enclosure and a new mounting configuration for the
power supply. With these changes the processor is relocated away from the
expansion slots, allowing them all to hold full length add-in cards. ATX defines
a double height aperture to the rear of the chassis which can be used to host a
wide range of onboard I/O. Only the size and position of this aperture is
defined, allowing PC manufacturers to add new I/O features (e.g.; TV input, TV
output, joystick, modem, LAN, audio, etc.) to systems. This will help systems
integrators differentiate their products in the marketplace, and better meet your
needs.
By integrating more I/O down onto the board and better positioning the
hard drive and floppy connectors material cost of cables and add-in cards is
reduced.
By reducing the number of cables and components in the system, manufac-
turing time and inventory holding costs are reduced and reliability will
increase.
By using an optimized power supply, it's possible to reduce cooling costs
and lower acoustical noise. An ATX power supply, which has a sidemounted fan, allows direct cooling of the processor and add-in cards
making a secondary fan or active heatsink unnecessary in most system
applications.
Full length
slots
Expandable I/O
Figure 3: Summary of ATX chassis features
CPU located near
Power Supply
Single chassis fan
for system
ATX power
connector
Floppy / IDE
connectors close to
peripheral bays
5 1/4"
Bay
3 1/2"
Bay
ATX
Power
Supply
Introduction EP-3C1A
Page 1-10
I/O Shield Connector
The EP-3C1A is equipped with an I/O back panel. Please use the appropriate I/O
shield (figure 4).
ATX
POWER SUPPLY
Power-On/Off (Remote)
The EP-3C1A has a single 20-pin connector for ATX power supplies. For ATX power
supplies that support the Remote On/Off feature, this should be connected to the
systems front panel for system Power On/Off button. The systems power On/Off
button should be a momentary button that is normally open.
The EP-3C1A has been designed with Soft Off" functions. You can turn Off the
system from one of two sources: The first is the front panel Power On/Off button,
and the other is the "Soft Off" function (coming from the EP-3C1As onboard circuit
controller) that can be controlled by the operating system. Windows 95/98 will
control this when the user clicks that they are ready to Shutdown the system.
Note: For maintaining the SDRAM power during STR (ACPI S3) function, it
is strongly recommend to use ATX power supplies that have a +5VSB
current of (>=) 1A (1000mA). Please check the 5VSBs specification
that has been printed on the ATX power supplys outer case.
Case (chassis) Power
ON/OFF button
Figure 5: Simple ATX Power
ON/OFF Controller
J3
Figure 4: I/O back panel layout
PS/2 Mouse
PS/2
KEYBOARD
USB port
COM1 COM2
parallel port
Speaker
Line_in
MIC
Joystic/Midi port
IntroductionEP-3C1A
Page 1-11
Figure 6: System Block Diagram
System Block Diagram
A Socket 370
Processor
MCH
(Memory
Controller
Hub)
MTH
(Memory
Translator
Hub)
ICH
(I/O
Controllrer
Hub)
100MHz
DIMM Modules
100/133MHz
66MHz
4X, 2X
AMR Slot
FWH (Firm Ware Hub)
Flash memory
LPC I/O
Winbond
83627HF
Serial Port 1
serial Port 2
LPT Port
PS/2 Mouse
PS/2 Keyboard
PCI
Sound
(100/133MHz FSB only)
Introduction EP-3C1A
Page 1-12
Page Left Blank
FeaturesEP-3C1A
Page 2-1
Section 2
FEA TURES
EP-3C1A Fea tures:
EP-3C1A is based on the Socket 370 Processors including FC- PGA operat-
ing at 500 ~ 733MHz (100MHz or 133MHz FSB only, dont supports 66MHz
processor). The board is configured by a BIOS setting to match your CPU
clock speed.
Designed with Intels 820 Chipset.
Supports up to 768MB of SDRAM (minimum of 64 MB) on board, You can use
168-pin DIMM x 3 to plug in the DIMM socket (please see Section 3-2).
EP-3C1A will not support ECC (Error Checking and Correction) mode.
Supports Universal AGP connector for 1X, 2X or 4X AGP Card.
Supports (5) 32 bit PCI slots, (1) AGP slot and provides (2) independent high
performance PCI IDE interfaces capable of supporting PIO Mode 3/4 and
Ultra DMA 33/66 devices. The EP-3C1A supports (5) PCI Bus Master slots
and a jumperless PCI INT# control scheme which reduces configuration
confusion when plugging in PCI card(s).
Supports ATAPI (e.g. CD-ROM) devices on both Primary and Secondary IDE
interfaces.
Designed with Winbond W83627HF LPC I/O: (1) floppy port, (1) parallel
port (EPP, ECP), and (2) serial ports (16550 Fast UART).
Note: Japanese Floppy 3 mode is also supported
Advanced Configuration Power Interface (ACPI) Ready.
Y2K Compliant.
Features Award Plug & Play BIOS. With Flash Memory you can always
upgrade to the current BIOS as they are released. (http://www.epox.com
please visit our Technical Support section for the latest updates).
EP-3C1A utilizes a Lithium battery which provides environmental protec-
tion and longer battery life.
Features EP-3C1A
Page 2-2
Supports the Universal Serial Bus (USB) connector. The onboard ICH chip
provides the means for connecting PC peripherals such as; keyboards,
joysticks, telephones, and modems.
Built-in ATX 20-pin power supply connector.
Software power-down when using Windows® 95/98.
Supports ring-in feature (remote power-on through external modem, allows
system to be turned on remotely).
Resume by Alarm - Allows your system to turn on at a preselected time.
Supports CPU Hardware sleep and SMM (System Management Mode).
Supports Hot key, Any key or password Keyboard power ON function
(KBPO).
Supports USDM software to offer motherboard various status on Windows
®
95/98.
Supports the CPU, PWR and Chassis fan Auto stop in sleep mode.
Supports the onboard standby and blinks in suspend green or STR mode on
J2 (Power LED).
Supports the STR (Suspend To SDRAM) power management by ACPIs S3.
Supports the STR indicator red LED (D13) to avoid pluging or un-pluging
DIMM modules when in a STR mode.
Supports the System Power LED (PANEL) blinking in the sleep mode.
Built-in WOL (Wake On Lan) Connector.
Supports an AMR Connector for use with a software AMR modem card.
(AMR card is Primary only).
Built-in C-Media CMI8738 PCI Sound Onboard.
True Full Duplex playback and recording, built-in 16 bits CODEC.
HRTF 3D positional audio, supports both Direct Sound 3D® & A3D
®
interface, two and four channel speaker mode.
Supports OPL3, MPU401 UART mode and Joystick function.
Downloadable Wave Table Synthesizer, supports Direct Music®.
Supports Digital Audio (SPDIF IN/OUT) module (Optional).
InstallationEP-3C1A
Page 3-1
Section 3
INSTALLATION
Installation EP-3C1A
Page 3-2
Figure 1
EP-3C1A Detailed Layout
InstallationEP-3C1A
Page 3-3
Easy Installation Procedure
The EP-3C1A is designed for high speed 100MHz or 133MHz FSB Socket 370
processors only, such as Intel FC-PGA 370 CuMine (Coppermine) 128K/256K
processors which are based on 0.18 micro process technology and utilizing the
AGTL+ bus architecture at 100 and 133MHz.
The EP-3C1A has the very few jumpers on board, making your installation faster and
easier. In despite of user friendly design, the EP-3C1A offers the flexible FSB
selection, being capable of running speedy FSB at 133MHz for Intel PIII CuMine
CPU & upcoming new Cyrix Socket 370 processors.
Before you get started, please read the following quick installation guide with
careful.
Easy Installation Procedure
The following must be completed before powering on your new system:
3-1. CPU Insertion
3-2. Jumper Settings
3-3. System memory Configuration
3-4. Device Connectors
3-5 External Modem Ring-in Power ON and Keyboard Power ON
Functions (KBPO)
3-6. STR (Suspend To RAM) Function
Section 3-1
CPU Insertion
CPU Insertion: (use CuMineTM for reference)
Step 1
Open the socket by raising the actuation
lever.
Figure 2
Installation EP-3C1A
Page 3-4
Step 2
Insert the processor.
Ensure proper pin 1 orientation by aligning
the FC-PGA corner marking with the socket
corner closest to the actuation arm tip. The
pin field is keyed to prevent mis-oriented
insertion.
Dont force processor into socket. If it does
not go in easily, check for mis-orientation and
debris.
Make sure the processor is fully inserted
into the socket on all sides.
Step 3
Close the socket by lowering and locking the
actuation lever.
Note: Intels reference design thermal solution is an active heatsink; an extruded alumi-
num heatsink based and a fan attached to the top on the fin array. (See Figure 5)
Figure 3
Figure 4
Figure 5
InstallationEP-3C1A
Page 3-5
Processor
Core Frequency
(MHz)
System Bus
Frequency
(MHz)
L2 Cache Size
(Kbytes)
L2 Cache Type CPUID
3
533EB
1
533 133 256 A TC
2
068xh
550E
1
550 100 256 A TC
2
068xh
600E
1
600 100 256 A TC
2
068xh
600EB
1
600 133 256 A TC
2
068xh
650E
1
650 100 256 A TC
2
068xh
667EB
1
667 133 256 A TC
2
068xh
700E
1
700 100 256 A TC
2
068xh
733EB
1
733 133 256 A TC
2
068xh
The table listing all Coppermine processor identification
Notes:
1. B -- 133MHz System Bus Frequency
E -- Processor with Advanced Transfer Cache (CPUID 068xh).
2. ATC = Advanced Transfer Cache. ATC is an L2 Cache integrated on the same
die as the processor core. With ATC, the interface between the processor core
and L2 Cache is 256-bits wide, runs at the same frequency as the processor core
and has enhanced buffering.
3. The Pentium® III Processor Specification Update for the exact CPUID for each
processor.
Installation EP-3C1A
Page 3-6
Section 3-2
Jumper Settings
1
JP1 CMOS Clear
JP1 = 1-2 Normal (Default)
= 2-3 Clear CMOS
1
1
JP10
JP11
CPU Type Select
1
JP7 On Board PCI Sound
JP7 = 1-2 Enabled PCI Sound (Default)
= 2-3 Disabled PCI Sound yrix CPU
JP13
Keyboard Power-ON Function
JP13= 1-2 Enabled
= 2-3 Disabled (Default)
1
01PJ11PJepyTUPC
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X: Dont Care
* : Reserved
InstallationEP-3C1A
Page 3-7
latoT
yromeM
1MMID
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2MMID
)3/2knaB(
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3MMID
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)2/3swoR(
BM652=
mumixaM
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)SSroSD(
enoNenoN
BM215=
mumixaM
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)SSroSD(
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)SSroSD(
enoN
BM867=
mumixaM
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)SSroSD(
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)ylnOSS(
*MARDS/ODE
,BM46,BM23,BM61,BM8
1xBM652,BM821
*)ylnOSS(
* SDRAM only supports 8, 16, 32, 64, 128, 256MB DIMM modules.
* Using non-compliant memory with higher bus speed (over clocking) may severely
compromise the integrity of the system.
* DS : Double Side Memory Module
* SS : Single Side Memory Module
Section 3-3
System Memory Configuration
Memor y Layout
The EP-3C1A supports (3) 168-pin DIMMs (Dual In-line Memory Module). Sockets
are available for 3.3Volt (power level) Synchronous Dynamic Random Access
Memory (SDRAM) of 8, 16, 32, 64, 128MB or 256MB.
This board supports SPD DIMMs Modules only.
This board supports 64Mbit and 128Mbit SDRAM technologies.
The registered DIMM Supports 32Mx4 128Mbit Memory Modules only.
We recommend using at least 125MHz (-8ns) SDRAM DIMM at the 100MHz
(or higher) FSB as timing becomes more critical at these higher speeds.
DIMM SDRAM may be 83MHz (-12ns), 100MHz (-10ns) or 125MHz (-8ns)
bus speed.
Figure 6 and Table 1 show several possible memory configurations using
Figure 6
Table 1
DIMM 1 (M1)
DIMM 2 (M2)
DIMM 3 (M3)
Bank 0/1
Bank 2/3
Bank 3/2
-Synchronous
-SDRAM DIMM
Installation EP-3C1A
Page 3-8
DIMM Module Installation
Figure 7 displays the notch marks and what they should look like on your DIMM
memory module.
DIMMs have 168-pins and two notches that will match with the onboard DIMM
socket. DIMM modules are installed by placing the chip firmly into the socket at
a 90 degree angle and pressing straight down (figure 8) until it fits tightly into the
DIMM socket (figure 9).
Figure 7
Figure 9
DIMM Module clip after installation
To remove the DIMM module simply press down both of the white clips on
either side and the module will be released from the socket.
Figure 8
DIMM Module clip before installation
CENTER KEY ZONE
(3.3 V DRAM)
LEFT KEY ZONE
(UNBUFFERED)
InstallationEP-3C1A
Page 3-9
Section 3-4
Device Connectors
Please install the motherboard into the chassis.
Now that your motherboard is installed you are ready to connect all your connections (figure 10).
J2,J3: Chassis Panel Connector
Power LED, Keylock, Speaker, Reset, Sleep, Turbo LED and HDD LED
J4: CPU Fan Power
A plug-in for the CPU Fan Power
J5: Power Supply Fan Monitoring
A plug-in for the Power supply so that BIOS can monitor the RPMs
J6: Chassis Fan Power
A plug-in for the chassis Fan Power
J7: WOL (Wake On Lan) Connector
PW1: ATX Power Connector
20-pin power connector
IDE1: Primary IDE Connector
IDE2: Secondary IDE Connector
FDD1: Floppy Controller Connector
CD-IN: CD Audio_IN Connector
Pin1(CD_IN_Left), Pin2/Pin3(GND), Pin4(CD_IN_Right)
AUX_IN: Auxiliary Line_IN Connector
Pin1(Left Line_IN), Pin2/Pin3(GND), Pin4(Right Line-IN)
MODEM_IN: Telephony Connector
Pin1(Audio_in), Pin2/Pin3(GND), Pin4(Mic-out to Modem)
JX2: OPTICAL SPDIF-I/O
Figure 10
PS/2 Mouse
PS/2
KEYBOARD
USB port
COM1 COM2
parallel port
Speaker
Line_in
or
Rear speaker
MIC
Joystic/Midi port
Installation EP-3C1A
Page 3-10
Device Connectors (continued)
(This is connected to the power button on the case. Using the Soft-Off
by Pwr-BTTN feature, you can choose either Instant Off (turns system
off immediatly), or 4 sec delay (you need to hold the button down for
4 seconds before the system turns off). When the system is in 4 sec
delay mode, there is a special feature to make the system to go into
suspend mode when the button is pressed momentarily.)
Turbo LED indicator - LED ON when higher speed is selected
IDE LED indicator - LED ON when Onboard PCI IDE Hard disks
is activate
J3
1
+
+
IR Connector
1. VCC 4. GND
2. NC 5. IRTX
3. IRRX
1
Power On/Off
J2
Speaker -
Connect to the system's speaker for beeping
1. Speaker 3. GND
2. N/C 4. GND
Reset - Closed to restart system.
KeyLock - Keyboard lock switch & Power LED connector
1. Power LED(+) 4. KeyLock
2. N/C 5. GND
3. GND
1
1
1
* The power LED lights when the system is
powered on and blinks in SLEEP MODE
(Suspend mode) and STR Mode.
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