NTC thermistors for
temperature measurement
Miniature sensors
with bendable wires
Series/Type: B57869S
Date: March 2013
© EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Applications
Dimensional drawing
Temperature measurement
Features
Uni curve sensor
Short response time
High measuring accuracy
between 0 °C and 70 °C
Excellent long-term stability
Epoxy resin encapsulation
Silver-plated nickel leads
UL approval (E69802)
Options
Alternative lead lengths on request
Delivery mode
Bulk
Dimensions in mm
Approx. weight 60 mg
General technical data
Climatic category (IEC 60068-1) 55/155/56
Max. power (at 25 °C) P
60 mW
25
Temperature tolerance (0 ... 70 °C) ∆T ±0.2, ±0.5 K
Rated temperature T
Dissipation factor (in air) δ
Thermal cooling time constant (in air) τ
Heat capacity C
th
c
25 °C
R
approx. 1.5 mW/K
approx. 12 s
approx. 18 mJ/K
th
Electrical specification and ordering codes
R
25
Ω
No. of R/T
characteristic
B
K
25/100
Ordering code
3 k 8016 3988 B57869S0302+140
5 k 8016 3988 B57869S0502+140
10 k 8016 3988 B57869S0103+140
30 k 8018 3964 B57869S0303+140
+ = Temperature tolerance
F = ±0.2 K
G = ±0.5 K
Important notes at the end of this document.
Page 2 of 18Please read Cautions and warnings and
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Note
For calculation of the R/T characteristics refer to our special tool "NTC R/T calculation". You may
download this tool from the Internet (www.epcos.com/tools → NTC Thermistors → NTC R/T
Calculation).
Reliability data
Test Standard Test conditions ∆R25/R
(typical)
Storage in
dry heat
IEC
60068-2-2
Storage at upper
category temperature
< 2% No visible
T: 155 °C
t: 1000 h
Storage in damp
heat, steady state
IEC
60068-2-78
Temperature of air: 40 °C
Relative humidity of air: 93%
< 1% No visible
Duration: 56 days
Rapid temperature
cycling
IEC
60068-2-14
Lower test temperature: 55 °C
Upper test temperature: 155 °C
< 1% No visible
Number of cycles: 100
Endurance P
: 60 mW
max
< 3% No visible
t: 1000 h
Long-term stability
(empirical value)
Temperature: 70 °C
t: 10000 h
< 2% No visible
Remarks
25
damage
damage
damage
damage
damage
Important notes at the end of this document.
Page 3 of 18Please read Cautions and warnings and
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Reliability data according to AEC Q200, Rev. D
Test Standard Test conditions ∆R25/R
25
(typical)
High temperature
exposure (storage)
Biased humidity MIL-STD-202,
MIL-STD-202,
method 108
method 103
Storage at T = +125 °C
t = 1000 h
T = 85 °C
Relative humidity of air 85%
< 2% No visible
< 2 %
t = 1000 h
Test voltage max. 0.3 V DC on
1)
NTC
Operational life MIL-STD-202,
method 108
T = +125 °C
t = 1000 h
< 2%
Test voltage max. 0.3 V DC on
1)
NTC
Temperature
cycling
JESD 22,
method JA-104
Lower test temperature: 55 °C
Upper test temperature: 125 °C
< 2% No visible
1000 cycles
Dwell time: max. 30 min
Transition time in air: max. 1 min
Terminal strength
(leaded)
Mechanical shock MIL-STD-202,
MIL-STD-202,
method 211
method 213,
condition C
Test leaded device integrity
Condition A: 2.27 N
Acceleration: 40 g
2)
2)
Pulse duration: 6 ms
Number of bumps: 3, each
< 1%
< 1%
direction
Vibration MIL-STD-202,
method 204
Acceleration: 5 g
t = 20 min
< 1% No visible
12 cycles in each of 3 orientations
Frequency range: 10 to 2000 Hz
1) Self heating of theNTCthermistor must not exceed 0.2 K, steady state. Test conditions deviating from AEC Q200, Rev. D.
2) Deviating from AEC Q200, Rev. D.
Remarks
damage
No visible
damage
No visible
damage
damage
No visible
damage
No visible
damage
damage
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Important notes at the end of this document.
Page 4 of 18Please read Cautions and warnings and
Temperature measurement B57869S
Miniature sensors with bendable wires S869
R/T characteristics
R/T No.
T (°C) B
55.0 96.3 7.4
50.0 67.01 7.2
45.0 47.17 6.9
8016 8018
= 3988 K B
25/100
RT/R
25
α (%/K) RT/R
25/100
= 3964 K
25
40.0 33.65 6.7 30.24 6.3
35.0 24.26 6.4 22.1 6.1
30.0 17.7 6.2 16.32 5.9
25.0 13.04 6.0 12.17 5.8
20.0 9.707 5.8 9.153 5.6
15.0 7.293 5.6 6.945 5.4
10.0 5.533 5.5 5.313 5.2
5.0 4.232 5.3 4.097 5.1
0.0 3.265 5.1 3.183 4.9
5.0 2.539 5.0 2.491 4.8
10.0 1.99 4.8 1.963 4.7
15.0 1.571 4.7 1.557 4.6
20.0 1.249 4.5 1.244 4.4
25.0 1.0000 4.4 1.0000 4.3
30.0 0.8057 4.3 0.8083 4.2
35.0 0.6531 4.1 0.6572 4.1
40.0 0.5327 4.0 0.5373 4.0
45.0 0.4369 3.9 0.4418 3.9
50.0 0.3603 3.8 0.365 3.7
55.0 0.2986 3.7 0.303 3.7
60.0 0.2488 3.6 0.2527 3.6
65.0 0.2083 3.5 0.2118 3.5
70.0 0.1752 3.4 0.1783 3.4
75.0 0.1481 3.3 0.1508 3.3
80.0 0.1258 3.2 0.128 3.2
85.0 0.1072 3.2 0.1091 3.2
90.0 0.09177 3.1 0.0933 3.1
95.0 0.07885 3.0 0.08016 3.0
100.0 0.068 2.9 0.0691 2.9
105.0 0.05886 2.9 0.05974 2.9
110.0 0.05112 2.8 0.05183 2.8
115.0 0.04454 2.7 0.04512 2.8
120.0 0.03893 2.6 0.0394 2.7
125.0 0.03417 2.6 0.0345 2.6
130.0 0.03009 2.5 0.03032 2.6
135.0 0.02654 2.5 0.02672 2.5
140.0 0.02348 2.4 0.02361 2.5
145.0 0.02083 2.4 0.02091 2.4
150.0 0.01853 2.3 0.01857 2.4
155.0 0.01653 2.3 0.016537 2.3
α (%/K)
Important notes at the end of this document.
Page 5 of 18Please read Cautions and warnings and
Temperature measurement B57869S
Miniature sensors with bendable wires S869
Mounting instructions
1 Soldering
1.1 Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering Iron soldering
Bath temperature max. 260 °C max. 360 °C
Soldering time max. 4 s max. 2 s
Distance from thermistor min. 6 mm min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2 Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3 SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB.
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier
termination
Important notes at the end of this document.
Page 6 of 18Please read Cautions and warnings and
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