EPCOS B82442-H User Manual
查询B82442-A1535-A300供应商
SIMID 2220-H
High-current version
Size 2220 (EIA) or 5650 (IEC)
Rated inductance 1 to 10000 µH
Rated current 35 to 2500 mA
Construction
■ Upright ferrite drum core
■ Laser-welded winding
■ Flame-retardant encapsulation
Features
■ Very high current handling capability
■ High
L
values
■ Suitable for reflow (IR and vapor phase) and wave soldering
Applications
■ Filtering of supply voltages, coupling, decoupling
■ DC/DC converters
■ Automotive electronics
■ Telecommunications
Terminals
■ Tinned
■ 0,4 µm Cu; 1–2 µm Ag; 5–7 µm Sn
■ Base material CuSn6
■ No leaching during wave soldering
B82442-HSMT Inductors, SIMID Series
Marking
Marking on component:
Manufacturer,
L
value (in nH) and tolerance ofL value (coded),
date of manufacture (coded)
Minimum data on reel:
Manufacturer, part number, ordering code,
L
value and tolerance ofL value,
quantity, date of packing
Delivery mode
12-mm blister tape, wound on 330-mm ∅ reel
For details on taping, packing and packing units see page 153
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SIMID 2220-H
General technical data
B82442-HSMT Inductors, SIMID Series
Rated inductance
Q factor
Q
Rated current
min
L
R
Measured with impedance analyzer HP 4194A
at frequency
f
L
Measured with impedance analyzer HP 4194A
at frequency
I
R
Maximum permissible dc with
inductance decrease ∆L/
f
Q
L
≤ 10 %
0
and temperature increase of ≤ 40 K
at rated temperature of 85°C
Self-resonance frequency
DC resistance
R
max
f
res, min
Measured with network analyzer HP 8753
Measured at 20°C ambient temperature,
measuring current <
I
R
Climatic category In accordance with IEC 60068-1
55/125/56 (– 55°C/+ 125°C/56 days damp heat test)
Solderability In accordance with IEC 60062-2-58
(215 ± 3)°C, (3 ± 0,3) s
Wetting of soldering area: ≥ 90 %
Resistance to soldering heat In accordance with IEC 60068-2-20
260°C, 10 s
∆L/L≤ ± 3%
Permissible PCB bending 2 mm (100 mm long standard PCB)
Weight Approx. 400 mg
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SIMID 2220-H
Dimensional drawing
1)
0,7±0,2
1)
3,5±0,1
5+0,3
0,15 max.
B82442-HSMT Inductors, SIMID Series
1)
0,7 min.
5,6+0,3
Marking
Marking
5+0,3
SSB1261-E
Layout recommendation
A
CB
B
D
SSB1227-Z
Dimensions (mm)
ABCD
Wave/reflow soldering 4,5 2,0 4,0 8,0
1) Soldering area, tinned
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