EON EN27C512 User Manual

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查询EN27C512供应商
EN27C512 512KBIT EPROM (64K x 8)
FEATURES
EN27C512
•
Fast Read Access Time
:
-45, -55, -70, and -90ns
•
•
Programming Voltage +12.75V
•
QuikRite
•
Typical programming time 20µs
•
Low Power CMOS Operation
• 1µ
•
30mA Operation (Max.)
•
CMOS- and TTL-Compatible I/O
•
High-Reliability CMOS Technology
TM
Programming Algorithm
A Standby (Typical)
•
Latch-Up Immunity to 100mA from -1V to V
•
Two-Line Control (
•
Standard Product Identification Code
•
JEDEC Standard Pinout
•
28-pin PDIP
•
32-pin PLCC
•
28-pin TSOP (Type 1)
•
Commercial and Industrial Temperature
CC
+ 1V
OE&CE)
Ranges
GENERAL DESCRIPTION
The EN27C512 is a low-power 512Kbit, 5V-only one-time-programmable (OTP) read-only memory (EPROM). Organized into 64K words with 8 bits per word, it features QuikRite address location programm ing, typically at 20µs per byte. Any byte can be accessed in less than 45ns, eliminating the need for W AIT states in high-performance microprocessor systems. The EN27C512 has separate Output Enable ( bus contention issues.
OE ) and Chip Enable ( CE ) controls which eliminate
TM
single-
FIGURE 1. PDIP
Pin Name Function
A0-A15 Addresses DQ0-DQ7 Outputs
CE Chip Enable OE Output Enable
NC No Connect
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EN27C512
FIGURE 2. TSOP
FIGURE 3. PLCC
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EN27C512
FIGURE 4. BLOCK DIAGRAM
FUNCTIONAL DESCRIPTION THE QUIKRITETM PROGRAMMING OF THE EN27C512
When the EN27C512 is delivered, the chip has all 512K bits in the “ONE”, or HIGH state. “ZEROs” are loaded into the EN27C512 through the procedure of programming.
The programming mode is entered when 12.75 ± 0.25V is applied to the
CEis at V
. For programming, the data to be programmed is applied with 8 bits in parallel to
IL
the data pins.
The QUIKRITE
TM
programming flowchart in Figure 5 shows Eon’s interactive programming algorithm. The interactive algorithm reduces programming time by using 20 µs to 100 µs programming pulses and giving each address only as many pulses as is necessary in order to
reliably program the data. After each pulse is applied to a given address, the data in that address is verified. If the data is not verified, additional pulses are given until it is verified or until the maximum number of pulses is reached. This process is repeated while sequencing through each address of the EN27C512. This part of the programming algorithm is done at
= 6.25V to assure that each EPROM bit is programmed to a sufficiently high threshold
V
CC
voltage. This ensures that all bits have sufficient margin. After the final address is completed, the entire EPROM memory is read at V
= 5.25 ± 0.25V to verify the entire memory.
CC
OE/V
PP
pin and
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EN27C512
PROGRAM INHIBIT MODE
Programming of multiple EN27C512 in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for may be common. A TTL low-level program pulse applied to an EN27C512
OE/V
= 12.75 ± 0.25V will program that EN27C512. A high-level CEinput inhibits the
PP
other EN27C512 from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits to determining that they were correctly programmed. The verification should be performed with should be verified at
t
after the falling edge of CE.
DV
CE, all like inputs of the parallel EN27C512
CEinput with
OE/V
and CEat VIL. Data
PP
AUTO PRODUCT IDENTIFICATION
The Auto Product Identification mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the EN27C512.
To activate this mode, the programming equipment must force 12.0 V ± 0.5V on address line A9 of the EN27C512. Two identifier bytes may then be sequenced from the device outputs by
toggling address line A0 from V V
during Auto Product Identification mode.
IL
Byte 0 (A0 = V
) represents the manufacturer code, and byte 1 (A0 = VIH), the device code. For
IL
the EN27C512, these two identifiers bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (DQ7) defined as the parity
When A1 = VIL, the EN27C512 will read out the binary code of 7F, continuation code, to
bit. signify the unavailability of manufacturer ID codes.
to VIH, when A1 = VIH. All other address lines must be held at
IL
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EN27C512
READ MODE
The EN27C512 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable ( device selection. Output Enable ( the output pins, independent of device selection. Assuming that addresses are stable, address access time (t the outputs (t
) after the falling edge of OE, assuming the CEhas been LOW and
OE
) is equal to the delay from CE to output (tCE) . Data is available at
ACC
addresses have been stable for at least t
STANDBY MODE
CE) is the power control and should be used for
OE) is the output control and should be used to gate data to
- tOE.
ACC
The EN27C512 has CMOS standby mode which reduces the maximum V It is placed in CMOS standby when standby mode which reduces the maximum V standby when state, independent of the
CEis at V
. When in standby mode, the outputs are in a high-impedance
IH
OEinput.
CEis at V
± 0.3 V. The EN27C512 also has a TTL-
CC
current to 1.0 mA. It is placed in TTL-
CC
current to 20µA.
CC
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not occur.
It is recommended that
CEbe decoded and used as the primary device-selection function, while
OEbe made a common connection to all devices in the array and connected to the READ line
from the system control bus. This assures that all deselected memory devices are in their low­power standby mode and that the output pins are only active when data is desired from a particular memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1µF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between V
CC
and VSS to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7µF bulk electrolytic capacitor should be used between V
and VSS for each eight devices. The location of the
CC
capacitor should be close to where the power supply is connected to the array.
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MODE SELECT TAB
/
EN27C512
Mode CE
Read Output Disable Standby (TTL) Standby (CMOS) Program
(4)
Program Verify Program Inhibit Manufacturer Code Device Code
(3)
(3)
V V V V V V V V V
IL IL IH
± 0.3V
CC IL IL IH IL IL
OE
V
PP
V
IL
V
IH
A0 A9 Output
XXD
X X High Z X X X High Z X X X High Z V
PP
V
IL
V
p p
V
IL
V
IL
XXD
XXD
X X High Z
V
IL
V
IH
VH(1) 1C
(1)
VH
NOTES:
1) VH = 12.0V ± 0.5V
2) X = Either V
3) For Manufacturer Code and Device Code, A1 = V
IH
or V
IL
IH
When A1 = VIL, both codes will read 7F
4) See DC Programming Characteristics for V
voltage during programming
PP
EON’S STANDARD PRODUCT IDENTIFICATION CODE
Pins
Code Manufacturer Device Type Continuation
A0 A1 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
01000111001C 111000001183 00011111117F 10011111117F
OUT
IN OUT
83
Hex
Data
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EN27C512
FIGURE 5. QUIKRITETM PROGRAMMING FLOW CHART
NOTE 1: Either 100µs or 20µs pulse.
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ABSOLUTE MAXIMUM RATINGS
EN27C512
Storage Temperature
-65àC to +125àC
Ambient Temperature
with Power Applied -40àC to +85àC
Voltage with Respect to V
All pins except A9, VPP, V A9, V
PP
V
CC
SS
CC
-0.6V to VCC + 0.5V
-0.6V to +13.5V
-0.6V to +7.0V
OPERATING RANGES
Commercial (C)
Case Temperature(Tc) 0àC to +70àC
Industrial (I)
Case Temperature(Tc) -40àC to +85àC
Supply READ Voltages
+4.50V to +5.5V
(Functionality is guaranteed between these limits)
Stresses above those shown above may cause permanent damage to the device. This is a stress rating only and operation above these specifications for extended periods may affect device reliability. Operation outside the
"OPERATING RANGES" shown above voids any and all warranty provisions.
DC CHARACTERISTICS FOR READ OPERATION
Symbol Parameter Min. Max. Unit Conditions
V V V V I I I I I
I
OH
OL
IH IL
LI
LO
CC3
CC2
CC1
PP
Output High Voltage 2.4 V IOH = -0.4mA Output Low Voltage 0.45 V IOL = 2.1mA Input High Voltage 2.0
+0.5
V
CC
V
Input Low Voltage -0.3 0.8 V Input Leakage Current -5 5 µAVIN = 0 to 5.5V Output Leakage Current -10 10 µAV
= 0 to 5.5V
OUT
VCC Power -Down Current 10 µA CE= VCC ± 0.3V VCC Standby Current 1.0 mA CE= V VCC Active Current 30 mA CE= VIL, f=5MHz,
I
= 0mA
OUT
VPP Supply Current Read 100 µA CE= OE = VIL,
VPP = 5.5V
CAPACITANCE
Symbol Parameter Typ. Max. Unit Conditions
C
IN
C
OUT
C
VPP
Input Capacitance 8 12 pF VIN = 0V Output Capacitance 8 12 pF V
OUT
= 0V
VPP Capacitance 18 25 pF VPP = 0V
IH
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EN27C512
AC CHARACTERISTICS FOR READ OPERATION
EN27C512
-45 -55 -70 -90
Symbol Parameter Condition Min Max Min Max Min Max Min Max Unit
tACC (3) Address to
Output Delay
tCE (2) CEto Output
Delay
tOE (2, 3) OE to Output
Delay
tDF (4, 5) OE or CEHigh to Output Float,
whichever occurred first
tOH Output Hold from Address,
CEor OE , whichever occurred
first
CE= OE = V
OE = V
IL
OE = V
IL
IL
0000
45 55 70 90
45 55 70 90
25 25 30 35
20 20 25 25
ns
ns
ns
ns
ns
FIGURE 6. AC WAVEFORMS FOR READ OPERATION
ADDRESS ADDRESS VALID
CE
tCE
tOE
OE
OUTPUT
tACC
HIGH Z
OUTPUT
VALID
tDF
tOH
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FIGURE 7. OUTPUT TEST WAVEFORMS AND MEASUREMENTS
45 and 55 devices:
EN27C512
AC
3.0V
DRIVING
LEVELS
0.0V
tR, tF < 5 ns (10% to 90%)
70 and 90 devices:
2.4V
AC
DRIVING
LEVELS
0.45V
tR, tF < 20 ns (10% to 90%)
1.5V
AC MEASUREMENT LEVEL
2.0
AC MEASUREMENT LEVEL
0.8
Output Test Load
1.3V
(1N914)
3.3K
OUTPUT
PIN
CL
Note: CL = 100pF including jig capacitance, except for the
-45 and -55 devices, where CL = 30pF.
DC PROGRAMMING CHARACTERISTICS
Test Limits
Symbol Parameter Conditions Min. Max Units
I
LI
V
IL
V
IH
V
OL
V
OH
I
CC2
I
PP2
V
ID
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Input Load Current V
IN = VIL
, V
IH
5.0
Input Low Level -0.5 0.8 V Input High Level 0.7 V Output Low Voltage I Output High Voltage
2.1 mA 0.45 V
OL =
I
OH =
-400 µA
2.4 V
VCC Supply Current
CC
V
+ 0.5 V
CC
40 mA
(Program and Verify) V
Supply Current CE= PGM= V
PP
IL,
10 mA
A9 Product Identification Voltage 11.5 12.5 V
10
µA
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EN27C512
FIGURE 8. PROGRAMMING WAVEFORMS
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SWITCHING PROGRAMMING CHARACTERISTICS (TA = + 25° C ± 5°C)
PARAMETER SYMBOL STANDARD PARAMETER DESCRIPTION
t
AS
t
OES
t
OEH
t
DS
t
AH
t
DH
t
DFP
t
PW
t
VCS
t
DV
t
VR OE
Address Setup Time 2
OE
/V
Setup Time 2 µs
PP
OE /VPP Hold Time 2 µs Data Setup Time 2 µs Address Hold Time 0 µs Data Hold Time 2 µs Output Enable to Output Float Delay 0 130 ns
PGMProgram Pulse Width 20 105 V
Setup Time 2
cc
Data Valid from
/V
Hold Time 2
PP
CE
EN27C512
Min. Max Units
µs
µs µs
150
ns µs
ORDERING INFORMATION
EN27C512 45 P I
TEMPERATURE RANGE
(Blank) = Commercial ( 0àC to +70àC) I = Industrial ( -40àC to +85àC)
PACKAGE
P = 28 Plastic DIP J = 32 Plastic PLCC T = 28 Plastic TSOP
SPEED
45 = 45ns 55 = 55ns 70 = 70ns 90 = 90ns
BASE PART NUMBER
EN = EON Silicon Devices 27 = EPROM C = CMOS 512 = 64K x 8
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