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SFX12V

Enhance SFX12V Version 2.2 Power Supply Design Guide

SFX/SFX12V Power Supply Design Guide
Version 2.2
Document Revision
Version Release Date Notes
1.1 4/98
2.0 5/01 • Added SFX12V description
2.1 8/01 • Section 4.4 Updated Figure 4 SFX/SFX12V Connectors
• Updated all mechanical outlines to clean up dimensioning of mounting holes.
• Added chassis cutouts for all mechanical outlines to clarify keep-out areas.
• Added Appendix C.
• Additional power ratings added
• Updated industry standards
• Increased standby current
• Section 5.8 removed vendor name
2.2 12/05 • Section 3.23 Typical Power Distribution. Change minimum loading on 5V rail to 0.3A
• Section 3.3.2 PS_ON#. Add text “The power supply should not latch into a shutdown state when PS_ON# is driven active by pulses between 10ms to 100ms during the decay of the power rails.”
SFX/SFX12V Power Supply Design Guide Version 2.2
IMPORTANT INFORMATION AND DISCLAIMERS
1. INTEL CORPORATION (AND ANY CONTRIBUTOR) IS PROVIDING THIS INFORMATION AS A CONVENIENCE AND ACCORDINGLY MAKES NO WARRANTIES WITH REGARD TO THIS DOCUMENT. IN PARTICULAR, INTEL (AND ANY CONTRIBUTOR) DOES NOT WARRANT OR REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL OPERATE IN THE INTENDED MANNER. NOR DOES INTEL (OR ANY CONTRIBUTOR) ASSUME RESPONSIBILITY FOR ANY ERRORS THAT THE DOCUMENT MAY CONTAIN.
2. NO REPRESENTATIONS OR WARRANTIES ARE MADE THAT ANY PRODUCT BASED IN WHOLE OR IN PART ON THE ABOVE DOCUMENT WILL BE FREE FROM DEFECTS OR SAFE FOR USE FOR ITS INTENDED PURPOSE. ANY PERSON MAKING, USING OR SELLING SUCH PRODUCT DOES SO AT HIS OR HER OWN RISK.
3. INTEL DISCLAIMS ALL LIABILITY ARISING FROM USE OF OR IN CONNECTION WITH THE INFORMATION PROVIDED IN THIS DOCUMENT, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS RELATING TO THE INFORMATION OR THE IMPLEMENTATION OF INFORMATION IN THIS DOCUMENT. INTEL DOES NOT WARRANT OR REPRESENT THAT SUCH DEVICES OR IMPLEMENTATION WILL NOT INFRINGE SUCH RIGHTS. INTEL IS NOT OBLIGATED TO PROVIDE ANY SUPPORT, INSTALLATION OR OTHER ASSISTANCE WITH REGARD TO THE INFORMATION.
4. THE INFORMATION REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STANDARD COMMERCIAL USE ONLY. CUSTOMERS ARE SOLELY RESPONSIBLE FOR ASSESSING THE SUITABILITY OF THE INFORMATION FOR USE IN PARTICULAR APPLICATIONS. THE INFORMATION IS NOT INTENDED FOR USE IN CRITICAL CONTROL OR SAFETY SYSTEMS, MEDICAL OR LIFE SAVING APPLICATIONS, OR IN NUCLEAR FACILITY APPLICATIONS.
5. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED HEREIN.
Copyright 2000, 2001 Intel Corporation. All rights reserved. Version 0.9 of updated SFX PSDG, Mar 2001
†
Third-party brands and names are the property of their respective owners.
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SFX/SFX12V Power Supply Design Guide
Version 2.2
Contents
1. Introduction....................................................................................................................................6
1.1. Scope.....................................................................................................................................6
1.2. Proposed changes for Version 2.0.........................................................................................6
1.2.1. Reformat....................................................................................................................6
1.2.2. Increased Power........................................................................................................6
1.2.3. Increased +5 VSB Current ........................................................................................6
1.2.4. External Fan Control - Optional..................................................................................6
1.2.5. SFX12V......................................................................................................................7
2. Applicable Documents..................................................................................................................7
3. Electrical.........................................................................................................................................9
3.1. AC Input .................................................................................................................................9
3.1.1. Input Overcurrent Protection .....................................................................................9
3.1.2. Inrush Current Limiting..............................................................................................9
3.1.3. Input Under Voltage...................................................................................................10
3.1.4. Regulatory.................................................................................................................10
3.1.5. Catastrophic Failure Protection.................................................................................10
3.2. DC Output ..............................................................................................................................10
3.2.1. DC Voltage Regulation..............................................................................................10
3.2.2. Remote Sensing........................................................................................................11
3.2.3. Typical Power Distribution.........................................................................................11
3.2.4. Power Limit / Hazardous Energy Levels....................................................................13
3.2.5. Efficiency...................................................................................................................13
3.2.6. Output Ripple/Noise ..................................................................................................14
3.2.7. Output Transient Response ......................................................................................15
3.2.8. Capacitive Load.........................................................................................................16
3.2.9. Closed-loop Stability..................................................................................................16
3.2.10. +5 VDC / +3.3 VDC Power Sequencing..................................................................16
3.2.11. Voltage Hold-up Time..............................................................................................16
3.3. Timing / Housekeeping / Control............................................................................................17
3.3.1. PWR_OK...................................................................................................................17
3.3.2. PS_ON# ....................................................................................................................18
3.3.3. +5 VSB ......................................................................................................................19
3.3.4. Power-on Time..........................................................................................................19
3.3.5. Rise Time..................................................................................................................19
3.3.6. Overshoot at Turn-on / Turn-off ................................................................................20
3.3.7. Reset after Shutdown................................................................................................20
3.3.8. +5 VSB at AC Power-down .......................................................................................20
3.4. Output Protection ...................................................................................................................20
3.4.1. Over Voltage Protection ............................................................................................20
3.4.2. Short-circuit Protection..............................................................................................20
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SFX/SFX12V Power Supply Design Guide Version 2.2
3.4.3. No-load Operation.....................................................................................................21
3.4.4. Over Current Protection.............................................................................................21
3.4.5. Over-Temperature Protection....................................................................................21
3.4.6. Output Bypass...........................................................................................................21
4. Mechanical .....................................................................................................................................21
4.1. Labeling / Marking..................................................................................................................21
4.2. Airflow / Fan ...........................................................................................................................22
4.3. AC Connector.........................................................................................................................22
4.4. DC Connectors.......................................................................................................................23
4.4.1. SFX Main Power Connector......................................................................................24
4.4.2. Peripheral Connector(s) ............................................................................................25
4.4.3. Floppy Drive Connector.............................................................................................25
4.4.4. +12 V Power Connector (for SFX12V only)...............................................................25
5. Environmental................................................................................................................................26
5.1. Temperature...........................................................................................................................26
5.2. Thermal Shock (Shipping)......................................................................................................26
5.3. Humidity .................................................................................................................................26
5.4. Altitude ...................................................................................................................................26
5.5. Mechanical Shock..................................................................................................................26
5.6. Random Vibration...................................................................................................................27
5.7. Acoustics................................................................................................................................27
5.8. Ecological Requirements.......................................................................................................27
6. Electromagnetic Compatibility.....................................................................................................28
6.1. Emissions...............................................................................................................................28
6.1.2 Immunity................................................................................................................................28
6.2. Input Line Current Harmonic Content ....................................................................................28
6.3. Magnetic Leakage Fields .......................................................................................................29
6.4. Reliability................................................................................................................................29
6.5. Mean Time Between Failures (MTBF)...................................................................................29
6.6. Voltage Fluctuations and Flicker...........................................................................................30
7. Safety..............................................................................................................................................30
7.1. North America........................................................................................................................30
7.2. International............................................................................................................................31
8....SYSTEM COOLING CONSIDERATIONS......................................................................................31
APPENDIX A GUIDELINES FOR A LOWER PROFILE PACKAGE ......................................32
APPENDIX B GUIDELINES FOR A TOP MOUNT FAN PACKAGE ......................................34
APPENDIX C GUIDELINES FOR A REDUCED DEPTH, TOP MOUNT FAN PACKAGE.....37
APPENDIX D GUIDELINES FOR A LOWER PROFILE PACKAGE......................................40
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SFX/SFX12V Power Supply Design Guide
Version 2.2
Figures
Figure 1. Differential Noise Test Setup.................................................................................................15
Figure 2. Power Supply Timing.............................................................................................................17
Figure 3. PS_ON# Signal Characteristics.............................................................................................19
Figure 4. SFX/SFX12V Connectors......................................................................................................23
Figure 5 40 mm Profile Mechanical Outline..........................................................................................33
Figure 6 Chassis Cutout.......................................................................................................................33
Figure 7 Top Mount Fan Profile Mechanical Outline ............................................................................35
Figure 8 Chassis Cutout.......................................................................................................................36
Figure 9 Recessed Fan Mounting.........................................................................................................36
Figure 10 Reduced Depth Top Mount Fan Profile Mechanical Outline ................................................38
Figure 11 Chassis cutout......................................................................................................................39
Figure 12 60 mm Mechanical Outline...................................................................................................41
Figure 13 Chassis Cutout.....................................................................................................................42
Tables
Table 1. AC Input Line Requirements...................................................................................................9
Table 2. DC Output Voltage Regulation ...............................................................................................10
Table 3. Typical Power Distribution for a 90 W SFX Configuration......................................................11
Table 4. Typical Power Distribution for a 120 W SFX Configuration....................................................11
Table 5. Typical Power Distribution for a 150 W SFX Configuration...................................................12
Table 6. Typical Power Distribution for a 160 W SFX12V Configuration..............................................12
Table 7. Typical Power Distribution for 180 W SFX12V Configuration.................................................13
Table 8 Energy Star Input Power Consumption.................................................................................14
Table 9. DC Output Noise/Ripple .........................................................................................................14
Table 10. DC Output Transient Step Sizes...........................................................................................15
Table 11. Output Capacitive Loads ......................................................................................................16
Table 12. PWR_OK Signal Characteristics..........................................................................................18
Table 13. PS_ON# Signal Characteristics............................................................................................18
Table 14. Over Voltage Protection........................................................................................................20
Table 15: Harmonic Limits, Class A equipment....................................................................................29
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SFX/SFX12V Power Supply Design Guide Version 2.2
1. Introduction
1.1. Scope
This document provides design suggestions for a family of small form factor power supplies that are primarily intended for use with microATX and FlexATX systems. The connectors conform to the basic requirements of the ATX main board specification except that -5 V is not available. It should not be inferred that all SFX power supplies must conform exactly to the content of this document. The design specifics described are not intended to support all possible systems, because power supply needs vary depending on system configuration.
1.2. Proposed changes for Version 2.0
This section provides a brief summary of the proposed changes to revise the SFX Power Supply Design Guide from Version 1.1 to Version 2.0.
1.2.1. Reformat
This design guide has been reformatted to more clearly show the case outline options.
1.2.2. Increased Power
The trend for faster and more powerful systems results in an increasing need for higher rated power supplies. Additional power ratings have been added with increased 5 VDC and 12 VDC current to meet the needs of present and future system needs. Power ratings have been added at 120 W and 150 W. These have been added for guidance and are not intended to limit the choice of power ratings available.
1.2.3. Increased +5 VSB Current
Trends in PC system power management solutions (for example, Instantly Available PC and Suspend-to-RAM) are driving a need for increased +5 VSB current capability for all SFX-family power supplies. The previous +5 VSB output requirement is being raised to 1.0 amps minimum, with 2.0 amps preferred. Recommendations for momentary peak current have also been added to enable USB "wake on" devices. See Section 3.3.3 for details.
1.2.4. External Fan Control - Optional
With the implementation of Suspend To RAM (STR or S3 sleep state), the system can obtain a low power condition without the need for external fan shutoff. In STR mode, the main outputs including 12 V are not available from the power supply and all system fans and the power supply fan will be off. FANC and FANM functions described in Version 1.1 have been removed for Version 2.0. Some vendors may still offer the external Fan functions as an option.
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SFX/SFX12V Power Supply Design Guide
Version 2.2
1.2.5. SFX12V
The latest generation of motherboards will have power delivery based on a 12 V rail. To meet the needs of the higher 12 V current, a new connector has been defined to meet the increased current needs of these motherboards. Wattages at 160 W and 180 W have been defined to meet the requirements of Intel Pentium® 4 processor-based systems.
2. Applicable Documents
The latest revision in effect of the following documents forms a part of this document to the extent specified.
Document title Description
AB13-94-146
ANSI C62.41-1991 IEEE Recommended Practice on Surge Voltages in Low-Voltage AC Circuits ANSI C62.45-1992 IEEE Guide on Surge Testing for Equipment Connected to Low-Voltage AC Power
MIL-STD-105K Quality Control MIL-STD-217F Reliability Predictions for Electronic Equipment MIL-C-5541 Chemical Conversion Coatings on Aluminum and Aluminum Alloys CSA C22.2 No.234, Level 3 Safety of Component Power Supplies (Intended for use with Electronic Data
CAN/CSA C22.2 No.950-95, 3rd edition
UL 1950, 3rd edition, without D3 Deviation
IEC 60950, 2nd ed. 1991: plus A1, A2, A3, A4
EN 60950, 2nd ed. 1992: plus A1, A2, A3, A4
EMKO-TSE (74-SEC) 207/94 Nordic national requirement in addition to EN 60950 CISPR 22:1997 3rd edition
EN 55022:1998 ANSI C63.4 – 1992 American National Standard for Methods of Measurement of Radio-Noise
AS/NZS 3548 (Class B) Australian Communications Authority, Standard for Electromagnetic Compatibility
CNS 13438 Limits and methods of measurement of radio disturbance characteristics of
EN 55024:1998 Information technology equipment—Immunity characteristics—Limits and methods
European Association of Consumer Electronics Manufacturers (EACEM) Hazardous Substance List / Certification
Circuits
Processing Equipment and Office Machines) Safety of Information Technology Equipment Including Electrical Business
Equipment Safety of Information Technology Equipment Including Electrical Business
Equipment Safety of Information Technology Equipment Including Business Equipment
Safety of Information Technology Equipment Including Business Equipment
Limits and Methods of Measurements of Radio Interference Characteristics of Information Technology Equipment, Class B
Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz for EMI testing
(AU & NZ)
Information Technology Equipment (Taiwan & China)
of measurement
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SFX/SFX12V Power Supply Design Guide Version 2.2
CISPR 24: 1997 Information technology equipment—Immunity characteristics—Limits and methods
of measurement
EN 61000-3-2 Electromagnetic compatibility (EMC)—Part 3: Limits—Section 2: Limits for
harmonic current emissions, Class D
IEC 61000-4- Electromagnetic compatibility (EMC) for industrial-process measurement and
control equipment—Part 4: Testing and measurement techniques
Section -2: Electrostatic discharge Section -3: Radiated, radio-frequency, electromagnetic field Section -4: Electrical fast transient / burst Section -5: Surge Section -6: Conducted disturbances, induced by radio-frequency fields Section -8: Power frequency magnetic fields Section -11: Voltage dips, short interruptions, and voltage variations
Japan Electric Association Guidelines for the Suppression of Harmonics in Appliances and General Use
Equipment IEC Publication 417 International Graphic Symbol Standard ISO Standard 7000 Graphic Symbols for Use on Equipment CFR 47, Part 15, Subpart B FCC Regulations pertaining to unintentional radiators (USA)
ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus (Canada) VCCI V-3/99.05 (Class B) Implementation Regulations for Voluntary Control of Radio Interference by Data
processing Equipment and Electronic Office Machines (Japan)
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SFX/SFX12V Power Supply Design Guide
Version 2.2
3. Electrical
The electrical requirements that follow are to be met over the environmental ranges specified in Section 5 unless otherwise noted.
3.1. AC Input
Table 1 lists AC input voltage and frequency requirements for continuous operation. The power supply shall be capable of supplying full-rated output power over two input voltage ranges rated 100-127 VAC and 200-240 VAC rms nominal. The correct input range for use in a given environment may be either switch-selectable or auto-ranging. The power supply shall automatically recover from AC power loss. The power supply must be able to start up under peak loading at 90 VAC.
Table 1. AC Input Line Requirements
Parameter Minimum Nominal
(Note)
Vin (115 VAC) 90 115 135 VAC Vin (230 VAC) 180 230 265 VAC Vin Frequency 47 -- 63 Hz
Note: Nominal voltages for test purposes are considered to be within ±1.0 V of nominal.
Maximum Unit
rms
rms
3.1.1. Input Overcurrent Protection
The power supply shall incorporate primary fusing for input overcurrent protection to prevent damage to the power supply and meet product safety requirements. Fuses should be slow-blow– type or equivalent to prevent nuisance trips1.
3.1.2. Inrush Current Limiting
Maximum inrush current from power-on (with power on at any point on the AC sine) and including, but not limited to, three line cycles, shall be limited to a level below the surge rating of the input line cord, AC switch if present, bridge rectifier, fuse, and EMI filter components. Repetitive ON/OFF cycling of the AC input voltage should not damage the power supply or cause the input fuse to blow.
1
. For Denmark and Switzerland international safety requirements, if the internal over-current protective devices exceed 8A for Denmark and 10A for Switzerland, then the power supply must pass international safety testing to EN 60950 using a maximum 16A over-current protected branch circuit, and this 16A (time delay fuse) branch circuit protector must not open during power supply abnormal operation (output short circuit and component fault) testing.
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SFX/SFX12V Power Supply Design Guide Version 2.2
3.1.3. Input Under Voltage
The power supply shall contain protection circuitry such that the application of an input voltage below the minimum specified in Section 3.1, Table 1, shall not cause damage to the power supply.
3.1.4. Regulatory
At a minimum, both system and power supply typically must pass safety and EMC testing per the limits and methods described in EN 55024 prior to sale in most parts of the world. Additional national requirements may apply depending on the design, product end use, target geography, customer, and other variables. Consult your company’s Product Safety and Regulations department for more details.
3.1.5. Catastrophic Failure Protection
Should a component failure occur, the power supply should not exhibit any of the following:
• Flame
• Excessive smoke
• Charred PCB
• Fused PCB conductor
• Startling noise
• Emission of molten material
• Earth ground fault (short circuit to ground or chassis enclosure)
3.2. DC Output
3.2.1. DC Voltage Regulation
The DC output voltages shall remain within the regulation ranges shown in Table 2 when measured at the load end of the output connectors under all line, load, and environmental conditions. The voltage regulation limits shall be maintained under continuous operation for a period of time equal to or greater than the MTBF specified in Section 6.5 at any steady state temperature and operating conditions specified in Section 5.
Table 2. DC Output Voltage Regulation
Output Range Minimum Nominal Maximum Unit
+12 VDC (Note) ±5% +11.40 +12.00 +12.60 Volts +5 VDC ±5% +4.75 +5.00 +5.25 Volts +3.3 VDC ±5% +3.14 +3.30 +3.47 Volts
-12 VDC ±10% -10.80 -12.00 -13.20 Volts +5 VSB ±5% +4.75 +5.00 +5.25 Volts
Note: At +12 VDC peak loading, regulation at the +12 VDC output can go to ± 10%.
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SFX/SFX12V Power Supply Design Guide
Version 2.2
3.2.2. Remote Sensing
The +3.3 VDC output should have provisions for remote sensing to compensate for excessive cable drops. The default sense should be connected to pin 11 of the main power connector. The power supply should draw no more than 10 mA through the remote sense line to keep DC offset voltages to a minimum.
3.2.3. Typical Power Distribution
DC output power requirements and distributions will vary based on specific system options and implementation. Significant dependencies include the quantity and types of processors, memory, add-in card slots, and peripheral bays, as well as support for advanced graphics or other features. Tables 3 through 7 show the power distribution for power supplies in the range of 90 W to 180 W. It is ultimately the responsibility of the designer to define a power budget for a given target product and market.
SFX Power Distribution Tables
Table 3. Typical Power Distribution for a 90 W SFX Configuration
Output Minimum
Current (amps)
Maximum Current (amps)
Peak Current (amps)
+12 VDC 0.0 1.5 4.8
+5 VDC 0.3 11.0
+3.3 VDC 0.3 6.0
-12 VDC 0.0 0.2 +5 VSB 0.0 1.0 1.5
Table 4. Typical Power Distribution for a 120 W SFX Configuration
Output Minimum
Current (amps)
Maximum Current (amps)
Peak Current (amps)
+12 VDC 0.2 3 6
+5 VDC 0.3 12.0
+3.3 VDC 0.3 6.0
-12 VDC 0.0 0.2 +5 VSB 0.0 1.0 2.0
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SFX/SFX12V Power Supply Design Guide Version 2.2
Table 5. Typical Power Distribution for a 150 W SFX Configuration
Output Minimum
Current (amps)
+12 VDC 0.2 5 8
+5 VDC 0.3 14.0
+3.3 VDC 0.3 12.0
-12 VDC 0.0 0.3 +5 VSB 0.0 1.5 2.0
Maximum Current (amps)
Peak Current (amps)
SFX12V Power Distribution Tables
Table 6. Typical Power Distribution for a 160 W SFX12V Configuration
Output Minimum
Current (amps)
+12 VDC 2.0 8.0 10.0
+5 VDC 0.3 12.0 (Note)
+3.3 VDC 0.5 16.7 (Note)
-12 VDC 0.0 0.3 +5 VSB 0.0 1.5 2.0
Note: Total combined output of 3.3 V and 5 V is < 61 W.
Maximum Current (amps)
Peak Current (amps)
12 10
8 6 4
12V Load (A)
2 0
0 5 10 15 20
5V + 3.3V Combined Load (A)
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Table 7. Typical Power Distribution for 180 W SFX12V Configuration
Output Minimum
Current (amps)
+12 VDC 2.0 10.0 13.0 +5 VDC 0.3 12.0 (Note) +3.3 VDC 0.5 16.7 (Note)
-12 VDC 0.0 0.3 +5 VSB 0.0 1.5 2.0
Note: Total combined output of 3.3 V and 5 V is < 61 W
Maximum Current (amps)
Peak Current (amps)
SFX/SFX12V Power Supply Design Guide
Version 2.2
14 12 10
8 6 4
12V Load (A)
2 0
0 5 10 15 20
5V + 3.3V combined Load (A)
3.2.4. Power Limit / Hazardous Energy Levels
Under normal or overload conditions, no output shall continuously provide 240 VA under any conditions of load including output short circuit, per the requirement of UL 1950/CSA 950 / EN 60950/IEC 950.
3.2.5. Efficiency
3.2.5.1. General
The power supply should be a minimum of 68% efficient under maximum rated load. The efficiency of the power supply should be met over the AC input range defined in Table 1, under the load conditions defined in Section 3.2.3, and under the temperature and operating conditions defined in Section 7.
3.2.5.2. Energy Star
The “Energy Star” efficiency requirements of the power supply depend on the intended system configuration. In the low-power / sleep state (S1 or S3) the system should consume power in accordance with the values listed in Table 8.
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