EMERGING DISPLAY ET028002DMU User Manual

EXAMINED BY :

APPROVED BY

:

C

USTOMER

FILE NO

. CAS-0006526

EMERGING DISPLAY

ISSUE

: NOV.27, 2007

TECHNOLOGIES CORPORATION

TOTAL PAGE

VERSION

: 2

: 27

A

CCEPTANCE

S

PECIFICATIONS

MODEL NO. :

E T 0 2 8 0 0 2 D M U

FOR MESSRS :

(R oH S )

CUSTOMER'S APPROVAL

:

DATE

_____________________________

:

BY

_____________________________

02101300-01-02

θ

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θ

⎯

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θ

⎯

θ

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E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

R E C O R D S OF R E V I S I O N

D A T E

NOV.27, 2007 1 2. MECHANICAL SPECIFICATIONS

ADD (10) INTERFACE MODE : RGB : 16/18 BIT
MCU : 8/16/18 BIT PARALLEL DATA
SPI DATA
2 3.1 ELECTRICAL ABSOLUTE MAXIMUM RATINGS

3 ADD 4.2 AC CHARACTERISTICS
9 , 10 5. OPTICAL CHARACTERISTICS

ADD NOTE (2)~(7)
ADD 5.2 THE TEST METHOD OF BRIGHTNESS AND UNIFORMITY
ADD 5.3 THE CALCULATING METHOD OF UNIFORMITY
12 7. BLOCK DIMENSIONS
MODIFY IC GATE NO.
14 , 15 9. INTERFACE SIGNAL
UPDATE PIN 17~PIN 34 FUNCTION
16 10. POWER SUPPLY

DELETE 12.4 OUTLINE OF OPTICAL MEASURING SYSTEM
25 12.4.1 STANDARD SPECIFICATIONS FOR RELIABILITY OF LCD MODULE

REVISED

PAGE

NO.

⎯

(1)DISPLAY SIZE (inch) : 2.8” → DIAGONALS : 2.8 inch

POWER SUPPLY FOR DIGITAL IOVCC -0.3 3.3 V

POWER SUPPLY FOR DIGITAL IOVCC -0.3 4.6 V

VIEWING
ANGLE

CONTRAST RATIO CR 400 500
RESPONSE TIME
THE BRIGHTNESS

OF MODULE

COLOR OF
CIE
COORDINATE

VIEWING
ANGLE

CONTRAST RATIO CR 400 500
RESPONSE TIME
THE BRIGHTNESS

OF MODULE

COLOR OF
CIE
COORDINATE

PARAMETER SYMBOL MIN. MAX. UNIT REMARK

PARAMETER SYMBOL MIN. MAX. UNIT REMARK

I T E M SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK

I T E M SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK

VDD

VDDI

GND

VLED(A)

VLED(K4)

LCD MODULE

DELETE 12.3 DEFINITION OF OPTICAL CHARACTERISTICS

NO. 4 : 40°C → 50°C, NO. 5 : 40°C → 60°C

MODEL NO.

E T 0 2 8 0 0 2 D M U

DOC . FIRST ISSUE

x+

θ

HOR.

VER.

WHITE

RED

GREEN

BLUE

HOR.

VER.

WHITE

RED

GREEN

BLUE

CENTER

x-

CR≥10

y+

θ

y-

t r ( rise )
t f ( fall )

B 300 350

VIEWING

X 0.290 0.310 0.330

NORMAL AUNLE

Y 0.321 0.341 0.361
X 0.635 0.655 0.675
Y 0.309 0.329 0.349
X 0.292 0.312 0.332
Y 0.555 0.575 0.595
X 0.114 0.134 0.154
Y

x+

θ

x­y+

θ

y-

t r ( rise )
t f ( fall )

B 300 350

Wx 0.290 0.310 0.330
Wy 0.321 0.341 0.361

Rx 0.635 0.655 0.675
Ry 0.309 0.329 0.349
Gx 0.292 0.312 0.332
Gy 0.555 0.575 0.595
Bx 0.114 0.134 0.154
By

1.65 ~3.3V

CENTER

NORMAL AUNLE

IF=80mA

x = 0°

θ

y = 0

θ

CR≥10

NTSC：60%

VIEWING

x = 0°

θ

y = 0

θ

2.3~3.3V

VF(3.3V)

S U M M A R Y

y=0

θ

°

x=0

θ

°

°

y=0

θ

°

x=0

θ

°

°

70 75

70

65

75

70

55

50

10 20

⎯

15 30

0.115 0.135 0.155

70 75

70

65

75

70

55

50

10 20

⎯

15 30

0.115 0.135 0.155

VDD

VDDI

GND

→

VLED(A)

VLED(K1)
VLED(K2)
VLED(K3)
VLED(K4)

LCD MODULE

VERSION PAGE

2 0-1

NOV.05, 2007

→

⎯

deg .

ms

cd/m

⎯

⎯

⎯

⎯

deg .

ms

cd/m

⎯

⎯

⎯

⎯

2

⎯
⎯
⎯
⎯

2

⎯

⎯

⎯

⎯

(3)

(4)
(5)

(6)

(7)

1.65 ~3.3V

→

2.3~3.3V

IF=80mA

⎯

⎯

⎯

⎯

⎯

⎯

⎯

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

VERSION PAGE

2 0-2

T A B L E O F C O N T E N T S

NO. I T E M PAGE
===============================================================

1.

2. MECHANICAL SPECIFICATIONS

3.

4.

5.

6.

7.

8. DETAIL DRAWING OF DOT MATRIX

9. INTERFACE SIGNAL

10. POWER SUPPLY

11. SPECIFICATION OF AUDACITY ASSURANCE

GENERAL SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
OPTICAL CHARACTERISTICS
OUTLINE DIMENSIONS
BLOCK DIMENSIONS

----------------------------------------------------

--------------------------------------------

---------------------------------------------

-------------------------------------------------

-------------------------------------------------------

---------------------------------------

-------------------------------------

-------------------------------------

---------------------------------------

---------------------------------

-----------------------

1
1
2

3 ~ 8

9 , 10

11
12
13

14 , 15

16

17 ~ 27

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

1. GENERAL SPECIFICATIONS

1 . 1 APPLICATION NOTES FOR CONTROLLER/DRIVER
PLEASE REFER TO :

H I M A X H X 8 3 4 7 - A

1 . 2 MATERIAL SAFETY DESCRIPTION

ASSEMBLIES SHALL COMPLY WITH EUROPEAN ROHS REQUIREMENTS,
INCLUDING PROHIBITED MATERIALS/COMPONENTS CONTAINING
LEAD,MERCURY, CADMIUM, HEXAVALENT CHROMIUM,
POLYBROMINATED BIPHENYLS (PBB) AND POLYBROMINATED
DIPHENYL ETHERS (PBDE)

2 . MECHANICAL SPECIFICATIONS

( 1 ) DIAGONALS

( 2 ) NUMBER OF DOTS

( 3 ) MODULE SIZE

------------------------------------

--------------------------

--------------------------------

2.8 inch
240W * (RGB) * 320H DOTS
50W * 69.2H * 3(D) mm
(WITHOUT FPC SIZE)

VERSION PAGE

2 1

( 4 ) ACTIVE AREA
( 5 ) PIXEL SIZE

( 6 ) LCD TYPE
( 7 ) COLOR
( 8 ) VIEWING DIRECTION
( 9 ) BACK LIGHT

( 10 ) INTERFACE MODE

---------------------------------

-------------------------------------

-----------------------------------

--------------------------------------

----------------------------------

-----------------------

---------------------------

43.2W * 57.6H mm (LCD)

0.18W * 0.18H mm
TFT , TRANSMISSIVE
262K (18BIT)
12 O’CLOCK
LED , COLOR : WHITE
RGB : 16/18 BIT

MCU : 8/16/18 BIT PARALLEL DATA
SPI DATA

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

VERSION PAGE

2 2

3 . ABSOLUTE MAXIMUM RATINGS

3 . 1 ELECTRICAL ABSOLUTE MAXIMUM RATINGS .

POWER SUPPLY FOR DIGITAL IOVCC -0.3 4.6 V
POWER SUPPLY FOR ANALOG VCI -0.3 4.6 V
INPUT VOLTAGE V

OPERATING STORAGE

HUMIDITY

VIBRATION

SHOCK

CORROSIVE GAS NOT ACCEPTABLE NOT ACCEPTABLE

3 . 2 ENVIRONMENTAL ABSOLUTE MAXIMUM RATINGS .

AMBIENT TEMPERATURE

PARAMETER SYMBOL MIN. MAX. UNIT REMARK

-0.3 VCI+0.3 V

IN

I T E M

MIN. MAX. MIN. MAX.

-20°C 70°C -30°C 80°C

⎯

⎯

⎯

⎯

2.45m/S
( 0.25G)

29.4 m/S
( 3G)

⎯

2

⎯

2

⎯

⎯

11.76m/S
( 1.2 G )

490m/S

( 50 G )

REMARK

NOTE ( 2 ), ( 3 )
WITHOUT

CONDENSATION
NOTE ( 4 )
5~20Hz , 1HR

2

20~500Hz(20Hz) , 1HR
20~500Hz(500Hz) , 1HR

X,Y,Z,TOTAL 3HR
10 m SECONDS

2

XYZ
DIRECTIONS
1 TIME EACH

NOTE ( 2 ) : Ta AT -30°C : 48HR MAX .

80°C : 168HR MAX .
NOTE ( 3 ) : BACKGROUND COLOR CHANGES SLIGHTLY DEPENDING ON AMBIENT
TEMPERATURE THIS PHENOMENON IS REVERSIBLE.
NOTE ( 4 ) : Ta ≤ 60°C : 90%HR (96RH MAX .)
Ta > 60°C : ABSOLUTE HUMIDITY MUST BE LOWER THAN THE HUMIDITY OF
90%RH AT 60°C.(96 HR MAX.)

02101300-01-02

N

N

N

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

4 . ELECTRICAL CHARACTERISTICS

4 . 1 DC CHARACTERISTICS

PARAMETER SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK

INPUT POWER SUPPLY VCI

INTERFACE OPERATION
VOLTAGE

IOVCC

OPERATION

VOLTAGE

I/O SUPPLY

VOLTAGE

VERSION PAGE

2 3

Ta = 25 °C

2.3 2.8 3.3 V

1.65 2.8 3.3 V

INPUT CURRENT IDD
V

INPUT VOLTAGE
NOTE ( 1 )

V

OUTPUT VOLTAGE
NOTE ( 1 )

H LEVEL

IH

L LEVEL -0.3

V

IL

H LEVEL

OH

L LEVEL

V

OL

⎯

⎯

0.8* I

0.8* I

⎯

OVCC

OVCC

5 10 mA

V

I

⎯
⎯

⎯
⎯

OVCC

0.2* I

0.8* I

⎯

OVCC

OVCC

V
V

V

NOTE ( 1 ) : APPLIED TO TERMINALS /RESET , /RS ,/WR,/RD,/CS , D17 , D16…….D0.

4 . 2 AC CHARACTERISTICS

4.2.1 PARALLEL INTERFACE CHARACTERISTICS (8080-SERIES MPU)

t

CHW

CS

DNC_SCL

WR_RNW

RD_E

VIH

VIL

AHT

t

CSF

t

CSF

V

tCS t

V

IH

V

IL

t

AST

t

VIH

V

IL

WRL

t

RC/ tRCFM

t

RDH/ tRDHFM

t

DST

t

AHT

t

RCS/ tRCSFM

t

V

IH

t

DHT

CSH

WC

t

RDL/tRDLFM

V

IL

t

RAT/tTRATFM

t

WRH

t

t

ODH

t

CHW

IH

V

IL

D17~D0

V

IH

V

IL

V

OH

V

OL

VOH
V

OL

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

(VSSA=0V, IOVCC=1.65V to 2.50V, VCI=2.3V to 2.9V, Ta = -30 to 70°C)

SIGNAL SYMBOL PARAMETER MIN. MAX. UNIT DESCRIPTION

DNC_SCL

NCS

NWR_RNW

NRD_E

D17 TO D0

t

AST

t

AHT

t

CHW

t

t

RCSFM

t

CSF

t

CSH

t

WC

t

WRH

t

WRL

t

RCFM

t

RDHFM

t

RDLFM

t

DST

t

DHT

t

RATFM

t

ODH

ADDRESS SETUP TIME
ADDRESS HOLD TIME (WRITE/READ)

CHIP SELECT “H” PULSE WIDTH
CHIP SELECT SETUP TIME (WRITE)

CS

CHIP SELECT SETUP TIME
CHIP SELECT WAIT TIME
(WRITE/READ)
CHIP SELECT HOLD TIME
WRITE CYCLE
CONTROL PULSE “H” DURATION
CONTROL PULSE “L” DURATION

READ CYCLE
CONTROL PULSE “H” DURATION
CONTROL PULSE “L” DURATION

DATA SETUP TIME
DATA HOLD TIME
READ ACCESS TIME
OUTPUT DISABLE TIME

NOTE：THE INPUT SIGNAL RISE TIME AND FALL TIME (TR, TF) IS SPECIFIED AT 15 NS OR LESS.

LOGIC HIGH AND LOW LEVELS ARE SPECIFIED AS 30% AND 70% OF IOVCC FOR INPUT SIGNALS.

VERSION PAGE

2 4

10
10

0

35

355

10
10

100

35
35

450

90

355

15
10

⎯

20

⎯
⎯

⎯
⎯
⎯
⎯
⎯

⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯

340

80

ns

ns

ns

ns

WHEN READ

FROM GRAM

FOR MAXIMUM

ns

CL=30pF

FOR MINIMUM

CL=8pF

NOTE：LOGIC HIGHT AND LOW LEVELS ARE SPECIFIED AS 30% AND 70% OF IOVCC

NOTE：LOGIC HIGH AND LOW LEVELS ARE SPECIFIED AS 30% AND 70% OF IOVCC

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

VERSION PAGE

2 5

4.2.2 PARALLEL INTERFACE CHARACTERISTICS (6800-SERIES MPU)

(VSSA=0V, IOVCC=1.65V to 2.50V, VCI=2.3V to 2.9V,Ta = -30 to 70°C)

SIGNAL SYMBOL PARAMETER MIN. MAX. UNIT DESCRIPTION

DNC_SCL

NCS

NWR_RNW

NRD_E

D17 TO D0

t

AST

t

AHT

t

CHW

t

CS

t

RCSFM

t

CSF

t

CSH

t

WC

t

WRH

t

WRL

t

RCFM

t

RDHFM

t

RDLFM

T

dst

t

DHT

t

RAT

t

RATFM

t

ODH

ADDRESS SETUP TIME
ADDRESS HOLD TIME (WRITE/READ)

CHIP SELECT “H” PULSE WIDTH
CHIP SELECT SETUP TIME (WRITE)
CHIP SELECT SETUP TIME
CHIP SELECT WAIT TIME (WRITE/READ)
CHIP SELECT HOLD TIME

WRITE CYCLE
CONTROL PULSE “H” DURATION
CONTROL PULSE “L” DURATION

READ CYCLE
CONTROL PULSE “H” DURATION
CONTROL PULSE “L” DURATION

DATA SETUP TIME
DATA HOLD TIME
READ ACCESS TIME (ID)
READ ACCESS TIME (FM)
OUTPUT DISABLE TIME

10
10

0

35

355

10
10

100

35
35

450

90

355

10
10

⎯
⎯

20

⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯

40

340

80

ns

ns

ns

ns

WHEN READ

FROM GRAM

FOR MAXIMUM

ns

CL=30pF

FOR MINIMUM

CL=8pF

NOTE：THE INPUT SIGNAL RISE TIME AND FALL TIME (TR, TF) IS SPECIFIED AT 15 NS OR LESS.
LOGIC HIGH AND LOW LEVELS ARE SPECIFIED AS 30% AND 70% OF IOVCC FOR INPUT SIGNALS.

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO

E T 0 2 8 0 0 2 D M U

.

4.2.3 SERIAL INTERFACE CHRARCTERISTICS

VERSION PAGE

2 6

SERIAL CLOCK CYCLE (WRITE)
DNC_SCL ”H” PULSE WIDTH (WRITE)
DNC_SCL ”L” PULSE WIDTH (WRITE)

DATA SETUP TIME (WRITE)
DATA HOLD TIME (WRITE)

SERIAL CLOCK CYCLE (READ)
DNC_SCL ”H” PULSE WIDTH (READ)
DNC_SCL ”L” PULSE WIDTH (READ)

ACCESS TIME t

OUTPUT DISABLE TIME tOH
DNC_SCL TO CHIP SELECT t

NCS “H” PULSE WIDTH t
CHIP SELECT SETUP TIME

CHIP SELECT HOLD TIME

NOTE：THE INPUT SIGNAL RISE TIME AND FALL TIME (TR, TF) IS SPECIFIED AT 15 NS OR LESS.
LOGIC HIGH AND LOW LEVELS ARE SPECIFIED AS 30% AND 70% OF IOVCC FOR INPUT SIGNALS.

PARAMETER SYMBOL CONDITION MIN. TYP. MAX. UNIT

⎯

t

SCYCW

DNC_SCL

t

SHW

t

SLW

t

SDS

t

SDH

t

SCYCR

t
t

ACC

CHW

t

t

SDI

DNC_SCL

SHR
SLR

SDO FOR MAXIMUM CL=30pF
FOR MINIMUM CL=8pF
SDO FOR MAXIMUM CL=30pF
FOR MINIMUM CL=8pF

DNC_SCL, NCS 15

SCC

NCS 45

CSS

NCS

CSH

100

35
35

30
30

150

60
60

45

15

60
65

⎯

⎯

⎯

⎯

⎯
⎯ ⎯ ⎯

⎯

⎯

⎯

⎯

⎯

⎯

⎯

100 ns

⎯

100 ns

⎯
⎯ ⎯

⎯

⎯

⎯ ⎯ ⎯

⎯

ns

ns

ns

ns
ns

ns

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

MODEL NO.

E T 0 2 8 0 0 2 D M U

VERSION PAGE

2 7

4.2.4 RGB INTERFACE CHARACTERISTICS

SYMBOL

DOTCLK CYCLE TIME

t

DCYC

(2) 16.6MHz
(3) 4.4MHz

t

DLW

t

CHW

t

DDS

t

DDH

t

DCSS

t

DCSH

SYNC SETUP TIME

t

DSYN

NOTE：(1) THE INPUT SIGNAL RISE TIME AND FALL TIME (tr, tf) IS SPECIFIED AT 15 NS OR LESS.

PARAMETER CONDITIONS RELATED PINS

VRR =

Min. 50 Hz

Max. 65 Hz

DOTCLK LOW TIME
DOTCLK HIGH TIME

RGB DATA SETUP TIME
RGB DATA HOLD TIME

ENABLE SETUP TIME
ENABLE HOLD TIME

ENABLE

DOTCLK

DOTCLK,

D17-D0

DOTCLK,

HSYNC,

VSYNC

MIN.

60

(NOTE2)

15
15

15
15

15
15

15

TYP.

⎯

(NOTE3)

⎯
⎯

⎯
⎯ ⎯

⎯ ⎯

MAX.

226

⎯
⎯
⎯
⎯

UNIT

ns

ns

ns

ns

ns

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

4.2.5 RESET INPUT TIMING

MODEL NO

.

E T 0 2 8 0 0 2 D M U

VERSION PAGE

2 8

SYMBOL PARAMETER RELATED PINS MIN. TYP.

t

RESET LOW PULSE WIDTH

RESW

t

RESET COMPLETE TIME

REST

t

PRES

NOTE：(1) SPIKE DUE TO AN ELECTROSTATIC DISCHARGE ON NRESET LINE DOES NOT CAUSE

NOTE：(2) DURING THE RESETTING PERIOD, THE DISPLAY WILL BE BLANKED (THE DISPLAY IS
ENTERING BLANKING SEQUENCE, WHICH MAXIMUM TIME IS 120 MS, WHEN RESET

STARTS

IN STB OUT –MODE. THE DISPLAY REMAINS THE BLANK STATE IN STB –MODE) AND THEN

RETURN TO DEFAULT CONDITION FOR H/W RESET.
(3) DURING RESET COMPLETE TIME, ID2 AND VCOMOF VALUE IN OTP WILL BE LATCHED TO
INTERNAL REGISTER DURING THIS PERIOD. THIS LOADING IS DONE EVERY TIME WHEN

(4) SPIKE REJECTION ALSO APPLIES DURING A VALID RESET PULSE AS SHOWN BELOW：

RESET GOES HIGH LEVEL
AFTER POWER ON TIME

IRREGULAR SYSTEM RESET ACCORDING TO THE TABLE BELOW.

NRESET PULSE ACTION

SHORTER THAN 5µs

LONGER THAN 10µs

BETWEEN 5µs AND 10µs

THERE IS H/W RESET COMPLETE TIME (TREST) WITHIN 5MS AFTER A RISING EDGE OF
NRESET.

(1)

NRESET 10

(2)

⎯

⎯

NRESET &

IOVCC

⎯ ⎯

⎯ ⎯

1

RESET REJECTED

RESET START

MAX

.

⎯ ⎯

5

120

⎯ ⎯

RESET

NOTE

WHEN RESET APPLIED
DURING STB MODE
WHEN RESET APPLIED
DURING STB MODE

RESET GOES HIGH LEVEL
AFTER POWER ON

UNI

T

µ

ms
ms

ms

s

(5) IT IS NECESSARY TO WAIT 5MSEC AFTER RELEASING! RES BEFORE SENDING COMMANDS.

ALSO STB OUT COMMAND CANNOT BE SENT FOR 120MSEC.

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

5 . OPTICAL CHARACTERISTICS NOTE (2)

MODEL NO

E T 0 2 8 0 0 2 D M U

.

VERSION PAGE

2 9

5 . 1 OPTICAL CHARACTERISTICS

VIEWING
ANGLE

CONTRAST RATIO CR 400 500
t r ( rise )

RESPONSE TIME

THE BRIGHTNESS

OF MODULE

Wx 0.260 0.310 0.360

Rx 0.605 0.655 0.705

COLOR OF
CIE

Gx 0.262 0.312 0.362

COORDINATE

Bx 0.084 0.134 0.184

THE BRIGHTNESS OF

UNIFORMITY

CURRENT FOR

LED BACKLIGHT

NOTE (1)：

A

I T E M SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK

HOR.

VER.

WHITE

RED

GREEN

BLUE

x+

θ

x-

θ

y+

θ

y-

θ

t f ( fall )

B 300 350

Wy 0.291 0.341 0.391

Ry 0.279 0.329 0.379

Gy 0.525 0.575 0.625

By

⎯

V

F

CENTER

CR≥10

NTSC：60%

VIEWING

NORMAL AUNLE

I

F

θ

θ

x = 0°

θ

y = 0

θ

°

⎯

= 80mA

y=0

x=0

70 75

°

65 70
70 75

°

50 55

10 20

⎯

15 30

⎯

0.085 0.135 0.185
75 80

3.3

⎯

⎯
⎯
⎯
⎯
⎯

⎯

⎯

⎯

deg . (3)

cd/m

Ta = 2 5 °C

(4)

ms (5)

2

(6)

⎯

⎯

⎯

⎯

%

V NOTE (1)

(7)

⎯

K1
K2
K3
K4

NOTE (2) : TEST EQUIPMENT SETUP :
AFTER STABILIZING AND LEAVING THE PANEL ALONE AT A GIVEN TEMPERATURE FOR
30 MINUTES , THE MEASUREMENT SHOULD BE EXECUTED. MEASUREMENT SHOULD BE
EXECUTED IN A STABLE , WINDLESS , AND DARK ROOM. OPTICAL SPECIFICATIONS ARE
MEASURED BY TOPCON BM-7 (FAST) WITH A VIEWING ANGLE OF 2° AT A DISTANCE OF
50cm AND NORMAL DIRECTION.

02101300-01-02

E M E R G I N G D I S P L A Y

TECHNOLOGIES CORPORATION

NOTE (3) : DEFINITION OF VIEWING ANGLE :

NOTE (4) : DEFINITION OF CONTRAST RATIO :

NOTE (5) : DEFINITION OF RESPONSE TIME : TR AND TF

THE FIGURE BVELOW IS THE OUTPUT SIGNAL OF THE PHOTO DETECTOR.

(T%)

)CR(TIOCONTRASTRA =

MODEL NO

E T 0 2 8 0 0 2 D M U

.

VERSION PAGE

2 10

"STATEWHITE"ATISLCDWHENMEASUREDBRIGHTNESS
"STATEBLACK"ATISLCDWHENMEASUREDBRIGHTNESS

White

NOTE (6) :

NOTE (7) : THE 100% TRANSMISSION IS DEFINED AS THE TRANSMISSION OF LCD PANEL WHEN ALL
THE INPUT TERMINALS OF MODULE ARE ELECTRICALLY OPENED.

Black

"STATEWHITE"ATISLCDWHENMEASUREDBRIGHTNESS

White

5.2 THE TEST METHOD OF BRIGHTNESS AND UNIFORMITY

UNIT：mm

5.3 THE CALCULATING METHOD OF UNIFORMITY

⎡

−

1: UNIFORMITY ×

⎢
⎣

BRIGHTESS AVERAGE

BRIGHTESS MINIMUN - BRIGHTESS MAXIMUN

⎤
⎥

⎦

%100

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6 . OUTLINE DIMENSIONS

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UNIT : mm
SCALE : NTS

OT SPECIFIED TOLERANCE IS ± 0.3

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7 . BLOCK DIMENSION

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8 . DETAIL DRAWING OF DOT MATRIX

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43.2

0.18

0.06

R

G

B

0.18

R

G

B

57.6

240(RGB)*320 DOTS

UNIT : mm
SCALE : NTS

OT SPECIFIED TOLERANCE IS ± 0.1

DOTS MATRIX TOLERANCE IS ± 0.01

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9 . INTERFACE SIGNALS

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9.1 LCD MODULE CONNECTOR

PIN NO SYMBOL REMARK FUNCTION

MAKER’S IDENTIFICATION (MAY ESTABLISH “H”, ”L” OR ”NC”)
IF THE CUSTOMER HAS MORE THAN TWO MAKERS WHO APPLIED
DIFFERENT S/W, CAN USE THIS PIN TO DETECT THE CODE BY THE MPU

1 ID O

2 VSSD I DIGITAL GROUND
3 IOVCC I DIGITAL IO PAD POWER SUPPLY
4 VSSA I ANALOG GROUND
5 VCI I ANALOG POWER SUPPLY

6 VSYNC I

7 HSYNC I

8 ENABLE I

9 DOTCLK I

10 DNC_SCL I

11 NRESET I

12 SDI I

13

14 NRD_E I

15 NCS I

16 TE O TEARING EFFECT OUTPUT, IF NOT USED, PLEASE OPEN THIS PIN.

NWR_RNW

AND DECIDE THE MAKER’S ID.
MOST IMPORTANTLY, THE CUSTOMER MUST DESIGN THIS PIN ON THE
MAIN BOARD AS WELL AND LEAVE IT OPEN AS NOT USED.
NOTE : EDT MODULE’S SETTING IS“H”.

FRAME SYNCHRONIZING SIGNAL. HAS TO BE FIXED TO IOVCC LEVEL
IF IS NOT USED.
FRAME SYNCHRONIZING SIGNAL. HAS TO BE FIXED TO IOVCC LEVEL
IF IS NOT USED.
A DATA ENABLE SIGNAL IN RGB I/F MODE. HAS TO BE FIXED TO VSSD
LEVEL IF UNUSED (HIGH ACTIVE, IF EPL=0).
DOT CLOCK SIGNAL. HAS TO BE FIXED TO VSSD LEVEL IF IS NOT
USED.
THE SIGNAL FOR COMMAND OR PARAMETER SELECT UNDER
PARALLEL MODE (I.E.NOT SERIAL INTERFACE):
LOW : COMMAND.
HIGH : PARAMETER.
WHEN UNDER SERIAL INTERFACE, IT SERVERS AS SCL.
RESET PIN. SETTING EITHER PIN LOW INITIALIZES THE LSI. MUST BE
RESET AFTER POWER IS SUPPLIED.
SERIAL DATA PIN.
WHEN IFSEL0=0, IT IS SERIAL DATA INPUT/OUTPUT PIN (SDA).
WHEN IFSEL0=1, IT IS SERIAL DATA INPUT PIN.
IF NOT USED, PLEASE LET IT CONNECTED TO IOVCC OR VSSD.
I80 SYSTEM: SERVES AS A WRITE SIGNAL AND WRITES DATA AT THE
RISING EDGE.

I

M68 SYSTEM: 0: WRITE, 1: READ.
FIX IT TO IOVCC OR VSSD LEVEL WHEN USING SERIAL BUSS
INTERFACE.
I80 SYSTEM: SERVES AS A READ SIGNAL AND READ DATA AT THE
LOW LEVEL.
M68 SYSTEM: 0: READ/WRITE DISABLE, 1: READ/WRITE ENABLE.
FIX IT TO IOVCC OR VSSD LEVEL WHEN USING SERIAL BUSS
INTERFACE.
CHIP SELECT SIGNAL.
LOW : CHIP CAN BE ACCESSED;
HIGH : CHIP CANNOT BE ACCESSED. MUST BE CONNECTED TO VSSD IF
NOT IN USE.

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MODEL NO

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PIN NO SYMBOL REMARK FUNCTION
17 D0
18 D1
19 D2
20 D3
21 D4
22 D5

23 D6 I/O
24 D7 I/O
25 D8 I/O
26 D9 I/O
27 D10 I/O
28 D11 I/O
29 D12 I/O
30 D13 I/O

I/O
I/O
I/O
I/O
I/O
I/O

1. 18-BIT BI-DIRECTIONAL DATA BUS FOR SYSTEM INTERFACE.
8-BIT BUS: USE D7-D0 AND D17-D8 UNUSED.
16-BIT BUS: USE D15-D0 AND D17-D16 UNUSED.
18-BIT BUS: USE D17-D0

2. 18-BIT DATA BUS FOR RGB INTERFACE
16-BIT BUS: USE D15-D0 AND D17-D16 UNUSED.
18-BIT BUS: USE D17-D0

CONNECTED UNUSED PINS TO THE VSSD LEVEL.
NOTICE: WHEN REGISTER RGB_EN=1 AND PIN ENABLE=1,
D[17:0] IS USED AS STREAM IMAGE DATA FOR DISPLAY.
IT MEANS MPU DATA
BUS AND RGB DATA BUS IS SHARED.

31 D14 I/O
32 D15 I/O
33 D16 I/O
34 D17 I/O
35 SDO O SERIAL DATA OUTPUT. IF NOT USE, LET IT TO OPEN.
36 NC NC NO USE, LET IT OPEN
37 NC NC NO USE, LET IT OPEN
38 NC NC NO USE, LET IT OPEN
39 NC NC NO USE, LET IT OPEN
40 NC NC NO USE, LET IT OPEN
41 NC NC NO USE, LET IT OPEN

42 P68 I

43 BS2 I

44 BS1 I

45 BS0 I

P68 BS2 BS1 BS0

0 0 0 0

0 0 0 1

0 0 1 0

0 0 1 1

0 1 0 0

0 1 0 1

1 0 0 0

1 0 0 1

1 0 1 0

1 0 1 1

1 1 0 0

1 1 0 1

× 1 1 0 SERIAL BUS IF DNC_SCL, SDO,SDI

16-BIT BUS INTERFACE, 80-SYSTEM,
65K-COLOR

16-BIT BUS INTERFACE, 80-SYSTEM,
262K-COLOR
18-BIT BUS INTERFACE, 80-SYSTEM,
262K-COLOR
8-BIT BUS INTERFACE, 80-SYSTEM,
262K-COLOR
16-BIT BUS INTERFACE, 80-SYSTEM,
262K-COLOR
18-BIT BUS INTERFACE, 80-SYSTEM,
262K-COLOR
16-BIT BUS INTERFACE, 68-SYSTEM,
65K-COLOR
16-BIT BUS INTERFACE, 68-SYSTEM,
262K-COLOR
18-BIT BUS INTERFACE, 68-SYSTEM,
262K-COLOR
8-BIT BUS INTERFACE, 68-SYSTEM,
262K-COLOR
16-BIT BUS INTERFACE, 68-SYSTEM,
262K-COLOR
18-BIT BUS INTERFACE, 68-SYSTEM,
262K-COLOR

D17-D16 : UNUSED,
D15-D0：DATA
D17-D16: UNUSED,
D15-D0: DATA

D17-D0: DATA
D17-D8: UNUSED

D7-D0: DATA
D17-D8: UNUSED
D7-D0: DATA

D17-D0: DATA
D17-D16: UNUSED,

D15-D0: DATA
D17-D16: UNUSED,
D15-D0: DATA

D17-D0: DATA
D17-D8:UNUSED

D7-D0: DATA
D17-D8: UNUSED
D7-D0: DATA

D17-D0: DATA

46 VLED(K4) I POWER SUPPLY FOR LED(-)
47 VLED(K3) I POWER SUPPLY FOR LED(-)
48 VLED(K2) I POWER SUPPLY FOR LED(-)
49 VLED(K1) I POWER SUPPLY FOR LED(-)
50 VLED(A) I POWER SUPPLY FOR LED(+)

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1 0 . POWER SUPPLY

1 0 .1 POWER SUPPLY FOR LCM

VDD

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VDDI

GND

VLED(A)

VLED(K1)
VLED(K2)

VLED(K3)
VLED(K4)

LCD MODULE

2.3~3.3V

1.65 ~3.3V

IF=80mA

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1 1 . SPECIFICATION OF AUDACITY ASSURANCE

11.1 APPLICATION

This inspection standard is to be applied to the LCD module delivered from
EMERGING DISPLAY TECHNOLOGIES CORP.( E.D.T ) to customers

11.2 INSPECTION CONDITIONS

11.2.1 Environmental conditions
Room temperature : 25°C ± 5°C
Humidity : 50 ± 10% RH

11.2.2 DISPLAY-ON inspection, visual appearance inspection on screen

The distance between the module and the inspector’s eyes shall be at least

30cm under illumination of one fluorescent lamp of 20W.

11.2.3 Inspection lot

Quantity per delivery lot for each model

11.2.4 Inspection method

A sampling inspection shall be made according to the following provisions to

judge the acceptability
(a)Applicable standard : MIL-STD-105E
Normal inspection, single sampling
Level Ⅱ

(b)AQL : Major defect : AQL 0.65
Minor defect : AQL 2.5

TOTAL DEFECTS : AQL 2.5

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11.3 INSPECTION STANDARDS

11.3.1 VISUAL DEFECTS CLASSIFICATION

TYPE OF DEFECT INSPECTION ITEM DEFECT FEATURE AQL

• DEFECT TO MISS SPECIFIED
DISPLAY FUNCTION, FOR ALL

1.DISPLAY ON

AND SPECIFIED DOTS
EX : DISCONNECTION , SHORT
CIRCUIT ETC

MAJOR DEFECT

2.BACKLIGHT

• NO LIGHT

• FLICKERING AND OTHER

0.65

ABNORMAL ILLUMINATION

3.DIMENSIONS

• SUBJECT TO INDIVIDUAL
ACCEPTANCE SPECIFICATIONS

• BLACK/WHITE SPOT

• BUBBLES ON POLARIZER

1.DISPLAY ZONE

• BLACK/WHITE LINE

• SCRATCH

• CONTAMINATION

• LEVER COLOR SPREED

2.BEZEL ZONE

• STAINS

• SCRATCHES

• FOREIGN MATTER

MINOR DEFECT

3.PCB

• CRACKS

• SCRATCHES

2.5

• STAINS

• INSUFFICIENT SOLDER

• SOLDERED IN INCORRECT

4.SOLDERING

POSITION

• CONVEX SOLDERING SPOT

• SOLDER BALLS

• SOLDER SCRAPS

5.DISPLAY ON

• LIGHT LINE

(ALL ON)

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11.3.2 INSPECATION CRITERION

NO. ITEM CRITERIA

DISPLAY ON

1.
INSPECTION

(1)INCORRECT PATTERN
(2)MISSING SEGMENT
(3)DIM SEGMENT
(4)OPERATING VOLTAGE BEYOND SPEC

OVERALL

2.
DIMENSIONS

(1)OVERALL DIMENSION BEYOND SPEC
(1)INSPECTION PATTERN : FULL WHITE,FULL

BLACK, RED, GREEN AND BLUE SCREENS.
(2)

BLACK SPOT Ⅰ

3.

WHITE SPOT Ⅰ
ON-DISPLAY

DOT

DEFECT

BRIGHT DOT
DARK DOT
TOTAL DOT
MINIMUM DISTANCE

BETWEEN BRIGHT DOTS
MINIMUM DISTANCE
BETWEEN BRIGHT DOTS AND
DARK DOTS
MINIMUM DISTANCE
BETWEEN DARK DOTS

N≤3
N≤3
N≤3

L≥5mm

L≥5mm

L≥5mm

NOTE : THE DEFINITION OF DOT DEFECT:THE DOT

DEFECT WAS JUDGED AFTER REPAIR AND THE SIZE
OF A DEFECTIVE DOT OVER 1/2 OF WHOLE DOT IS
REGARDED AS ONE DEFECTIVE DOT.

(1)THE FOLLOWING BLACK LINE, WHITE LINE ARE

WITHIN THE VIEWING AREA.

LENGTH : L WIDTH : W PERMISSIBLE NO.

4.

WHITE LINE
ON-DISPLAY

3 < L

BLACK LINE

WIDTH : Wmm , LENGH : Lmm

L ≤ 0.5 W ≤ 0.1

0.5 < L ≤ 3 0.1 < W ≤ 0.5

0.5 ≤ W

IGNORE

2

NONE

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NO. ITEM CRITERIA

BUBBLE
ON THE
POLARIZER

SURFACE STATNS

LINE SHAPE
L:LENGTH(mm)

DOT SHAPE
D:AVERAGE
DIAMETER(mm)

BUBBLES OF
POLARIZER

5.

/SURFACE STAINS
/DIRT/CF FAIL
/SPOT

CF FAIL / SPOT

NOTE : (1)POLARIZER BUBBLE IS DEFINED AS THE BUBBLE

APPEARS ON ACTIVE DISPLAY AREA. THE DEFECT OF
POLARIZER BUBBLE SHALL BE IGNORED IF THE
POLARIZER BUBBLE APPEARS ON THE OUTSIDE OF
ACTIVE DISPLAY AREA.

(2)THE EXTRANEOUS SUBSTANCE IS DEFINED AS IT CAN

BE OBSERVED WHEN THE MODULE IS POWER ON.

(3)THE DEFINITION OF AVERAGE DIAMETER, D IS DEFINED

AS FOLLOWING.

AVERAGE DIAMETER(D)=(X+Y)/2 , WHERE

L ≤ 0.5, W ≤ 0.1

0.25 < D ≤ 0.5 N ≤ 0.5

0.1 < D ≤ 0.3mm N ≤ 2

0.1 < D ≤ 0.3mm N ≤ 2

X

0.5 < L ≤ 3

0.1< W ≤ 0.5

D ≤ 0.25

0.5 < D

D < 0.1 mm

D < 0.1 mm

NOTE

LGNORE

N ≤ 1

LGNORE

IGNORE

IGNORE

Y

SCRATCHES AND

6.

DENT ON GLASS
POLARIZER
UNEVEN COLOR

7.

SPREAD,
COLORATION

BEZEL

8.
APPEARANCE

(1) PLS REFER TO THE ABOVE NO.3 AND 4 TO
DETERMINE SCRATCHES AND DENT ON POLARIZER
OR GLASS

(1)TO BE DETERMINED BASED UPON THE STANDARD
SAMPLE.

(1)BEZEL MAY NOT HAVE RUST, BE DEFORMED OR HAVE

FINGER PRINTS STAINS OF OTHER CONTAMINATION.

(2)BEZEL MUST COMPLY WITH JOB SPECIFICATIONS.

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NO. ITEM CRITERIA

(1)NO SOLDERING FOUND ON THE SPECIFIED PLACE
(2)INSUFFICENT SOLDER
(a)LSI, IC
A POOR WETTING OF SOLDER IS BETWEEN LOWER
BEND OR “HEEL” OF LEAD AND PAD

SOLDER FILLET

(b)CHIP COMPONENT
．SOLDER IS LESS THAN 50% OF SIDES AND FRONT

FACE WETTING

SOLDER FILLET

9. SOLDERING

1/2

• SOLDER WETS 3 SIDES OF TERMINAL, BUT LESS
THAN 25% OF SIDES AND FRONT SURFACE AREA ARE
COVERED

SOLDER

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NO. ITEM CRITERIA

(3)PARTS ALIGMENT

(a)LSI, IC
LEAD WIDTH IS MORE THAN 50% BEYOND PAD
OUTLINE

9. SOLDERING

(b)CHIP COMPONENT
COMPONENT IS OFF CENTER, AND MORE THAN
50% OF THE LEADS IS OFF THE PAD OUTLINE

10. BACKLIGHT

(4)NO UNMELTED SOLDER PASTE MAY BE PRESENT

ON THE PCB.
(5)NO COLD SOLDER JOINTS, MISSING SOLDER
CONNECTIONS, OXIDATION OR ICICLE.
(6)NO RESIDUE OR SOLDER BALLS ON PCB.
(7)NO SHORT CIRCUITS IN COMPONENTS ON PCB.
(1)NO LIGHT
(2)FLICKERING AND OTHER ABNORMAL ILLUMINATION
(3)SPOTS OR SCRATCHES THAT APPEAR WHEN LIT
MUST BE JUDGED USING LCD SPOT, LINES AND

CONTAMINATION STANDARDS.
(4)BACKLIGHT DOESN’T LIGHT OR COLOR IS WRONG.

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NO. ITEM CRITERIA

11. PCB , COB

GENERAL

12.
APPEARANCE

(1)COB SEAL MAY NOT HAVE PINHOLES LARGER THAN

0.2mm OR CONTAMINATION.
(2)COB SEAL SURFACE MAY NOT HAVE PINHOLES
THROUGH TO THE IC.
(3)THE HEIGHT OF THE COB SHOULD NOT EXCEED THE
HEIGHT INDICATED IN THE ASSEMBLY DIAGRAM.
(4)THERE MAY NOT BE MORE THAN 2mm OF SEALANT
OUTSIDE THE SEAL AREA ON THE PCB, AND THERE

SHOULD BE NO MORE THAN THREE PLACES.
(5)NO OXIDATION OR CONTAMINATION PCB TERMINALS
(6)PARTS ON PCB MUST BE THE SAME AS ON THE
PRODUCTION CHARACTERISTIC CHART.
THERE SHOULD BE NO WRONG PARTS, MISSING

PARTS OR EXCESS PARTS.
(7)THE JUMPER ON THE PCB SHOULD CONFORM TO THE
PRODUCT CHARACTERISTIC CHART.
(8)IF SOLDER GETS ON BEZEL TAB PADS, LED PAD,
ZEBRA PAD OR SCREW HOLD PAD, MAKE SURE IT IS
SMOOTHED DOWN.
(1)NO OXIDATION, CONTAMINATION, CURVES OR, BENDS
ON INTERFACE PIN (OLB) OF TCP.
(2)NO CRACKS ON INTERFACE PIN (OLB) OF TCP.
(3)NO CONTAMINATION, SOLDER RESIDUE OR SOLDER
BALLS ON PRODUCT.
(4)THE IC ON THE TCP MAY NOT BE DAMAGED, CIRCUITS.
(5)THE UPPERMOST EDGE OF THE PROTECTIVE STRIP ON
THE INTERFACE PIN MUST BE PRESENT OR LOOK AS
IF IT CAUSE THE INTERFACE PIN TO SEVER.
(6)THE RESIDUAL ROSIN OR TIN OIL OF SOLDERING
(COMPONENT OR CHIP COMPONENT) IS NOT BURNED
INTO BROWN OR BLACK COLOR.
(7)SEALANT ON TOP OF THE ITO CIRCUIT HAS NOT
HARDENED.
(8)PIN TYPE MUST MATCH TYPE IN SPECIFICATION

SHEET.
(9)LCD PIN LOOSE OR MISSING PINS.
(10)PRODUCT PACKAGING MUST THE SAME AS
SPECIFIED ON PACKAGING SPECIFICATION SHEET.
(11)PRODUCT DIMENSION AND STRUCTURE MUST
CONFORM TO PRODUCT SPECIFICATION SHEET.
(12)THE APPEARANCE OF HEAT SEAL SHOULD NOT
ADMIT ANY DIRT AND BREAK.

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NO. ITEM CRITERIA
THE LCD WITH EXTENSIVE CRACK IS NOT ACCEPTABLE
a b c

*W=EFFECTIVE SEAL WIDTH

General glass chip :

a

c

≤ t/2 < VIEWING AREA ≤ 1/8X

t/2 > , ≤ 2t ≤ W/3 ≤ 1/8X

X = LCD SIDE LENGTH
t = GLASS THICKNESS

w

c

a

c

a

a b c

13. CRACKED GLASS

Corner part :

c

b

≤ t/2 < VIEWING AREA ≤ 1/8X

> t/2 , ≤ 2t ≤ W/3 ≤ 1/8X

a

*W=EFFECTIVE SEAL WIDTH
X=LCD SIDE LENGTH
Y=GLASS THICKNESS

CHIP ON ELECTRODE PAD

a

c

a b c

≤ t ≤ 0.5mm ≤ 1/8X
* X=LCD SIDE WIDTH
t =GLASS THICKNESS

a b c

≤ t ≤ 1/8X ≤ L

*X=LCD SIDE WIDTH
t = GLASS THICKNESS
L=ELECTRODE PAD LENGTH

c

a

cIF GLASS CHIPPING THE ITO

TERMINAL, OVER 2/3 OF THE ITO
MUST REMAIN AND BE ,

INSPECTED ACCORDING TO

ELECTRODE TERMINAL
SPECIFICATIONS

dIF THE PRODUCT WILL BE HEAT

SEALED BY THE CUSTOMER, THE
ALIGNMENT MARK MUST NOT BE
DEMAGED

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11.4 RELIABILITY TEST

11.4.1 STANDARD SPECIFICATIONS FOR RELIABILITY OF LCD MODULE

NO ITEM DESCRIPTION

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High temperature

1

2

3

4

5

6

7

8

operation

Low temperature

operation

High temperature

storage

Low temperature

storage

High temperature /

humidity test

High temperature /

high humidity

storage

Thermal shock

( not operated )

ESD

( Electrostatic

Discharge )

The sample should be allowed to stand at +70°C for 240 hrs

The sample should be allowed to stand at -20°C for 240 hrs

The sample should be allowed to stand at +80°c for 240 hrs

The sample should be allowed to stand at -30°C for 240 hrs

The sample should be allowed to stand at 50°C, 90% RH
240 hrs

The sample should be allowed to stand at 60°C, 90% RH
240 hrs

The sample should be allowed to stand the following 10 cycles
of operation :

-30°c for 30 minutes
+80°c for 30 minutes

AIR DISCHARGE ± 4KV
CONTACT DISCHARGE ± 2KV

9

Drop test

( 1 Box)

6 FACES, 2 CORNERS
HEIGHT : 750mm

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11.4.2 TESTING CONDITIONS AND INSPECTION CRITERIA

For the final test the testing sample must be stored at room temperature for 24 hours, after
the tests listed in table 6.2 , standard specifications for reliability have been executed in
order to ensure stability .

NO ITEM TEST MODEL INSPECTION CRITERIA

1

2 Contrast Refer TO Specification

Current

consumption

Refer To Specification

The current consumption should
conform to the product specification.
After the tests have been executed,
the contrast must be larger than half
of its initial value prior to the tests.

3 Appearance Visual inspection

Defect free

11.4.3 LIFE TIME

Functions, performance, appearance , etc. shall be free from
remarkable deterioration within 50,000 hours under ordinary

LIFE TIME

operating and storage conditions room temperature (25±10°c) ,
normal humidity ( 45±20% RH ) , and in area not exposed to
direct sun light.
( life time of backlight , please refer to data about backlight . )

Note : from our experience the life time of high humidity operation and high temperature
operation as above mentioned could be achieved .

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11.5 OPERATION

11.5.1 Do not connect or disconnect modules to or from the main system while
power is being supplied .

11.5.2 Use the module within specified temperature ; lower temperature causes the
retardation of blinking speed of the display ; higher temperature makes
overall display discolor . When the temperature returns to normality , the
display will operate normally .

11.5.3 Adjust the LC driving voltage to obtain the optimum contrast .

11.5.4 Power On Sequence input signals should not be supplied to LCD module
before power supply voltage is applied and reaches the specified value ( 5
±0.25v ) .
If above sequence is not followed , CMOS LSIs of LCD modules may be
damaged due to latch - up problem .

11.6 NOTICE

11.6.1 Use a grounded soldering iron when soldering connector I/O terminals . For
soldering or repairing , take precaution against the temperature of the soldering
iron and the soldering time to prevent peeling off the through-hole-pad .

11.6.2 Do not disassemble . EDT shall not be held responsible if the module is
disassembled and upon the reassembly the module failed .

11.6.3 Do not charge static electricity , as the circuit of this module
contains CMOS LSIs. A workman's body should always be static-protected by
use of an ESD STRAP . Working clothes for such personnel should be of
static-protected material .

11.6.4 Always ground the electrically-powered driver before using it to install the
LCD module. While cleaning the work station by vacuum cleaner, do not
bring the sucking mouth near the module ; static electricity of the electrically­powered driver or the vacuum cleaner may destroy the module .

11.6.5 Don’t give external shock.

11.6.6 Don’t apply excessive force on the surface.

11.6.7 Liquid in LCD is hazardous substance .Must not lick and swallow.
When the liquid is attach to your,skin,cloth etc.wash it out thoroughly and
immediately.

11.6.8 Don’t operate it above the absolute maximum rating.

11.6.9 Storage in a clean environment, free from dust,active gas,and
solvent.

11.6.10 Store without any physical load.

11.6.11 Rewiring : no more than 3 times .

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