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EMC FC4500 User Manual

EMC Enterprise Storage
EMC Fibre Channel
Disk-Array Processor Enclosure (DPE)
Rackmount FC4500
HARDWARE REFERENCE
P/N 014002901-04
EMC Corporation 171 South Street, Hopkinton, MA 01748-9103
Corporate Headquarters: (508) 435-1000, (800) 424-EMC2 Fax: (508) 435-5374 Service: (800) SVC-4EMC
Copyright © EMC Corporation 2000, 2001. All rights reserved.
Printed February 2001
No part of this publication may be reproduced or distributed in any form or by any means, or stored in a database or retrieval system, without the prior written consent of EMC Corporation.
The information contained in this document is subject to change without notice. EMC Corporation assumes no responsibility for any errors that may appear.
All computer software programs, including but not limited to microcode, described in this document are furnished under a license, and may be used or copied only in accordance with the terms of such license. EMC either owns or has the right to license the computer software programs described in this document. EMC Corporation retains all rights, title and interest in the computer software programs.
EMC Corporation makes no warranties, expressed or implied, by operation of law or otherwise, relating to this document, the products or the computer software programs described herein. EMC CORPORATION DISCLAIMS ALL IMPLIED WARRANTIES OF MERCHANTIBILITY AND FITNESS FOR A PARTICULAR PURPOSE. In no event shall EMC Corporation be liable for (a) incidental, indirect, special, or consequential damages or (b) any damages whatsoever resulting from the loss of use, data or profits, arising out of this document, even if advised of the possibility of such damages.
Trademark Information
EMC2, EMC, MOSAIC:2000, Symmetrix, CLARiiON, and Navisphere are registered trademarks and EMC Enterprise Storage, The Enterprise Storage Company, The EMC Effect, Connectrix, EDM, SDMS, SRDF, Timefinder, PowerPath, InfoMover, FarPoint, EMC Enterprise Storage Network, EMC Enterprise Storage Specialist, EMC Storage Logic, Universal Data Tone, E-Infostructure, Celerra , and Access Logix are trademarks of EMC Corporation.
All other trademarks used herein are the property of their respective owners.
ii
Regulatory Notices
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation. Testing was done with shielded cables. Therefore, in order to comply with the FCC regulations, you must use
shielded cables with your installation. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
This Class A digital apparatus complies with Canadian ICES-003 Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada
Manufacturer’s Declaration of Conformity - CE mark
This equipment has been tested and found to comply with the requirements of European Community Council Directives 89/336/EEC, 73/23/EEC, and 98/68/EEC relating to electromagnetic compatibility and product safety respectively.
This product complies with EN55022, CISPR22 and AS/NZS 3548 Class A.
EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
iii
iv

Contents

Preface..............................................................................................................................xi
Chapter 1 About the Rackmount Disk-Array Processor Enclosure
Introduction.......................................................................................1-2
DPE Components..............................................................................1-4
Enclosure.....................................................................................1-4
Midplane.....................................................................................1-8
Storage Processors (SPs) ...........................................................1-9
Link Control Cards (LCCs)............................................................1-11
Disk Modules ...........................................................................1-12
Disk Drives ...............................................................................1-12
Drive Carrier ............................................................................1-13
Power Supplies ........................................................................1-13
Standby Power Supply (SPS).................................................1-14
Drive Fan Pack .........................................................................1-14
SP Fan Pack...............................................................................1-15
Redundancy in Configurations.....................................................1-17
What Next? ......................................................................................1-18
Chapter 2 Installing a Rackmount DPE
Requirements.....................................................................................2-1
Site Requirements......................................................................2-1
Cabling Requirements...............................................................2-2
Addressing Requirements........................................................2-2
Installing a DPE in a Cabinet ..........................................................2-3
Installing DPEs on the Mounting Rails in the Cabinet ........2-4
DPE Powerup and Initialization...................................................2-16
DPE Powerdown.............................................................................2-16
Binding Disk Modules into Groups .............................................2-18
EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
v
Contents
Chapter 3 Servicing and Upgrading a DPE
Monitoring DPE Status....................................................................3-1
Handling CRUs.................................................................................3-4
Power Issues and CRUs............................................................3-4
Avoiding Electrostatic Discharge (ESD) Damage ........................3-6
Precautions When Removing, Installing, or Storing CRUs........3-7
Precautions When Handling Optical Cables ................................3-8
Replacing or Adding a Disk Module.............................................3-9
Replacing the SP Fan Pack ............................................................3-14
Replacing an Optical GBIC............................................................3-17
Installing an Optical GBIC Connector..................................3-19
Removing an SP or an SP Filler Module .....................................3-21
Installing or Replacing an SP Memory Module.........................3-24
Installing an SP or SP Filler Module ............................................3-26
Installing an SP or SP Filler Module.....................................3-27
Replacing or Adding an LCC Module.........................................3-30
Removing an LCC ...................................................................3-30
Installing an LCC.....................................................................3-32
Replacing the Drive Fan Pack.......................................................3-34
Removing the Drive Fan Pack...............................................3-35
Installing the Drive Fan Pack.................................................3-35
Replacing or Adding a Power-Supply Module..........................3-36
Removing a Power-Supply Filler Module ...........................3-37
Installing a Power-Supply Module.......................................3-41
Appendix A Technical Specifications and Operating Limits
Technical Specifications .................................................................A-1
AC Power Requirements.........................................................A-1
Size and Weight ........................................................................A-2
Drive Type .................................................................................A-3
SP Optical Cabling....................................................................A-3
LCC Copper Cabling................................................................A-3
Standards Certification and Compliance..............................A-3
Operating Limits .............................................................................A-5
Shipping and Storage Requirements ...........................................A-6
Glossary .........................................................................................................................g-1
Index.................................................................................................................................i-1
vi

Figures

1-1 DAE ................................................................................................................ 1-2
1-2 DPE Front View ............................................................................................ 1-5
1-3 DPE Front View with SP Fan Cover and Door Removed ...................... 1-6
1-4 DPE Back View ............................................................................................. 1-7
1-5 DPE Back View with Drive Fan Pack Removed ...................................... 1-7
1-6 Front Door ..................................................................................................... 1-9
1-7 SP Back Panel .............................................................................................. 1-10
1-8 LCC ............................................................................................................... 1-11
1-9 Disk Module ................................................................................................ 1-12
1-10 Power Supply .............................................................................................. 1-13
1-11 SPS ................................................................................................................ 1-14
1-12 Drive Fan Pack ............................................................................................ 1-15
1-13 SP Fan Pack ................................................................................................. 1-16
2-1 Opening the Front Door .............................................................................. 2-5
2-2 Securing the DPE to the Cabinet Front Channel ...................................... 2-6
2-3 Securing the DPE to the Cabinet Back Channel ....................................... 2-7
2-4 Closing and Locking the Front Door ......................................................... 2-8
2-5 SP Fibre Channel Arbitrated Loop Address ID Switches
(Back of SP)................................................................................................... 2-10
2-6 Removing the Drive Fan Pack .................................................................. 2-11
2-7 Plugging the AC Line Cord into the Power Supply and Turning on the
Power Switch ............................................................................................... 2-12
2-8 Installing the Drive Fan Module .............................................................. 2-13
2-9 Attaching Optical Cables to a DPE .......................................................... 2-14
2-10 Cabling a DPE to a DAE ............................................................................ 2-15
3-1 Status Lights Visible from the Front of the DPE ...................................... 3-2
3-2 Unlocking and Opening the Front Door ................................................. 3-10
3-3 Removing a Disk Filler Module ............................................................... 3-11
3-4 Removing a Disk Module .......................................................................... 3-11
3-5 Installing a Disk Module ........................................................................... 3-12
EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
vii
Figures
3-6 Closing and Locking the Front Door ........................................................ 3-13
3-7 Removing the SP Fan Pack Cover ............................................................ 3-14
3-8 Removing the SP Fan Pack ........................................................................ 3-15
3-9 Installing the Replacement SP Fan Pack .................................................. 3-16
3-10 Installing the SP Fan Pack Cover .............................................................. 3-17
3-11 Removing an Optical Cable from an SP .................................................. 3-18
3-12 Removing an Optical GBIC Connector from an SP ............................... 3-19
3-13 Installing an Optical GBIC Connector on an SP ..................................... 3-20
3-14 Installing an Optical Cable on an SP ........................................................ 3-21
3-15 Removing an SP or Filler Module ............................................................. 3-23
3-16 Removing the Memory Module from the SP .......................................... 3-25
3-17 Installing the Memory Module on the SP ................................................ 3-26
3-18 Setting the SP Address ID .......................................................................... 3-28
3-19 Installing an SP or SP Filler Module ......................................................... 3-29
3-20 Removing an LCC Filler Module .............................................................. 3-31
3-21 Removing a Copper Cable from an LCC ................................................. 3-31
3-22 Installing an LCC Module .......................................................................... 3-33
3-23 Reconnecting a Copper Cable to an Expansion LCC ............................. 3-34
3-24 Removing the Drive Fan Pack ................................................................... 3-35
3-25 Installing the Drive Fan Pack .................................................................... 3-36
3-26 Removing the Bottom Filler Module ........................................................ 3-37
3-27 Removing the Top Filler Module .............................................................. 3-38
3-28 Turning off a Supply’s Power and Unplugging the AC Line Cord ..... 3-39
3-29 Removing the Top Power-Supply Module ............................................. 3-40
3-30 Removing the Bottom Power-Supply Module ....................................... 3-41
3-31 Installing the Bottom Power Supply ........................................................ 3-42
3-32 Installing the Top Power Supply .............................................................. 3-43
3-33 Plugging in the AC Line Cord and Turning on Power ......................... 3-44
viii

Tables

3-1 Status Lights Color Codes, Front of DPE .................................................. 3-2
3-2 Status Lights Color Codes, Back of DPE .................................................. 3-3
EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
ix
Tab les
x
How This Manual Is
Organized

Preface

This manual describes how to install the EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Rackmount Model FC4500, and how to replace and add customer-replaceable units (CRUs).
If you will install and service the rackmount DPE, you should read this manual. After reading it, you will be able to install a rackmount DPE, replace any CRUs that may fail, and upgrade a rackmount DPE by adding disk modules and redundant CRUs.
Chapter 1 Introduces the rackmount DPE’s components. Chapter 2 Explains requirements and describes how to
install the rackmount DPE and cable it to the server and to rackmount Disk Array Enclosures (DAEs).
Chapter 3 Describes how to replace CRUs such as disk
modules.
Appendix A Lists the rackmount DPE’s technical
specifications.
Glossary Defines terms used in the Fibre Channel
environment.
Related
Documentation
EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
Other EMC publications include:
• EMC Fibre Channel Disk-Array Enclosure (DAE) Rackmount Hardware
Reference (P/N 014002591).
• DC Standby Power Supply (SPS) Hardware Reference
(P/N 014002887).
xi
Preface
Conventions Used in
This Manual
!
EMC uses the following conventions for notes, cautions, warnings, and danger notices.
A note presents information that is important, but not hazard-related.
CAUTION
A caution contains information essential to avoid damage to the system or equipment. The caution may apply to hardware or software.
WARNING
A warning contains information essential to avoid a hazard that can cause severe personal injury, death, or substantial property damage if you ignore the warning.
DANGER
A danger notice contains information essential to avoid a hazard that will cause severe personal injury, death, or substantial property damage if you ignore the warning.
EMC uses the following type style conventions in this guide:
Boldface Specific filenames or complete paths. Window
names and menu items in text. Emphasis in cautions and warnings.
Italic Introduces new terms or unique word usage in
text. Command line arguments when used in text.
Fixed space
Examples of specific command entries that you would type, displayed text, or program listings. For example:
xii
QUERY [CUU=cuu|VOLSER=volser]
Fixed italic Arguments used in examples of command line
syntax.
1
About the Rackmount
Disk-Array Processor
Enclosure
Topics in this chapter include:
• Introduction ........................................................................................1-2
• DPE Components...............................................................................1-4
• Link Control Cards (LCCs).............................................................1-11
• Redundancy in Configurations......................................................1-17
About the Rackmount Disk-Array Processor Enclosure
1-1
About the Rackmount Disk-Array Processor Enclosure
1

Introduction

The DPE is a highly available, high-performance, high-capacity, disk-array storage system that uses a Fibre Channel Arbitrated Loop (FC-AL) as its interconnect interface. Its modular, scalable design provides additional disk storage as your needs increase.
1-2
Figure 1-1 DAE
Using its interface, with simple FC-AL serial cabling, the FC4500 DPE can support up to 11 DAEs A DAE is a basic enclosure without a storage processor (SP). The FC4500 and 11 DAEs support up to 120 disk modules in a single disk-array file storage system.
About the Rackmount Disk-Array Processor Enclosure
You can place the DAEs in the same cabinet as the DPE, or in one or more separate cabinets. The DPE connects to the external Fibre Channel environment using GBIC connectors on the storage processor. High-availability features are standard.
The EMC Access Logix™ option provides Storage Group functionality for the FC4500 DPE.
1
Introduction
1-3
About the Rackmount Disk-Array Processor Enclosure
1

DPE Components

The DPE components include:
• A sheet-metal enclosure with a midplane, front door, and SP fan pack cover
• One or two SPs
• One or two link control cards (LCCs)
• Up to ten disk modules
• One or two power supplies
• One drive fan pack
• One SP fan pack
Any unoccupied slot (SP, LCC, disk module, or power supply) has a filler module to maintain air flow and compliance with electromagnetic interference (EMI) standards.
The SPs, LCCs, disk modules, power supplies, fan packs, and filler modules are customer-replaceable units (CRUs), which you can add or replace without tools while the DPE is powered up.
1-4
The high-availability features for a DPE include:
• Second SP and LCC
• Second power supply
• Standby power supply (SPS) (See “Related Documentation” on
page xi.)
A second SP (with required second LCC) provides continued access to the DPE and any connected DAEs if the first SP or LCC fails. The second SP can improve performance and connects easily to a second server.
The disk drives are FC-AL compliant and support dual-port FC-AL interconnects through the two LCCs and their cabling.

Enclosure

The enclosure is a sheet-metal housing with a front panel, a midplane, front door, and slots for the SPs, LCCs, disk modules, power supplies, and fan packs.
The following figures show the DPE components. Details on each component follow the figures. If the enclosure provides slots for two
About the Rackmount Disk-Array Processor Enclosure
identical components, the component in slot A is called component-name A. If there is a second component, it is in slot B and is called component-nameB, as follows.
Component Name in Slot A Name in Slot B
SP SP A SP B
LCC LCC A LCC B
Power supply PS A PS B
If you have one power supply, it can be in either slot A or slot B. If you have one SP and one LCC, they can be in either slot A or B, but not mixed.
s
e
l
u
d
o
m
k
s
i
D
1
0
5
4
3
2
9
8
7
6
Front door
1
Figure 1-2 DPE Front View
SP fan pack cover
DPE Components
1-5
About the Rackmount Disk-Array Processor Enclosure
1
Front panel with door removed for clarity
SP fan pack
SP fan pack cover
1-6
Figure 1-3 DPE Front View with SP Fan Cover and Door Removed
About the Rackmount Disk-Array Processor Enclosure
Drive fan pack
1
LCC A with expansion connector (marked EXP)
SP retaining screw (2 per SP)
LCC B with expansion connector (marked EXP)
Figure 1-4 DPE Back View
LCC B
SP B
SP ejector (2 per SP)
SP A
SP B
ac line cord connectors
Power supply PS A
Power supply PS B
LCC A
Location of DPE EMI rating label - Class A
SP A
Figure 1-5 DPE Back View with Drive Fan Pack Removed
DPE Components
1-7
About the Rackmount Disk-Array Processor Enclosure
1
SP A works with LCC A to run SP A’s disk modules; SP B works with LCC B to run SP B’s disk modules.
Front Panel
Enclosure address light (0 for a DPE)

Midplane

Disk module status lights (two per module)
Check
1023 4 5 6 7 8 9
Active
Check
The front panel contains the enclosure address (EA) light, two status lights for each disk module slot, and two DPE status lights. All lights are visible with the front door closed.
The enclosure address light displays the enclosure address setting for the DPE, which is always 0. This address cannot be changed.
The DPE status lights are described in the “Monitoring DPE status” section in Chapter 3.
The midplane distributes power and signals to all the enclosure components. All CRUs except the fan packs plug directly into midplane connectors.
DPE status lights
Power
1-8
Locking latch with key
About the Rackmount Disk-Array Processor Enclosure
1
The front door must be closed for the DPE to be EMI compliant. Opening the door to access the disk modules is a service procedure.
Figure 1-6 Front Door

Storage Processors (SPs)

The front door has a locking latch and an EMI shield. The latch is a push button with a removable locking key that you can use in any DPE or DAE. When the door is open, you can remove or install disk modules.
The SP is the DPE’s intelligent component. It defines the DPE and differentiates the DPE from a DAE. An SP is a printed-circuit board with dual in-line memory modules (DIMMs), a bezel with status lights, and securing latches. The following figure locates the SP ports, the status lights, the location of the DIMMs, and the FC-AL ID rotary switches.
DPE Components
1-9
About the Rackmount Disk-Array Processor Enclosure
1
Connectors for DIMMS
Captive retaining screw (2 per SP)
Release lever (2 per SP)
Port A (with optical GBIC)
Port B (with optical GBIC)
Figure 1-7 SP Back Panel
Speed light
Network/RJ45 connection reserved for future use
Check Light (amber)
FC-AL ID switches (required only for Fibre Channel Arbitrated Loop environment)
Console
Active light (green)
SPS
Link/activity light
As shown in the figure, the SP has 4 connectors for DIMMs that comprise both read and write caches. These DIMMs come in 128-, 256-, or 512-Mbyte capacity. Memory allocation is handled by Navisphere
® Manager or another Navisphere array management
utility.
When the DPE is configured to operate in a fabric environment, only one of the SP ports (A or B) can be used to connect to the external Fibre Channel environment.
The SP has two Fibre Channel ports (A and B) referred to as the SP front end, for connecting to the external Fibre Channel environment. It also has two rotary switches for setting the FC-AL address ID when operating in a Fibre Channel Arbitrated Loop environment.
1-10
The SP connects to disk modules and to its corresponding LCC via an internal FC-AL. SP A connects to LCC A, and SP B to LCC B. The SP-LCC interface is called the SP back end.
The SP also has an Console connector (with a terminal icon), a connector for communication with the standby power supply, marked SPS, and a LAN connection. Each SP has four status lights
visible from the back of the DPE. For a definition of these light colors, see the “Monitoring DPE Status” section in Chapter 3.
If a DPE has one SP, you can install a second one while the DPE is running.When both SPs are installed, you can replace either SP while the DPE is running. You should never attempt to replace any of the SP’s components, except the memory modules and GBICs.

Link Control Cards (LCCs)

A link control card (LCC) is a CRU in an enclosure that connects Fibre Channel signalling to the disk modules. The LCC provides:
• Fibre channel connectivity between the SP, disks, and other enclosures
• Bypass capability for faulted or missing units
• Monitor and control of the enclosure elements
About the Rackmount Disk-Array Processor Enclosure
1
Figure 1-8 LCC
Each LCC independently monitors the environmental status of the entire DPE, using a microcomputer-controlled CRU monitor. The CRU monitor communicates status to the SP server using special protocols. These protocols let the SP poll DPE status and send commands that control the port LCC bypass circuits and the disk-module check lights.
EXP
Latch
Link Control Cards (LCCs)
Expansion FC-AL cable connector
Check light
!
(amber)
Active light (green)
1-11
About the Rackmount Disk-Array Processor Enclosure
1
Each LCC has two status lights visible from the back of the DPE. For definitions of these light colors, see the “Monitoring DPE Status” section in Chapter 3.
A latch on the LCC locks it into place to ensure proper connection to the midplane. You can add or replace an LCC while the DPE is powered up.

Disk Modules

Disk Drives

Each disk module (see figure below) consists of a Fibre Channel disk drive in a carrier assembly. You can add or remove a disk module while the DPE is powered up.
Disk drive
Figure 1-9 Disk Module
The disk drives are 3.5-inch FC-AL drives that conform to the following standards:
Carrier
Shock mount (4)
Latch
Handle
ESD clip (2)
1-12
• SFF-8067
• Fibre Channel Arbitrated Loop (FC-AL)
• FC-AL Private Loop Direct Attach (PLDA) profile
The disk module slots in the enclosure accommodate drives with heights of either 2.54 cm (1.0 inch) or 4.06 cm (1.6 inches). You can combine drives of either height, and from different manufacturers,
About the Rackmount Disk-Array Processor Enclosure
within the same DPE, subject to the restrictions imposed by the Core Software running in the DPE’s SPs.
1

Drive Carrier

Power Supplies

The disk-drive carrier is a plastic assembly that slides into the enclosure slot guides and midplane connectors. It has a handle with a latch and electrostatic discharge (ESD) clips, which connect to the drive’s head-disk assembly. The latch holds the disk module in place to ensure proper connection with the midplane.
The power supplies (see figure below) are located behind the drive fan pack. With two power supplies, the top supply is installed inverted with respect to the bottom supply.
On/Off switch and circuit breaker
Ac line cord connector
Latch
Active light (green)
Check light
!
(amber)
Figure 1-10 Power Supply
Each power supply is an auto-ranging, power-factor-corrected, multi-output, off-line converter with its own line cord and on/off switch. Each supply supports a fully configured DPE and shares load currents with the other supply, if it is present. The drive and LCC voltage lines have individual soft-start switches that protect the disk drives and LCCs if you install them while the DPE is powered up. A CRU with power-related faults will not adversely affect the operation of any other CRU.
Cooling Check light (amber)
Link Control Cards (LCCs)
1-13
About the Rackmount Disk-Array Processor Enclosure
1
Each power supply has status lights. These status lights are partially visible through the drive fan pack, and fully visible with the drive fan pack removed. The status lights are described in the “Monitoring DPE Status” section of Chapter 3.
A latch on the power supply locks it into place to ensure proper connection to the midplane. You can add or remove one power supply in a highly available DPE while the DPE is powered up.

Standby Power Supply (SPS)

Figure 1-11 SPS

Drive Fan Pack

Disk configurations that use write caching, such as RAID 5, require a standby power supply (SPS) to prevent data loss during a power failure. Data is maintained after a power loss.
One or two SPS units fit beneath the DPE and maintain power until write cache data can be safely stored to the disk. Installing an SPS and cabling it to the DPE are explained in the manual DC Standby Power Supply (SPS) Installation (014002887).
The drive fan pack (see Figure 1-11) cools the disk modules, power supplies, and LCCs in the DPE. A separate pack, described next, cools the SPs. The drive fan pack contains three fans that draw ambient room air through the front door, across the drive modules, and through the midplane and power supplies. The drive fan pack connects directly to both power supplies, and either supply can power it. The fans operate at a lower voltage and speed during normal operation to minimize acoustic noise. If a fan fails, the voltage and speed of the remaining fans increase to compensate, resulting in higher acoustic noise.
1-14
Figure 1-12 Drive Fan Pack
The drive fan pack has one status light. The status light is described in the “Monitoring DPE Status” section of Chapter 3.
Latches on the drive fan pack hold the pack in place.
About the Rackmount Disk-Array Processor Enclosure
Check light
!
(amber)
Latches
Latches
1

SP Fan Pack

You can remove the drive fan pack while the DPE is powered up. While the pack is removed, the cooling check light on each power supply flashes. If the pack is removed for more than approximately two minutes, the disk modules and SPs power down. The disk modules and SPs power up when you reinstall the drive fan pack.
The SP fan pack (see Figure 1-12) cools the SPs. It contains three fans that draw ambient room air through the SP fan pack cover, through the midplane, and across the SPs. The SP fan pack connects to the DPE midplane via an internal cable, and either supply can power it. The fans operate at a lower voltage and speed during normal operation to minimize acoustic noise. If a fan fails, the voltage and speed of the remaining fans increase to compensate, resulting in higher acoustic noise.
Link Control Cards (LCCs)
1-15
About the Rackmount Disk-Array Processor Enclosure
1
Check light
!
(amber)
Latches
Figure 1-13 SP Fan Pack
1-16
Latches on the SP fan pack hold the pack in place. The SP fan pack has one status light visible when the SP fan pack
cover is removed. The status light is described in the “Monitoring DPE Status” section of Chapter 3.
You can remove the SP fan pack while the DPE is powered up. If the pack is removed for more than approximately two minutes, the SPs and disk modules power down. The SPs and disk modules power up when you reinstall the SP fan pack.

Redundancy in Configurations

Mirrored storage-system write caching requires:
• Two SPs with equal memory of at least 128 Mbytes
• Two power supplies
• Two LCCs in the DPE and each DAE
• Disks in slots 0:0 through 0:8
• SPS (standby power supply) with a fully charged battery
DPE Rackmount
0123456789
About the Rackmount Disk-Array Processor Enclosure
1
Database
drives for
LIC
(0 thru 2)
The following table describes the DPE’s high-availability configurations.
Configuration SPs LCCs
Maximum - HA 2
2
2
2
These configurations provide more redundancy, and therefore a higher degree of system availability. The drive fan packs and SP fan pack provide redundant cooling for all the configurations listed above.
Vault
drives for
caching
(0 thru 8)
Power supplies
2
2
Disk modules SPSs
3 or more
9 or more
0 (no write caching)
2 (high-availability write caching)
Redundancy in Configurations
1-17
About the Rackmount Disk-Array Processor Enclosure
1

What Next?

Continue to the next chapter, which explains how to install a DPE.
1-18
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