DATA SHEET
256MB SDRAM S.O.DIMM
EBS25EC8APSA (32M words × ××× 72 bits, 1 bank)
Description
The EBS25EC8APSA is 32M words × 72 bits, 1 bank
Synchronous Dynamic RAM Small Outline Dual In-line
Memory Module (S.O.DIMM), mounted 9 pieces of
256M bits SDRAM (EDS2508APTA) sealed in TSOP
package. This module provides high density and large
quantities of memory in a small space without utilizing
the surface mounting technology. Decoupling
capacitors are mounted on power supply line for noise
reduction.
Features
• Fully compatible with 8 bytes S.O.DIMM: JEDEC
standard outline
• 144-pin socket type small outline dual in line memory
module (S.O.DIMM)
PCB height: 38.10mm (1.5inch )
Lead pitch: 0.80mm
• 3.3V power supply
• Clock frequency: 100MHz 133MHz (max.)
• LVTTL interface
• Data bus width: × 72 ECC
• Single pulsed /RAS
• 4 Banks can operates simultaneously and
independently
• Burst read/write operation and burst read/single write
operation capability
• Programmable burst length (BL): 1, 2, 4, 8, Full page
• 2 variations of burst sequence
Sequential
Interleave
• Programmable /CAS latency (CL): 2, 3
• Byte control by DQMB
• Refresh cycles: 8192 refresh cycles/64ms
• 2 variations of refresh
Auto refresh
Self refresh
Document No. E0227E20 (Ver. 2.0)
Date Published November 2001 (K) Japan
URL: http://www.elpida.com
C
Elpida Memory, Inc. 2001
Ordering Information
Part number
EBS25EC8APSA-7A
EBS25EC8APSA-75 *
EBS25EC8APSA-80
EBS25EC8APSA-7AL
EBS25EC8APSA-75L*
EBS25EC8APSA-80L
Note: 100MHz operation at /CAS latency = 2.
Clock frequency
MHz (max.)
133
133
100
133
133
100
/CAS latency Package
2, 3
3
2, 3
2, 3
3
2, 3
Pin Configurations
1pin 59pin 61pin 143pin
2pin 60pin 62pin 144pin
EBS25EC8APSA
Contact pad
144-pin S.O.DIMM Gold EDS2508APTA
Front Side
Mounted devices
Back Side
Front side Back side
Pin No. Pin name Pin No. Pin name Pin No. Pin name Pin No. Pin name
1 VSS 73 NC 2 VSS 74 CLK1
3 DQ0 75 VSS 4 DQ32 76 VSS
5 DQ1 77 CB4 6 DQ33 78 CB5
7 DQ2 79 CB6 8 DQ34 80 CB7
9 DQ3 81 VDD 10 DQ35 82 VDD
11 VDD 83 DQ16 12 VDD 84 DQ48
13 DQ4 85 DQ17 14 DQ36 86 DQ49
15 DQ5 87 DQ18 16 DQ37 88 DQ50
17 DQ6 89 DQ19 18 DQ38 90 DQ51
19 DQ7 91 VSS 20 DQ39 92 VSS
21 VSS 93 DQ20 22 VSS 94 DQ52
23 DQMB0 95 DQ21 24 DQMB4 96 DQ53
25 DQMB1 97 DQ22 26 DQMB5 98 DQ54
27 VDD 99 DQ23 28 VDD 100 DQ55
29 A0 101 VDD 30 A3 102 VDD
31 A1 103 A6 32 A4 104 A7
33 A2 105 A8 34 A5 106 BA0
35 VSS 107 VSS 36 VSS 108 VSS
37 DQ8 109 A9 38 DQ40 110 BA1
39 DQ9 111 A10 (AP) 40 DQ41 112 A11
41 DQ10 113 VDD 42 DQ42 114 VDD
Data Sheet E0227E20 (Ver. 2.0)
2
EBS25EC8APSA
Front side Back side
Pin No. Pin name Pin No. Pin name Pin No. Pin name Pin No. Pin name
43 DQ11 115 DQMB2 44 DQ43 116 DQMB6
45 VDD 117 DQMB3 46 VDD 118 DQMB7
47 DQ12 119 VSS 48 DQ44 120 VSS
49 DQ13 121 DQ24 50 DQ45 122 DQ56
51 DQ14 123 DQ25 52 DQ46 124 DQ57
53 DQ15 125 DQ26 54 DQ47 126 DQ58
55 VSS 127 DQ27 56 VSS 128 DQ59
57 CB0 129 VDD 58 CB1 130 VDD
59 CB2 131 DQ28 60 CB3 132 DQ60
61 CLK0 133 DQ29 62 CKE0 134 DQ61
63 VDD 135 DQ30 64 VDD 136 DQ62
65 /RAS 137 DQ31 66 /CAS 138 DQ63
67 /WE 139 VSS 68 NC 140 VSS
69 /CS0 141 SDA 70 A12 142 SCL
71 NC 143 VDD 72 NC 144 VDD
Pin Description
Pin name Function
Address input
A0 to A12
BA0, BA1 Bank select address
DQ0 to DQ63 Data input/output
CB0 to CB7 Check bit (Data input/output)
/CS0 Chip select input
/RAS Row enable (/RAS) input
/CAS Column enable (/CAS) input
/WE Write enable input
DQMB0 to DQMB7 Byte data mask
CLK0, CLK1 Clock input
CKE0 Clock enable input
SDA Data input/output for serial PD
SCL Clock input for serial PD
VDD Primary positive power supply
VSS Ground
NC No connection
Row address A0 to A12
Column address A0 to A9
Data Sheet E0227E20 (Ver. 2.0)
3
EBS25EC8APSA
Serial PD Matrix
Byte No. Function described Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
0
1 Total SPD memory size 0 0 0 0 1 0 0 0 08H 256 bytes
2 Memory type 0 0 0 0 0 1 0 0 04H SDRAM
3 Number of row addresses bits 0 0 0 0 1 1 0 1 0DH 13
4 Number of column addresses bits 0 0 0 0 1 0 1 0 0AH 10
5 Number of banks 0 0 0 0 0 0 0 1 01H 1
6 Module data width 0 1 0 0 1 0 0 0 48H 72 bits
7 Module data width (continued) 0 0 0 0 0 0 0 0 00H 0
8 Module interface signal levels 0 0 0 0 0 0 0 1 01H LVTTL
9
(-80/80L) 1 0 0 0 0 0 0 0 80H 8ns
10
(-80/80L) 0 1 1 0 0 0 0 0 60H 6ns
11 Module configuration type 0 0 0 0 0 0 1 0 02H ECC
12 Refresh rate/type 1 0 0 0 0 0 1 0 82H 7.8µs
13 SDRAM width
14 Error checking SDRAM width
15
16
17
18
19
20
21 SDRAM device attributes 0 0 0 0 0 0 0 0 00H
22 SDRAM device attributes: General 0 0 0 0 1 1 1 0 0EH
23
(-75/75L, -80/80L) 1 0 1 0 0 0 0 0 A0H 10ns
24
(-75/75L, -80/80L) 0 1 1 0 0 0 0 0 60H 6ns
2 5 t o 2 6 0 0 0 0 0 0 0 0 0 0 H
27
(-75/75L, -80/80L) 0 0 0 1 0 1 0 0 14H 20ns
Number of bytes used by module
manufacturer
SDRAM cycle time at CL = 3
(highest /CAS latency)
(-7A/7AL, -75/75L)
SDRAM access from Clock at CL = 3
(highest /CAS latency)
(-7A/7AL, -75/75L)
SDRAM device attributes:
minimum clock delay for back-toback random column addresses
SDRAM device attributes:
Burst lengths supported
SDRAM device attributes: number of
banks on SDRAM device
SDRAM device attributes:
/CAS latency
SDRAM device attributes:
/CS latency
SDRAM device attributes:
/WE latency
SDRAM cycle time at CL = 2
(2nd highest /CAS latency)
(-7A/7AL)
SDRAM access from Clock at CL = 2
(2nd highest /CAS latency)
(-7A/7AL)
Minimum row precharge time
(-7A/7AL)
1 0 0 0 0 0 0 0 80H 128 bytes
0 1 1 1 0 1 0 1 75H 7.5ns
0 1 0 1 0 1 0 0 54H 5.4ns
0 0 0 0 1 0 0 0 08H × 8
0 0 0 0 1 0 0 0 08H × 8
0 0 0 0 0 0 0 1 01H 1 CLK
1 0 0 0 1 1 1 1 8FH 1, 2, 4, 8, F
0 0 0 0 0 1 0 0 04H 4
0 0 0 0 0 1 1 0 06H 2, 3
0 0 0 0 0 0 0 1 01H 0
0 0 0 0 0 0 0 1 01H 0
0 1 1 1 0 1 0 1 75H 7.5ns
0 1 0 1 0 1 0 0 54H 5.4ns
0 0 0 0 1 1 1 1 0FH 15ns
Data Sheet E0227E20 (Ver. 2.0)
4
EBS25EC8APSA
Byte No. Function described Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
28
(-80/80L) 0 0 0 1 0 0 0 0 10H 16ns
29
(-75/75L, -80/80L) 0 0 0 1 0 1 0 0 14H 20ns
30
(-80/80L) 0 0 1 1 0 0 0 0 30H 48ns
31 Density of each bank on module 0 1 0 0 0 0 0 0 40H 256MB
32
(-80/80L) 0 0 1 0 0 0 0 0 20H 2ns
33
(-80/80L) 0 0 0 1 0 0 0 0 10H 1ns
34
(-80/80L) 0 0 1 0 0 0 0 0 20H 2ns
35
(-80/80L) 0 0 0 1 0 0 0 0 10H 1ns
36 to 61 Superset information 0 0 0 0 0 0 0 0 00H
62 SPD data revision code 0 0 0 1 0 0 1 0 12H 1.2
63
(-75/75L) 1 1 1 0 0 1 0 0 E4H
(-80/80L) 0 0 1 0 0 1 0 1 25H
64 Manufacturer’s JEDEC ID code 1 1 1 1 1 1 1 0 FEH Elpida Memory
65 to 71 Manufacturer’s JEDEC ID code 0 0 0 0 0 0 0 0 00H
72 Manufacturing location
73 to 90 Manufacturer’s part number
91 to 92 Revision code
93 to 94 Manufacturing date
9 5 t o 9 8 A s s e m b l y s e r i a l n u m b e r
99 to 125 Manufacturer specific data
126
127
Row active to row active min
(-7A/7AL, -75/75L)
/RAS to /CAS delay min
(-7A/7AL)
Minimum /RAS pulse width
(-7A/7AL, -75/75L)
Address and command signal input
setup time
(-7A/7AL, -75/75L)
Address and command signal input
hold time
(-7A/7AL, -75/75L)
Data signal input setup time
(-7A/7AL, -75/75L)
Data signal input hold time
(-7A/7AL, -75/75L)
Checksum for Bytes 0 to 62
(-7A/7AL)
Reserved (Intel specification
frequency)
Reserved (Intel specification /CAS#
latency support)
0 0 0 0 1 1 1 1 0FH 15ns
0 0 0 0 1 1 1 1 0FH 15ns
0 0 1 0 1 1 0 1 2DH 45ns
0 0 0 1 0 1 0 1 15H 1.5ns
0 0 0 0 1 0 0 0 08H 0.8ns
0 0 0 1 0 1 0 1 15H 1.5ns
0 0 0 0 1 0 0 0 08H 0.8ns
1 0 1 0 0 0 1 1 A3H
0 1 1 0 0 1 0 0 64H 100MHz
1 1 0 0 0 1 1 1 C7H
Data Sheet E0227E20 (Ver. 2.0)
5