Elhrom ELSP01 User Manual
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C
uct Name:EL
Pro
Mod
el No.: EL
EL
S-Module-01
P01
P01 R
Modul
User
anual
ELS
01 is a 2.4GH
to 2
bps. The high-
mod
le has been m
ELS
01 is Norway-i
Ame
ica, it's max tr
can
e increased b
E
ectrical
No
.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
SMD wireless
performance o
ss produced s
mported from
nsmitted powe
10dB. Also, it'
param
Pa
ameters name
R
chip
and LNA Ch
erating frequ
duction tech
Int
rface
wer supply
mmunication
M
asured dista
nsmitted po
R
te
Tu
rn-off current
E
ission curren
R
ceive current
mmunication
ission Len
ceive Lengt
SI supported
An
tenna
O
erating Tem
O
erating Humi
rage temper
module with fu
board antenna
moothly, and c
ordic. Equippe
is up to 7dBm
small size is c
ters
p
ncy 2
ology l
level 0
ce 1
er ≤
t 3
interface S
th
h
erature
ity
ture
ction for recei
is included in
n be used for
with 20dBm
(conform to F
nvenient for e
P
arameter
N
rf24l01P
FX2401
04~2478 M
ad-free, SMT
10x2.54mm
9~3.6V DC
7VCC~5V
0m+
0dBm
2
0K~2Mbps
0uA
mA
2
mA
PI
S
ingle Data Pa
1
32 Bytes
S
ingle Data Pa
1
32 Bytes
N
onsupport
3
0dBi PCB PI
A
ntenna
10℃～+40℃
5﹪～95﹪R
40℃～+125
ing and transm
odule, which i
arious applicat
ower amplificat
CID and CE ce
bedded devel
Note
Nordi
Rfaxi
z
SMT
Note:
perm
VCC i
Norm
witho
Cond
3 leve
nRF2
level
Max r
cket
3 leve
cket
3level
Supp
A
itting. It has a s
accurate at i
ons scenarios.
ion chip of RF
rtification) and
pment.
Module will b
nently, if the
dicates sup
l Mode(Sunn
t interference
cted Emiss
l adjustable(
L01P set to
te up to 10M
l FIFO
FIFO
rt simple pac
all size, and
pedance matc
The nRF24LO
2401 chip imp
he receiving s
damaged
oltage is ove
ly voltage
y day, circu
)
on Test
odulated via
ower down,
ps
et loss only
igh rate up
ing. This
chip in
rted from
nsitivity
r 3.6V
stance
irmware)
E low
22 Receive sensitivity -95dBm 1000kbps 0.1% BER
23 More details please refer to chip manual.
Interface specifications:
PCB Specification：
32x48.5x1.0mm
Pin Name Pin Direction Use
1 RF_SCK Input Module SPI Bus Clock
2 RF_CSN Input Module CS PIN
3 RF_CE Input Module control PIN
4 V_NRF Power supply should be between 1.9-3.6V
5 GND
6 GND
7 GND
Ground, connect to Power ground
referenced
Ground, connect to Power ground
referenced
Ground, connect to Power ground
referenced
8 N/A Not Connected
9 N/A Not Connected
10 N/A Not Connected
11 N/A Not Connected
12 N/A Not Connected
13 N/A Not Connected
14 N/A Not Connected
15 N/A Not Connected
16 RX_EN
LNA enable feet, high level effective
LNA
17 TX_EN PA enable feet, high level effective
PA
18 RF_IRQ Output
Module interrupt signal output, low level
effective
19 RF_MISO Output Module SPI data output PIN
20 RF_MOSI Input Module SPI data input PIN
*Please refer to Nordic authority《Nrf24l01P Datasheet》for PIN definition of module,
software driver and communication protocol.
Notice
No Category Notice
High frequency analog device
1 Static
Avoid touching components on module if possible, since the
high frequency analog device features electrostatic susceptibility
2 Soldering
Electric soldering iron must be well connected to ground when
soldering
Power supply quality influence on module performance, please
3 Power supply
insure the power supply will not appear big ripple to avoid dither
in power supply.
Module ground apply single point grounding. It's recommended
4 Ground
to use ohm inductance or 10mH inductance and set it apart from
reference ground of other circuit in other part.
Mounting structure of module antenna influence module
5
Antenna
performance. Please insure little noise interference around
antenna. Note: Antenna must not mount in metallic shell,
otherwise the transmission distance be weakened greatly.
If there are different frequency modules inside one product, the
6 Interference
frequency should be well programmed to reduce the influence of
harmonic interference and intermediation interference
If there is oscillator close to the PCB in which module mount,
7 Oscillator
please increase the distance between oscillator and PCB if
possible.
Typical Circuit
MCU
Note:
IRQ is a Interrupt Pin, which can be used to activate SCM to achieve quick
1.
response.IRQ could be unconnected to obtain interruption status by SPI(It' not
recommended because of the low efficiency. And it will influence Power
Consumption.)
2. CE can be connect to high voltage level for a long term， in this way write register must be
set to POWER DOWN mode first.
3. Truth-value table for relationship between TX_EN and RX_EN as shown:
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